Temperature discretization digital device

Patent metadata

Field	Value
Publication number	US-12517477-B2
Application number	US-202118009305-A
Country	US
Kind code	B2
Filing date	Jun 11, 2021
Priority date	Jun 12, 2020
Publication date	Jan 6, 2026
Grant date	Jan 6, 2026

Abstract

The objective of the present invention is to provide a temperature discretization digital device capable of achieving thermalBIT, which controls the characteristic of bifurcation of a temperature solution of a thermoelectric heat equation by adjusting an internal calorific value control parameter such as a current/voltage/thermoelectric property coefficient, so as to cause numbers 0 and 1 to correspond to the numerical range of a temperature solution.To this end, the present invention comprises a thermalBIT solution realizing material having a multi-temperature solution in a medium-sized current or voltage area, controls the characteristic of bifurcation of a temperature solution of a thermoelectric heat equation by adjusting an internal calorific value control parameter; and causes numbers 0 and 1 to correspond to the numerical range of a multi-temperature solution so that thermalBIT is realized.

First claim

The invention claimed is:

1 . A temperature discretization digital device, the device being configured to, for a thermalBIT solution realizing material with multi-temperature solutions in a given range of current or voltage:
acquire the multi-temperature solutions by controlling a characteristic of bifurcation of a temperature solution determined through a thermoelectric heat equation by adjusting an internal calorific value control parameter; and implement the thermalBIT by causing numbers 0, 1, 2, . . . , N to correspond to a numerical range of the acquired multi-temperature solutions, wherein the thermoelectric heat equation is as follows:
0=∇( k·∇T )+[− T∇α·J+ρJ 2 ]

where, T is a temperature solution of the thermoelectric heat equation as a temperature distribution function for space; k is a thermal conductivity; α is a Seebeck coefficient; and ρ is an electrical resistivity, and wherein J is an electrical current density and, when a voltage V is applied across the thermalBIT solution realizing material along with an external resistance R ext , is expressed as follows:

J
=

V

∫

ρ
⁢
dx

+

R

e
⁢
x
⁢
t

/
A

where, R ext is an external resistance, and A is a cross-sectional of the thermalBIT element.

2 . The temperature discretization digital device of claim 1 , wherein the thermalBIT solution realizing material is a thermoelectric material.

3 . The temperature discretization digital device of claim 1 , wherein the thermalBIT solution realizing material is such that the thermoelectric heat equation has the multi-temperature solutions with non-local and non-linear properties, due to characteristics of thermoelectric properties changing depending on temperature or location.

4 . The temperature discretization digital device of claim 1 , wherein the internal calorific value control parameter is an electric current density J.

5 . The temperature discretization digital device of claim 1 , wherein the internal calorific value control parameter is a voltage V.

6 . The temperature discretization digital device of claim 1 , wherein the internal calorific value control parameter is an external resistance R ext .

7 . The temperature discretization digital device of claim 1 , wherein the thermalBIT solution realizing material is made of PbTe, BaTiO 3 , GeTe, Ag 2 Te, Cu 2 Se, SnSe, or an alloy thereof, and has an electrical resistivity changing rapidly depending on temperature.

8 . The temperature discretization digital device of claim 1 , wherein the thermalBIT solution realizing material is divided into a P-type thermalBIT material in which a Seebeck coefficient α is α>0; and an N-type thermalBIT material in which the Seebeck coefficient α of α<0.

9 . The temperature discretization digital device of claim 1 , further comprising:
electrodes coupled to both ends of the thermalBIT solution realizing material; and a temperature solution acquisition terminal contacting the thermalBIT solution realizing material to acquire thermalBIT temperature information, wherein an amount of change in the control parameter is transmitted through the electrode.

10 . The temperature discretization digital device of claim 9 , wherein the thermalBIT solution realizing material is formed in a structure of m (m=natural number) laminating layers, and the laminating layers have different Seebeck coefficients from each other.

11 . The temperature discretization digital device of claim 10 , wherein the thermalBIT solution realizing material is sequentially laminated with
a P-type thermalBIT material in contact with the first electrode; and an N-type thermalBIT material in contact with the second electrode.

12 . The temperature discretization digital device of any one of claims 9 to 11 , wherein the temperature solution acquisition terminal contacts a center of the thermalBIT solution realizing material to acquire the thermalBIT temperature information.

13 . The temperature discretization digital device of claim 12 , wherein the temperature solution acquisition terminal further comprises an information layer disposed in the thermalBIT solution realizing material, and contacts the information layer to acquire the thermalBIT temperature information.

14 . The temperature discretization digital device of any one of claims 9 to 11 , wherein the temperature solution acquisition terminal contacts the first electrode or the second electrode to acquire the thermalBIT temperature information.

15 . The temperature discretization digital device of claim 12 , wherein the temperature solution acquisition terminal further comprises an information layer connected to an end of the thermalBIT solution realizing material, and contacts the information layer to acquire the thermalBIT temperature information.

16 . The temperature discretization digital device of claim 9 , wherein the first electrode or the second electrode is coupled to a thermal insulating or cooling plate.

17 . The temperature discretization digital device of claim 13 or claim 15 , wherein the information layer has a higher resistivity than that of thermalBIT solution realizing material.

18 . The temperature discretization digital device of claim 13 or claim 15 , wherein the information layer has a lower thermal conductivity than that of the thermalBIT solution realizing material.

Assignees

• Keri Korea Electrotechnology Res Inst

Inventors

• Ryu Byungki
• Chung Jaywan
• Park Su-Dong

Classifications

• G01K7/00

  Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat (giving results other than momentary value of temperature G01K3/00) {; Power supply therefor, e.g. using thermoelectric elements} · CPC title

• H10N10/17

  characterised by the structure or configuration of the cell or thermocouple forming the device · CPC title

• H10N10/852

  comprising tellurium, selenium or sulfur · CPC title

• H10N10/10

  operating with only the Peltier or Seebeck effects · CPC title

• H10N10/01

  Manufacture or treatment · CPC title