MEMS mirror device with piezoelectric actuation and manufacturing process thereof

US12517345B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12517345-B2
Application numberUS-202318220554-A
CountryUS
Kind codeB2
Filing dateJul 11, 2023
Priority dateJul 18, 2022
Publication dateJan 6, 2026
Grant dateJan 6, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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Disclosed herein is a micro-electro-mechanical mirror device having a fixed structure defining an external frame delimiting a cavity, a tiltable structure extending into the cavity, a reflecting surface carried by the tiltable structure and having a main extension in a horizontal plane, and an actuation structure coupled between the tiltable structure and the fixed structure. The actuation structure is formed by a first pair of actuation arms causing rotation of the tiltable structure around a first axis parallel to the horizontal plane. The actuation arms are elastically coupled to the tiltable structure through elastic coupling elements and are each formed by a bearing structure and a piezoelectric structure. The bearing structure of each actuation arm is formed by a soft region of a first material and the elastic coupling elements are formed by a bearing layer of a second material, the second material having greater stiffness than the first material.

First claim

Opening claim text (preview).

The invention claimed is: 1 . A micro-electro-mechanical systems (MEMS) mirror device, comprising: a fixed structure defining an external frame delimiting a cavity; a tiltable structure extending into the cavity; a reflecting surface carried by the tiltable structure and having a main extension in a first plane; and an actuation structure coupled between the tiltable structure and the fixed structure; wherein the actuation structure comprises at least one first pair of actuation arms configured to cause rotation of the tiltable structure around a first rotation axis parallel to the first plane, the actuation arms of the at least one first pair of actuation arms being elastically coupled to the tiltable structure through respective elastic coupling elements with each actuation arm comprising a bearing structure and a piezoelectric structure, and wherein the bearing structure of each actuation arm of the at least one first pair of actuation arms comprises a first region made of a first material and the elastic coupling elements comprise a bearing layer made of a second material, the second material having greater stiffness than the first material. 2 . The MEMS mirror device according to claim 1 , wherein the second material comprises silicon. 3 . The MEMS mirror device according to claim 1 , wherein the first material comprises a polymeric material. 4 . The MEMS mirror device according to claim 1 , wherein the first material comprises a dry film photoresist. 5 . The MEMS mirror device according to claim 1 , wherein the bearing structure further comprises an additional layer made of a third material having a stiffness equal to a stiffness of the second material, the additional layer being arranged above or below the first region. 6 . The MEMS mirror device according to claim 5 , wherein the third material is chosen from the group consisting of silicon oxide, silicon nitride, metal. 7 . The MEMS mirror device according to claim 1 , wherein the bearing structure further comprises an additional layer made of a third material having a stiffness greater than the first material and lower than the second material, the additional layer being arranged above or below the first region. 8 . The MEMS mirror device according to claim 7 , wherein the piezoelectric structure overlays the cavity and the bearing structure overlays the piezoelectric structure. 9 . The MEMS mirror device according to claim 1 , wherein the bearing structure overlays the cavity and the piezoelectric structure overlays the bearing structure. 10 . The MEMS mirror device according to claim 1 , further comprising an internal frame surrounding the tiltable structure, the internal frame being rigidly coupled to the tiltable structure and elastically coupled to the at least one first pair of actuation arms through the elastic coupling elements. 11 . The MEMS mirror device according to claim 10 , wherein the actuation structure further comprises a pair of actuation arms configured to cause rotation of the tiltable structure around a second rotation axis, transverse to the first rotation axis and parallel to the first plane, the actuation arms of the pair of actuation arms being elastically coupled to the internal frame through respective actuation elastic elements and comprising respective bearing structures and respective piezoelectric structures; wherein the tiltable structure, the fixed structure, the bearing structures of the actuation arms and the actuation elastic elements are made of the second material. 12 . The MEMS mirror device according to claim 11 , wherein the actuation arms of the at least one first pair of actuation arms are elastically coupled to the internal frame on opposite sides of the first rotation axis; further comprising a second pair of actuation arms arranged symmetrically to the at least one first pair of actuation arms with respect to the second rotation axis, the actuation arms of the second pair of actuation arms being elastically coupled to the tiltable structure on opposite sides of the first rotation axis, through respective elastic elements. 13 . The MEMS mirror device according to claim 9 , wherein the tiltable structure is configured to rotate around the first rotation axis with a quasi-static movement and to rotate around the second rotation axis with a resonant movement. 14 . A process of manufacturing a micro-electro-mechanical systems (MEMS) mirror device, comprising: forming a fixed structure defining an external frame which delimits a cavity; forming a tiltable structure extending into the cavity; forming a reflecting surface carried by the tiltable structure and having a main extension in a first plane; and forming an actuation structure, coupled between the tiltable structure and the fixed structure and configured to cause rotation of the tiltable structure around a first rotation axis parallel to the first plane, wherein forming the actuation structure comprises forming at least one first pair of actuation arms and forming elastic coupling elements each elastically coupling a respective first actuation arm of the at least one first pair of actuation arms to the tiltable structure, wherein forming the at least one first pair of actuation arms comprises forming a bearing structure and forming a piezoelectric structure, and wherein the bearing structure of each actuation arm of the at least one first pair of actuation arms comprises a first region made of a first material and the elastic coupling elements comprise a bearing layer made of a second material, the second material having greater stiffness than the first material. 15 . The process according to claim 14 , further comprising: on a wafer made of semiconductor material having a first and a second face, forming a piezoelectric region and a first region on the first face; partially removing the semiconductor material of the wafer from the second face to form the cavity and define the fixed structure, the tiltable structure, and the elastic coupling elements of the at least one first pair of actuation arms, and completely removing the semiconductor material of the wafer below the at least one first pair of actuation arms. 16 . The process according to claim 14 , wherein forming a piezoelectric structure comprises forming and patterning a first electrode layer, a piezoelectric layer, and a second piezoelectric layer, and wherein forming a bearing structure comprises forming a first region made of a polymeric material above or below the piezoelectric structure. 17 . A MEMS mirror device, comprising: a frame encompassing a cavity; a mirror element extending into the cavity, rotatable, carrying a reflecting surface in a first plane; and an actuation component linking the mirror element and the frame; the actuation component including at least one pair of actuation arms promoting rotation of the mirror element around an axis parallel to the first plane, the pair of actuation arms being elastically linked to the mirror element via elastic coupling elements, each actuation arm having a bearing structure and a piezoelectric structure, the bearing structure of each actuation arm comprised of a first region made of a first material, and the elastic coupling elements including a bearing layer made of a second material, the second material being stiffer than the first material. 18 . The MEMS mirror device of claim 17 , further comprising an internal frame around the mirror element, rigidly linked to the mirror element and elastically linked to the actuation arms via the el

Assignees

Inventors

Classifications

  • Treatments for improving the stiffness of a vibrating element · CPC title

  • Micromirrors, not used as optical switches · CPC title

  • For controlling stiffness, e.g. ribs · CPC title

  • containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title

  • comprising flexible or deformable structures (manufacture of MEMS devices for specific applications, see relevant places, e.g. gyroscopes G01C19/5719, pressure sensors G01L9/0042, accelerometers G01P15/0802, acoustic transducers or diaphragms therefor H04R31/00) · CPC title

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What does patent US12517345B2 cover?
Disclosed herein is a micro-electro-mechanical mirror device having a fixed structure defining an external frame delimiting a cavity, a tiltable structure extending into the cavity, a reflecting surface carried by the tiltable structure and having a main extension in a horizontal plane, and an actuation structure coupled between the tiltable structure and the fixed structure. The actuation stru…
Who is the assignee on this patent?
St Microelectronics Srl
What technology area does this patent fall under?
Primary CPC classification G02B26/0858. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jan 06 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).