Method for separating ultrathin glass

US12515978B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12515978-B2
Application numberUS-202318181589-A
CountryUS
Kind codeB2
Filing dateMar 10, 2023
Priority dateSep 11, 2020
Publication dateJan 6, 2026
Grant dateJan 6, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for separating an ultrathin glass using ultrashort laser pulses of an ultrashort pulse laser includes focusing the ultrashort laser pulses into the ultrathin glass such that a resulting focal zone is elongated in a beam direction and extends over an entire thickness of the ultrathin glass. The ultrashort laser pulses have a non-radially symmetric beam cross section perpendicular to a beam propagation direction. The method further includes introducing material modifications into the ultrathin glass along a separating line using the ultrashort laser pulses focused into the ultrathin glass, and separating the ultrathin glass along the separating line.

First claim

Opening claim text (preview).

The invention claimed is: 1 . A method for separating a glass using laser pulses of a pulse laser, the method comprising: focusing the laser pulses into the glass such that a resulting focal zone is elongated in a beam direction and extends over an entire thickness of the glass, wherein a laser beam formed by the laser pulses have a non-radially symmetric beam cross section perpendicular to a beam propagation direction, and wherein secondary maxima situated nearest to a principal maximum of the laser beam are positioned on an axis perpendicular to a long axis of the non-radially symmetric beam cross section and have an intensity of more than 17% relative to a maximum intensity, introducing material modifications into the glass along a separating line using the laser pulses focused into the glass, and separating the glass along the separating line. 2 . The method according to claim 1 , wherein the separating step comprises applying a thermal stress, and/or applying a mechanical force, and/or etching by using at least one wet-chemical solution. 3 . The method according to claim 1 , wherein the separating step comprises repeatedly passing the laser pulses over the separating line while introducing the laser pulses of the pulse laser, wherein laser parameters of the pulse laser are kept constant for all passes and correspond to laser parameters used for initial introduction of the material modifications. 4 . The method according to claim 1 , wherein a length of the focal zone elongated in the beam direction is longer than twice or ten times of the thickness of the glass. 5 . The method according to claim 1 , wherein the laser beam formed by the laser pulses is a quasi non-diffractive laser beam, at least in the focal zone elongated in the beam direction. 6 . The method according to claim 1 , wherein the long axis of the non-radially symmetric beam cross section has a vanishing intensity. 7 . The method according to claim 1 , wherein the long axis of the non-radially symmetric beam cross section has a non-vanishing intensity, and has an interference contrast of less than 0.9. 8 . The method according to claim 1 , wherein the material modification has a non-radially symmetric material modification cross section, and/or the long axis of the non-radially symmetric material modification cross section is oriented along the separating line. 9 . The method according to claim 1 , wherein each material modification is introduced into the glass by a single laser pulse or by a single burst of laser pulses. 10 . The method according to claim 1 , wherein all of the material modifications are introduced into the glass in a single pass of a laser beam formed by the laser pulses along the separating line, and the glass is then separated by application of a tensile force in the separating step. 11 . The method according to claim 1 , wherein a distance between the material modifications is greater than twice, or four times, or ten times of a long axis of a non-radially symmetric material modification cross section. 12 . The method according to claim 1 , wherein the laser pulses have a wavelength of between 300 nm and 2000 nm, and/or the laser pulses have a pulse duration that is shorter than 1 ns, and/or a pulse energy of each laser pulse is less than 100 μJ, and/or a repetition rate of a laser beam formed by the laser pulses is less than 1 MHZ, and/or when a plurality of laser pulses are emitted in a pulse train, the pulse train comprises between two and six laser pulses, and a repetition rate within a pulse train is between 100 MHz and 50 GHz. 13 . The method according to claim 1 , wherein the glass is thinner than 1000 μm. 14 . The method according to claim 1 , wherein a laser pulse is split by a beam splitter optical unit, and at least two material modifications are introduced simultaneously into the glass.

Assignees

Inventors

Classifications

  • Cutting or splitting in curves, especially for making spectacle lenses · CPC title

  • into an oval shape, e.g. elliptic shape · CPC title

  • by beam condensation on the workpiece, e.g. for focusing · CPC title

  • taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence) · CPC title

  • Glass · CPC title

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What does patent US12515978B2 cover?
A method for separating an ultrathin glass using ultrashort laser pulses of an ultrashort pulse laser includes focusing the ultrashort laser pulses into the ultrathin glass such that a resulting focal zone is elongated in a beam direction and extends over an entire thickness of the ultrathin glass. The ultrashort laser pulses have a non-radially symmetric beam cross section perpendicular to a b…
Who is the assignee on this patent?
Trumpf Laser—und Systemtechnik GmbH, Trumpf Laser & Systemtechnik Gmbh
What technology area does this patent fall under?
Primary CPC classification B23K26/53. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 06 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).