Apparatus and methods for reducing substrate cool down time

Patent metadata

Field	Value
Publication number	US-12534823-B2
Application number	US-202217870009-A
Country	US
Kind code	B2
Filing date	Jul 21, 2022
Priority date	Nov 19, 2021
Publication date	Jan 27, 2026
Grant date	Jan 27, 2026

Abstract

A method and apparatus for reducing cool-down times within a cool-down chamber are described herein. The method and apparatus include a process chamber, a transfer chamber, a dual-handled transfer robot within the transfer chamber, and a cool-down chamber. The dual-handled transfer robot it utilized to transfer a substrate between the process chamber and the cool-down chamber. The amount of time the substrate is disposed on the dual-handled transfer robot before being moved into the cool-down chamber is multiplied by a correction factor and subtracted from an original cool down time to achieve an adjusted cool down time. The adjusted cool down time is determined separately for each substrate being cooled within the cool-down chamber.

First claim

What is claimed is:

1 . A method of processing a substrate, suitable for use in semiconductor manufacturing, comprising:
removing a substrate from a processing chamber using a transfer robot with two or more arms; moving the substrate into a transfer chamber; moving the substrate into a cool-down chamber; determining a wait time of the substrate within the transfer chamber; determining a cool down factor based on the wait time; determining an adjusted cool down time by adjusting an original cool down time based on the cool down factor; and cooling the substrate in the cool-down chamber using the adjusted cool down time.

2 . The method of claim 1 , wherein the wait time is multiplied by a cooling variable to obtain the cool down factor.

3 . The method of claim 2 , wherein the cool down factor is subtracted from the original cool down time to obtain the adjusted cool down time.

4 . The method of claim 2 , wherein the cooling variable is 0.5 to 1.0.

5 . The method of claim 1 , wherein the wait time is an amount of time the substrate is held by the transfer robot during removing of the substrate from the processing chamber, moving the substrate into the transfer chamber, and moving the substrate into the cool-down chamber.

6 . The method of claim 1 , wherein the original cool down time is a pre-determined constant value.

7 . The method of claim 6 , wherein determined the original cool down time is 60 seconds to 80 seconds.

8 . A method of processing a substrate, suitable for use in semiconductor manufacturing, comprising:
(a) removing a first substrate from a processing chamber using a first arm of a transfer robot; (b) moving the first substrate into a transfer chamber; (c) moving a second substrate on a second arm of the transfer robot into the processing chamber; (d) moving the first substrate into a cool-down chamber; (e) determining a wait time of the first substrate on the first arm within the transfer chamber; (f) determining a cool down factor based on the wait time; (g) determining an adjusted cool down time by adjusting an original cool down time based on the cool down factor; and (h) cooling the first substrate in the cool-down chamber using the adjusted cool down time.

9 . The method of claim 8 , wherein (a) is performed before (b), and (b) is performed before (c).

10 . The method of claim 8 , wherein determining the wait time is performed using historical processing data or process simulations of the wait time within the transfer chamber.

11 . The method of claim 8 , wherein the wait time is determined by a controller calculating a wait time of the first substrate within the transfer chamber before being positioned into the cool-down chamber.

12 . The method of claim 8 , wherein the cool down factor is subtracted from the original cool down time to obtain the adjusted cool down time.

13 . The method of claim 8 , wherein the processing chamber is a deposition chamber.

14 . A processing system, suitable for use during semiconductor processing, comprising:
a transfer chamber comprising a transfer robot having a first arm and a second arm; a plurality of processing chambers coupled to the transfer chamber; one or more cool-down chambers; and a controller storing instructions to enable process operations of:
removing a substrate from one of the plurality of processing chambers using a first arm of the transfer robot;
moving the substrate into the transfer chamber;
moving the substrate into the one or more cool-down chambers;
determining a wait time of the substrate within the transfer chamber;
determining a cool down factor based on the wait time;
determining an adjusted cool down time by adjusting an original cool down time based on the cool down factor; and
cooling the substrate in the one or more cool-down chambers using the adjusted cool down time.

15 . The processing system of claim 14 , wherein at least one of the processing chambers is a deposition chamber.

16 . The processing system of claim 14 , wherein the first arm and the second arm are coupled to an actuator and configured to move simultaneously.

17 . The processing system of claim 14 , wherein the transfer chamber is separated from each of the plurality of processing chambers and the one or more cool-down chambers by one or more valves.

18 . The processing system of claim 14 , wherein the transfer chamber is configured to be held at a temperature of less than 50° C.

19 . The processing system of claim 14 , wherein the wait time is multiplied by a cooling variable of 0.5 to 1.0 to obtain the cool down factor and the cool down factor is subtracted from the original cool down time to obtain the adjusted cool down time.

20 . The processing system of claim 14 , wherein the substrate comprises a first substrate, and wherein a second substrate is disposed on the second arm of the transfer robot while the first substrate is being removed from the processing chamber.

Assignees

• Applied Materials Inc

Inventors

• Ackermann Thomas
• Höpfner Christian

Classifications

• H01L21/68707

  Electricity · mapped topic

• H01L21/67742

  Electricity · mapped topic

• C23C16/52

  Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title

• C23C16/463

  Cooling of the substrate · CPC title

• C30B25/16 Primary

  Controlling or regulating (controlling or regulating in general G05) · CPC title