AC-coupling structure in electrical cabled interconnect

Patent metadata

Field	Value
Publication number	US-12525375-B2
Application number	US-202318491907-A
Country	US
Kind code	B2
Filing date	Oct 23, 2023
Priority date	Oct 12, 2020
Publication date	Jan 13, 2026
Grant date	Jan 13, 2026

Abstract

A signal cable for an AC-coupled link, may include: a signal conductor; a dielectric surrounding the signal conductor; and a ground sheath having a conductive layer disposed at least partially around the conductor such that the dielectric is positioned between the ground sheath and the signal conductor, wherein the conductive layer comprises a first portion extending in a first direction along the cable and a second portion extending in a second direction, opposite the first direction, along the cable and further wherein the first and second portions of the conductive layer are separated from each other by a gap, the gap being dimensioned to provide a determined amount of capacitance in series in the ground sheath. The gap may form a complete separation between the first and second portions of the conductive layer.

First claim

What is claimed is:

1 . A signal cable comprising: a conductor to carry electrical signals; a cylindrical ground shield layer around the conductor to provide a return path for the electrical signals, the cylindrical ground shield layer comprising a first continuous portion and a second continuous portion separated by a gap to provide a predetermined amount of capacitance, the gap around a circumference of the cylindrical ground shield layer with a geometry adjusted to provide a capacitance between 10 pF and 0.01 uF, and the gap filled with carbon loaded ceramics and one or more of glass, mica, and oxide; and a dielectric layer positioned between the conductor and the ground shield layer.

2 . The signal cable of claim 1 , wherein the carbon loaded ceramics is deposited using a sputtering method.

3 . The signal cable of claim 1 , further comprising one or more additional conductors surrounded by the ground shield layer and the dielectric layer to carry the electrical signals.

4 . The signal cable of claim 1 , wherein the gap is formed by a first set of conductive fingers belonging to the first continuous portion interleaved with a second set of conductive fingers belonging to the second continuous portion.

5 . The signal cable of claim 4 , wherein a length of a respective conductive finger in the first or second set of conductive fingers is between 8 and 24 mils, wherein a width of the respective conductive finger is between 1 and 8 mils, and wherein a spacing between adjacent conductive fingers in the first or second set of conductive fingers is between 1 and 8 mils.

6 . The signal cable of claim 4 , wherein the first and second sets of conductive fingers have a tapered width.

7 . The signal cable of claim 6 , wherein a respective conductive finger in the first or second set of conductive fingers is shaped as a trapezoid, a triangle, or a sinusoidal wave.

8 . The signal cable of claim 1 , wherein the signal cable is a coaxial cable, a twinaxial cable, a triaxial cable, or a quadriaxial cable.

9 . The signal cable of claim 1 , wherein the gap is to block a direct current (DC) component of the electrical signals.

10 . The signal cable of claim 9 , wherein a high-pass cut-off frequency of the gap is between 1 MHz and 1 GHz.

11 . The signal cable of claim 1 , wherein the gap is formed by chemical etching or laser etching.

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Bois Karl J
• Stewart James David
• Kopp David P
• Chobanyan Elene

Classifications

• H01B13/0167

  After-treatment · CPC title

• H01R12/722

  coupling devices mounted on the edge of the printed circuits · CPC title

• H01P3/06

  Coaxial lines · CPC title

• H01R12/75

  connecting to cables except for flat or ribbon cables · CPC title

• H01B11/1856

  Discontinuous insulation · CPC title