Qubit assembly preparation method, qubit assembly, quantum chip, and device

Patent metadata

Field	Value
Publication number	US-12524697-B2
Application number	US-202218078228-A
Country	US
Kind code	B2
Filing date	Dec 9, 2022
Priority date	Sep 26, 2021
Publication date	Jan 13, 2026
Grant date	Jan 13, 2026

Abstract

A qubit assembly preparation method includes preparing a waveguide film in two or more regions on a substrate spaced apart from each other. The method further includes preparing, by using a Dolan bridge photoresist structure, a qubit structure not connected to the waveguide film. The qubit structure includes a three-layer structure. The three-layer structure includes a first superconducting portion and a second superconducting portion intersecting with each other in a coverage region on the substrate. The method further includes removing the insulation layer on a first target region and a second target region of an upper surface of the superconducting portion. The method further includes evaporating a connection layer on the waveguide film, the qubit structure, and the substrate between the waveguide film and the qubit structure.

First claim

What is claimed is:

1 . A qubit assembly preparation method comprising:
preparing a waveguide film in at least two regions on a substrate spaced apart from each other, a side surface of the waveguide film being an oblique surface extending outward from a top portion; preparing, by using a Dolan bridge photoresist structure, a qubit structure not connected to the waveguide film, the qubit structure comprising a three-layer structure, the three-layer structure comprising a first superconducting portion and a second superconducting portion intersecting with each other in a coverage region on the substrate, outer surfaces of the first superconducting portion and the second superconducting portion being covered by an insulation layer, and the outer surfaces being surfaces in the first superconducting portion and the second superconducting portion that are not in contact with the substrate; removing the insulation layer on a first target region of an upper surface of the first superconducting portion and the insulation layer on a second target region of an upper surface of the second superconducting portion, the upper surface being a surface in the outer surfaces of the first superconducting portion and the second superconducting portion that is on another side opposite to a lower surface, and the lower surface being a surface in the outer surfaces of the first superconducting portion and the second superconducting portion that faces the substrate; and evaporating a connection layer on the waveguide film, the qubit structure, and the substrate between the waveguide film and the qubit structure, to obtain a qubit assembly, the connection layer being configured to communicate the first superconducting portion and the second superconducting portion with the waveguide films.

2 . The method according to claim 1 , wherein the preparing the waveguide film comprises:
evaporating a first superconducting material on the substrate; applying first photoresist onto the first superconducting material; removing the first photoresist in an etching region through photolithography development; performing wet etching on the first superconducting material in the etching region; and performing cleaning to remove the first photoresist, to obtain the waveguide films in at least two regions.

3 . The method according to claim 1 , wherein the preparing the qubit structure comprises:
preparing a Dolan bridge photoresist structure not comprising the qubit structure on the waveguide film and the substrate; and preparing the qubit structure through double-oblique angle evaporation based on the Dolan bridge photoresist structure.

4 . The method according to claim 3 , wherein the preparing the Dolan bridge photoresist structure comprises:
applying second photoresist onto the waveguide film and the substrate; applying third photoresist onto the second photoresist.

5 . The method according to claim 3 , wherein the preparing the Dolan bridge photoresist structure comprises:
performing exposure development and fixation processing on the second photoresist and the third photoresist, to obtain the Dolan bridge photoresist structure.

6 . The method according to claim 3 , wherein the preparing the qubit structure comprises:
vertically evaporating a second superconducting material based on the Dolan bridge photoresist structure, to obtain the first superconducting portion; preparing the insulation layer on the surface of the first superconducting portion.

7 . The method according to claim 3 , wherein the preparing the qubit structure comprises:
obliquely evaporating the second superconducting material based on the Dolan bridge photoresist structure; and performing cleaning to remove the Dolan bridge photoresist structure and the second superconducting material on the Dolan bridge photoresist structure, to obtain the qubit structure.

8 . The method according to claim 5 , wherein an oblique angle of the oblique evaporation ranges from 20° to 70°.

9 . The method according to claim 1 , wherein the removing the insulation layer comprises:
applying fourth photoresist onto the waveguide film, the qubit structure, and the substrate between the waveguide film and the qubit structure; processing the fourth photoresist in a photolithography development and fixation manner, to expose the first target region and the second target region.

10 . The method according to claim 1 , wherein the removing the insulation layer comprises:
performing etching processing on the first target region and the second target region, to remove the insulation layer on the first target region and the insulation layer on the second target region.

11 . A qubit assembly comprising:
a substrate; waveguide films in at least two regions on the substrate spaced apart from each other and having at least one side surface, the side surface of at least one waveguide film being an oblique surface extending outward from a top portion; a qubit structure comprising a three-layer structure, the three-layer structure comprises a first superconducting portion and a second superconducting portion intersecting with each other in a coverage region on the substrate, and outer surfaces of the first superconducting portion and the second superconducting portion are covered by an insulation layer, the outer surfaces being surfaces in the first superconducting portion and the second superconducting portion that are not in contact with the substrate, an upper surface of the first superconducting portion having a first target region not covered by the insulation layer, and an upper surface of the second superconducting portion having a second target region not covered by the insulation layer, the upper surface being a surface in the outer surfaces of the first superconducting portion and the second superconducting portion that is on another side opposite to a lower surface, and the lower surface being a surface in the outer surfaces of the first superconducting portion and the second superconducting portion that faces the substrate; and a connection layer covering the waveguide film, the qubit structure, and the substrate between the waveguide film and the qubit structure, the connection layer being configured to communicate the first superconducting portion and the second superconducting portion with the waveguide films.

12 . The qubit assembly according to claim 11 , wherein a thickness of the waveguide film is greater than that of the qubit structure.

13 . The qubit assembly according to claim 11 , wherein an oblique angle of the side surface of the waveguide film ranges from 20° to 70°.

14 . A production line device comprising:
an etcher; a mask aligner; and an evaporator; wherein the etcher, the mask aligner, and the evaporator are configured to perform a qubit assembly preparation method comprising:
preparing a waveguide film in at least two regions on a substrate spaced apart from each other, a side surface of the waveguide film being an oblique surface extending outward from a top portion;
preparing, by using a Dolan bridge photoresist structure, a qubit structure not connected to the waveguide film, the qubit structure comprising a three-layer structure, the three-layer structure comprising a first superconducting portion and a second superconducting portion intersecting with each other in a coverage region on the substrate, outer surfaces of the first superconducting portion and the second superconducting portion being covered by an insulation layer, and the outer surfaces being surfaces in the first superconducting portion and the second superconducting portion that ar

Assignees

• Tencent Tech Shenzhen Company Ltd

Inventors

• Zhang Wenlong
• Dai Maochun

Classifications

• H10N69/00

  Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00 · CPC title

• H10N60/12

  Josephson-effect devices · CPC title

• G06N10/40 Primary

  Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control · CPC title

• H10N60/0912 Primary

  of Josephson-effect devices · CPC title