Flexible circuit board and electronic device comprising same

Patent metadata

Field	Value
Publication number	US-12513818-B2
Application number	US-202318348622-A
Country	US
Kind code	B2
Filing date	Jul 7, 2023
Priority date	Jan 13, 2021
Publication date	Dec 30, 2025
Grant date	Dec 30, 2025

Abstract

An electronic device is provided. The electronic device includes a housing, a main circuit board arranged inside the housing, and at least one flexible circuit board electrically connected to the main circuit board, wherein the flexible circuit board includes a flexible circuit part, and a joining part arranged on one end of the flexible circuit part and connected to the main circuit board. A first joining part includes a first layer oriented a first direction and having at least one first connection hole, a second layer oriented in a second direction opposite to the first direction and has at least one second connection hole, and a reinforcement member which is arranged between the first and the second layer and is connected to the flexible circuit part while being arranged such that at least a portion thereof overlaps with the one end part of the flexible circuit part.

First claim

What is claimed is:

1 . An electronic device comprising:
a housing; a main circuit board disposed within the housing; and at least one flexible circuit board electrically connected to the main circuit board, wherein the flexible circuit board comprises:
a flexible circuit part, and
a connection part disposed at one end of the flexible circuit part and connected to the main circuit board,
wherein the connection part comprises:
a first layer oriented in a first direction and including one or more first connection holes,
a second layer oriented in a second direction opposite to the first direction and including one or more second connection holes, and
a reinforcing member, disposed between the first and second layers, and connected to a layer of the flexible circuit part in a state of at least partially overlapping one end portion of the flexible circuit part, the layer of the flexible circuit part being disposed in a same layer as the reinforcing member, and
wherein a material of the layer of the flexible circuit part is different from a material of the reinforcing member.

2 . The electronic device of claim 1 , wherein the reinforcing member comprises:
first and second reinforcing insulating films, and an adhesive layer bonded between the first and second reinforcing insulating films.

3 . The electronic device of claim 2 , wherein the adhesive layer comprises one end portion disposed to overlap the one end portion of the flexible circuit part.

4 . The electronic device of claim 2 , wherein the flexible circuit part comprises:
a first conductive layer disposed to be oriented in the first direction, and a second conductive layer disposed to be oriented in the second direction and spaced apart from the first conductive layer.

5 . The electronic device of claim 4 ,
wherein the first conductive layer comprises:
a first protective layer applied to a first surface of the first conductive layer oriented in the first direction, and
a first insulating film disposed on a second surface of the first conductive layer oriented in the second direction, and
wherein the second conductive layer comprises:
a second protective layer applied to a first surface of the second conductive layer oriented in the first direction, and
a second insulating film disposed on a second surface of the second conductive layer oriented in the second direction.

6 . The electronic device of claim 5 , further comprising: an air layer between the first and second insulating films.

7 . The electronic device of claim 6 , wherein the adhesive layer directly faces the air layer.

8 . The electronic device of claim 5 , further comprising: a flexible material between the first and second insulating films.

9 . The electronic device of claim 5 ,
wherein the first reinforcing insulating film extends from the first insulating film, and wherein the second reinforcing insulating film extends from the second insulating film.

10 . The electronic device of claim 1 ,
wherein the reinforcing member comprises one or more third connection holes, and wherein each of the one or more third connection holes are disposed to be vertically coaxial to a corresponding one of the one or more first connection holes and a corresponding one of the one or more second connection holes.

11 . The electronic device of claim 1 , wherein an interposer is disposed between the connection part and the main circuit board.

12 . The electronic device of claim 11 ,
wherein the interposer comprises one or more fourth connection holes, and wherein each of the one or more fourth connection holes are disposed to be vertically coaxial to a corresponding one of the one or more first connection holes and a corresponding one of the one or more second connection holes.

13 . The electronic device of claim 1 , wherein each of the one or more first connection holes are disposed to be vertically coaxial to a corresponding one of the one or more second connection holes.

14 . A flexible circuit board comprising:
a flexible circuit part; and a connection part disposed at one end of the flexible circuit part, wherein the connection part comprises:
a first layer oriented in a first direction and including one or more first connection holes,
a second layer oriented in a second direction opposite to the first direction and including one or more second connection holes, and
a reinforcing member, disposed between the first and second layers, connected to a layer of the flexible circuit part in a state of at least partially overlapping one end portion of the flexible circuit part, the layer of the flexible circuit part being disposed in a same layer as the reinforcing member, and
wherein a material of the layer of the flexible circuit part is different from a material of the reinforcing member.

15 . The flexible circuit board of claim 14 , wherein the reinforcing member comprises:
first and second reinforcing insulating films, and an adhesive layer bonded between the first and second reinforcing insulating films.

16 . The flexible circuit board of claim 15 , wherein the adhesive layer comprises one end portion disposed to overlap the one end portion of the flexible circuit part.

17 . The flexible circuit board of claim 15 , wherein the flexible circuit part comprises:
a first conductive layer disposed to be oriented in the first direction, and a second conductive layer disposed to be oriented in the second direction opposite and spaced apart from the first conductive layer.

18 . The flexible circuit board of claim 17 ,
wherein the first conductive layer comprises:
a first protective layer applied to a first surface of the first conductive layer oriented in the first direction, and
a first insulating film disposed on a second surface of the first conductive layer oriented in the second direction, and
wherein the second conductive layer comprises:
a second protective layer applied to a first surface of the second conductive layer oriented in the first direction, and
a second insulating film disposed on a second surface of the second conductive layer oriented in the second direction.

19 . The flexible circuit board of claim 18 , further comprising: an air layer between the first and second insulating films.

20 . The flexible circuit board of claim 19 , wherein the adhesive layer directly faces the air layer.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Youngsun
• Kim Kideok
• Kim Byeongkeol
• Lee Jongbum
• Jeon Jongmin
• Cho Jeongbeom

Classifications

• H05K2201/10378

  Interposers · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K1/147

  at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence) · CPC title

• H04R2420/07

  Applications of wireless loudspeakers or wireless microphones · CPC title

• H05K3/363

  by soldering · CPC title