Bond assembly jig preparation methods using thermosetting bismaleimide resins

Patent metadata

Field	Value
Publication number	US-12521946-B2
Application number	US-202318530646-A
Country	US
Kind code	B2
Filing date	Dec 6, 2023
Priority date	Dec 13, 2022
Publication date	Jan 13, 2026
Grant date	Jan 13, 2026

Abstract

A method for preparing a bond assembly jig (BAJ) includes forming a cutter relief groove in the BAJ, filling the cutter relief groove of the BAJ with a material, and curing the material after said filling.

First claim

What is claimed is:

1 . A method for preparing a bond assembly jig (BAJ), comprising:
forming a cutter relief groove in the BAJ; filling the cutter relief groove of the BAJ with a material; curing the material after said filling; and laying up a part on the BAJ after said curing.

2 . The method of claim 1 , wherein the material comprises a bismaleimide (BMI) resin.

3 . The method of claim 1 , wherein the material does not comprise Epocast material.

4 . The method of claim 1 , wherein the cutter relief groove extends from an exposed surface of the BAJ into a main body of the BAJ.

5 . The method of claim 1 , further comprising cleaning the cutter relief groove with a solvent before said filling.

6 . The method of claim 1 , wherein the material comprises a plurality of overlaid strips.

7 . The method of claim 1 , wherein said filling comprises overfilling the cutter relief groove with the material.

8 . The method of claim 1 , further comprising, before said curing, covering an exposed surface of the material with a release film and a caul sheet.

9 . The method of claim 8 , further comprising sealing outer perimeter edges of the caul sheet with a tape.

10 . The method of claim 1 , further comprising forming a groove in the part and the material, wherein the portion of the groove formed in the material provides a sub-groove.

11 . The method of claim 10 , further comprising removing the part from the BAJ after said forming the groove.

12 . The method of claim 11 , further comprising depositing preg material into the sub-groove after said removing.

13 . A method for preparing a bond assembly jig (BAJ), comprising:
forming a cutter relief groove in the BAJ, wherein the cutter relief groove extends from an exposed surface of the BAJ into a main body of the BAJ; cleaning the cutter relief groove with a solvent; after said cleaning, filling the cutter relief groove of the BAJ with a material, wherein the material comprises a bismaleimide (BMI) resin; covering an exposed surface of the material with a release film and a caul sheet; curing the material after said filling after said covering; and laying up a part on the BAJ after said curing.

14 . The method of claim 13 , wherein the material does not include Epocast material.

15 . The method of claim 13 , wherein the material comprises a plurality of overlaid strips.

16 . The method of claim 13 , wherein said filling comprises overfilling the cutter relief groove with the material.

17 . The method of claim 13 , further comprising sealing outer perimeter edges of the caul sheet with a tape.

18 . The method of claim 13 , further comprising:
forming a groove in the part and the material, wherein the portion of the groove formed in the material provides a sub-groove; removing the part from the BAJ after said forming the groove; and depositing preg material into the sub-groove after said removing.

19 . A method for preparing a bond assembly jig (BAJ), comprising:
forming a cutter relief groove in the BAJ, wherein the cutter relief groove extends from an exposed surface of the BAJ into a main body of the BAJ; cleaning the cutter relief groove with a solvent; after said cleaning, over-filling the cutter relief groove of the BAJ with a material, wherein the material comprises a plurality of overlaid strips formed of bismaleimide (BMI) resin; covering an exposed surface of the material with a release film and a caul sheet; sealing outer perimeter edges of the caul sheet with a tape; curing the material after said filling after said covering; laying up a part on the BAJ after said curing; forming a groove in the part and the material, wherein the portion of the groove formed in the material provides a sub-groove; removing the part from the BAJ after said forming the groove; and depositing preg material into the sub-groove after said removing.

20 . A method for preparing a bond assembly jig (BAJ), comprising:
forming a cutter relief groove in the BAJ; filling the cutter relief groove of the BAJ with a material; covering an exposed surface of the material with a release film and a caul sheet; and curing the material after said filling and said covering.

Assignees

• Boeing Co

Inventors

• Bible George E
• Winzek Peter M

Classifications

• B29C2793/0054

  partially cutting through the material · CPC title

• B29C2793/0081

  before shaping · CPC title

• B29C70/545 Primary

  Perforating, cutting or machining during or after moulding · CPC title