Conductive composition, conductive paste, electric circuit, flexible electric circuit body and method of producing molded body

Patent metadata

Field	Value
Publication number	US-12518889-B2
Application number	US-202218272229-A
Country	US
Kind code	B2
Filing date	Jan 7, 2022
Priority date	Jan 14, 2021
Publication date	Jan 6, 2026
Grant date	Jan 6, 2026

Abstract

A conductive composition includes conductive particles, a thermoplastic resin, and a solvent, wherein a glass transition temperature of the thermoplastic resin is 140 to 200 degrees C.

First claim

The invention claimed is:

1 . A conductive composition comprising:
conductive particles; a thermoplastic resin; and a solvent, wherein a glass transition temperature of the thermoplastic resin is 140 to 200 degrees C., and wherein the thermoplastic resin comprises poly (4, 4′-cyclohexylidenediphenyl) carbonate.

2 . The conductive composition according to claim 1 , wherein a boiling point of the solvent is 200 degrees C. or more.

3 . The conductive composition according to claim 1 , wherein the solvent comprises at least one selected from the group consisting of isophorone, 3-methoxy N, N-dimethylpropanamide, benzyl alcohol, butyl carbitol, ethyl carbitol acetate and tetraglyme.

4 . The conductive composition according to claim 1 , wherein a weight ratio of the conductive particles to the thermoplastic resin (weight of the conductive particles:weight of the thermoplastic resin) is in a range of 99:1 to 70:30.

5 . The conductive composition according to claim 1 , wherein the conductive particles are silver particles.

6 . A conductive paste comprising the conductive composition according to claim 1 .

7 . The conductive paste according to claim 6 , wherein the conductive paste is for forming a flexible electric circuit body.

8 . The conductive paste according to claim 6 , wherein the conductive paste is for In-Mold Electronics.

9 . An electric circuit comprising a cured product of the conductive paste according to claim 6 .

10 . A flexible electric circuit body comprising:
a flexible base material; and the electric circuit according to claim 9 arranged on the flexible base material.

11 . A method of producing a molded body comprising:
forming an electric circuit on a surface of a flexible base material using the conductive paste according to claim 6 ; and forming the molded body by molding the flexible base material, on which the electric circuit was formed, and a resin for molding.

12 . The conductive composition according to claim 1 , wherein the solvent comprises at least one selected from the group consisting of 3-methoxy N, N-dimethylpropanamide, butyl carbitol, ethyl carbitol acetate and tetraglyme.

Assignees

• Namics Corp

Inventors

• Ogiwara Toshiaki
• Fujino Taku

Classifications

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K1/095

  for polymer thick films, i.e. having a permanent organic polymeric binder · CPC title

• C09D5/24

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• H01B1/12

  organic substances {(organic macromolecular compounds or compositions C08)} · CPC title