Movable device and wound capacitor package structure thereof

Patent metadata

Field	Value
Publication number	US-12531190-B2
Application number	US-202418444743-A
Country	US
Kind code	B2
Filing date	Feb 18, 2024
Priority date	Jul 25, 2023
Publication date	Jan 20, 2026
Grant date	Jan 20, 2026

Abstract

A movable device and a wound capacitor package structure thereof are provided. A first gap defined between a first exposed portion of a first conductive pin and an inner surface of a first bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, and a first exposed height defined from a bottom side of the first exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm. A second gap defined between a second exposed portion of a second conductive pin and an inner surface of a second bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, and a second exposed height defined from the bottom side of the second exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm.

First claim

What is claimed is:

1 . A wound capacitor package structure, comprising:
a wound assembly including a positive wound conductive foil, a negative wound conductive foil and two wound insulators; a conductive assembly including a first conductive pin electrically contacting the positive wound conductive foil and a second conductive pin electrically contacting the negative wound conductive foil; a package assembly configured to enclose the wound assembly; and a bottom seat plate disposed on a bottom side of the package assembly for carrying the package assembly; wherein, one of the two wound insulators is disposed between the positive wound conductive foil and the negative wound conductive foil, and one of the positive wound conductive foil and the negative wound conductive foil is disposed between the two wound insulators; wherein the first conductive pin includes a first embedded portion accommodated inside the package assembly and a first exposed portion exposed outside the package assembly, the second conductive pin includes a second embedded portion accommodated inside the package assembly and a second exposed portion exposed outside the package assembly, and both the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin pass through the bottom seat plate and are partially exposed from a bottom side of the bottom seat plate; wherein the bottom seat plate has a first through opening and a first bottom guide channel communicated with the first through opening, and the first exposed portion of the first conductive pin passes through the first through opening and extends along the first bottom guide channel; wherein the bottom seat plate has a second through opening and a second bottom guide channel communicated with the second through opening, and the second exposed portion of the second conductive pin passes through the second through opening and extends along the second bottom guide channel; wherein a first gap defined between the first exposed portion of the first conductive pin and an inner surface of the first bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, a bottom side of the first exposed portion of the first conductive pin is exposed from the first bottom guide channel of the bottom seat plate, and a first exposed height defined from the bottom side of the first exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm; wherein a second gap defined between the second exposed portion of the second conductive pin and an inner surface of the second bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, a bottom side of the second exposed portion of the second conductive pin is exposed from the second bottom guide channel of the bottom seat plate, and a second exposed height defined from the bottom side of the second exposed portion to the bottom side of the bottom seat plate ranges from 0.01 mm to 0.3 mm; wherein, when the wound capacitor package structure is electrically connected to a circuit substrate through the first conductive pin and the second conductive pin respectively contacting a first conductive material and a second conductive material, the first exposed portion of the first conductive pin is configured to guide a portion of the first conductive material into the first gap defined between the first exposed portion of the first conductive pin and the inner surface of the first bottom guide channel of the bottom seat plate through capillary action, and the second exposed portion of the second conductive pin is configured to guide a portion of the second conductive material into the second gap defined between the second exposed portion of the second conductive pin and the inner surface of the second bottom guide channel of the bottom seat plate through capillary action.

2 . The wound capacitor package structure according to claim 1 ,
wherein the package assembly includes a package casing configured to accommodate the wound assembly and a bottom sealing structure disposed inside the package casing and cooperating with the package casing, and the wound assembly is completely enclosed by the package casing and the bottom sealing structure; wherein the bottom seat plate has a plurality of first inner surfaces located in the first bottom guide channel, and the first inner surfaces include two first side inner surfaces corresponding to each other and a first top inner surface connected between the two first side inner surfaces; wherein, a first horizontal distance defined between the first exposed portion of the first conductive pin and one of the first side inner surfaces ranges from 0.01 mm to 0.2 mm, and a first vertical distance defined between the first exposed portion of the first conductive pin and the first top inner surface ranges from 0.01 mm to 0.2 mm; wherein, before the wound capacitor package structure is electrically connected to the circuit substrate, a ratio of a first thickness of the first conductive material disposed on the circuit substrate to a first exposed height defined from the bottom side of the first exposed portion to the bottom side of the bottom seat plate is 0.1˜0.2:0.01˜0.3; wherein the bottom seat plate has at least two convex support portions disposed on the bottom side thereof and corresponding to each other, the first bottom guide channel and the second bottom guide channel are located between the at least two convex support portions, and a height of each of the convex support portion is equal to the first exposed height or the second exposed height.

3 . The wound capacitor package structure according to claim 1 ,
wherein the package assembly includes a package casing configured to accommodate the wound assembly and a bottom sealing structure disposed inside the package casing and cooperating with the package casing, and the wound assembly is completely enclosed by the package casing and the bottom sealing structure; wherein the bottom seat plate has a plurality of second inner surfaces located in the second bottom guide channel, and the second inner surfaces include two second side inner surfaces corresponding to each other and a second top inner surface connected between the two second side inner surfaces; wherein, a second horizontal distance defined between the second exposed portion of the second conductive pin and one of the second side inner surfaces ranges from 0.01 mm to 0.2 mm, and a second vertical distance defined between the second exposed portion of the second conductive pin and the second top inner surface ranges from 0.01 mm to 0.2 mm; wherein, before the wound capacitor package structure is electrically connected to the circuit substrate, a ratio of a second thickness of the second conductive material disposed on the circuit substrate to a second exposed height defined from the bottom side of the second exposed portion to the bottom side of the bottom seat plate is 0.1˜0.2:0.01˜0.3; wherein the bottom seat plate has at least two convex support portions disposed on the bottom side thereof and corresponding to each other, the first bottom guide channel and the second bottom guide channel are located between the at least two convex support portions, and a height of each of the convex support portion is equal to the first exposed height or the second exposed height.

4 . A wound capacitor package structure, comprising:
a wound assembly; a conductive assembly including a first conductive pin electrically contacting the wound assembly and a second conductive pin electrically contacting the wound assembly; a package assembly configured to enclose the wound assembly; and a bottom seat plate disposed on a bottom side of the package assembly for carrying the package assembly; wherein both a first exposed portion of the first

Assignees

• Apaq Technology Co Ltd

Inventors

• Su Chung-Jui
• Liang Ming-Tsung

Classifications

• H01G9/012 Primary

  specially adapted for solid capacitors · CPC title

• H01G9/048

  characterised by their structure (H01G11/22 takes precedence) · CPC title

• H01G9/08

  Housing; Encapsulation · CPC title

• H01G9/15

  Solid electrolytic capacitors (H01G11/00 takes precedence) · CPC title

• H01G2/106

  Fixing the capacitor in a housing · CPC title