Multilayer capacitor and method of manufacturing the same
US-2022139616-A1 · May 5, 2022 · US
US12512270B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12512270-B2 |
| Application number | US-202418584402-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 22, 2024 |
| Priority date | Nov 16, 2023 |
| Publication date | Dec 30, 2025 |
| Grant date | Dec 30, 2025 |
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A disclosed multilayer ceramic capacitor includes: a ceramic main body; a plurality of first internal electrodes and a plurality of second internal electrodes that are disposed inside the ceramic main body; and a first external electrode and a second external electrode that are disposed outside the ceramic main body. Each of the first and second external electrodes includes an electrode layer disposed on an end surface of the body and electrically connected to the first or second internal electrodes, a non-conductive resin layer disposed on at least one surface connected to the end surface of the ceramic main body and in contact with the electrode layer, and a conductive resin layer covering at least a portion of the non-conductive resin layer.
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What is claimed is: 1 . A multilayer ceramic capacitor, comprising: a ceramic main body that includes a first surface and a second surface facing in a first direction, a third surface and a fourth surface facing in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface facing in a third direction and connecting the first surface and the second surface; a plurality of first internal electrodes and a plurality of second internal electrodes that are disposed inside the ceramic main body; a first external electrode and a second external electrode that are disposed outside the ceramic main body; a first plating layer covering at least a portion of the first external electrode; and a second plating layer covering at least a portion of the second external electrode, wherein the first external electrode includes: a first electrode layer disposed on the first surface of the ceramic main body and electrically connected to the plurality of first internal electrodes, a first non-conductive resin layer disposed on at least one of the third surface, the fourth surface, the fifth surface, or the sixth surface of the ceramic main body and in contact with the first electrode layer, and a first conductive resin layer covering at least a portion of the first non-conductive resin layer, wherein the second external electrode includes: a second electrode layer disposed on the second surface of the ceramic main body and electrically connected to the plurality of second internal electrodes, a second non-conductive resin layer disposed on at least one of the third surface, the fourth surface, the fifth surface, or the sixth surface of the ceramic main body and in contact with the second electrode layer, and a second conductive resin layer covering at least a portion of the second non-conductive resin layer, and wherein the first plating layer directly contacts the first electrode layer, and the second plating layer directly contacts the second electrode layer. 2 . The multilayer ceramic capacitor of claim 1 , wherein the first non-conductive resin layer includes a first end portion in contact with the first electrode layer, and a second end portion opposing the first end portion in the first direction, and the second non-conductive resin layer includes a third end portion in contact with the second electrode layer, and a fourth end portion opposing the third end portion in the first direction. 3 . The multilayer ceramic capacitor of claim 2 , wherein the first conductive resin layer covers the first end portion and the second end portion of the first non-conductive resin layer, and the second conductive resin layer covers the third end portion and the fourth end portion of the second non-conductive resin layer. 4 . The multilayer ceramic capacitor of claim 2 , wherein the first conductive resin layer covers the first end portion of the first non-conductive resin layer and exposes the second end portion, and the second conductive resin layer covers the third end portion of the second non-conductive resin layer and exposes the fourth end portion. 5 . The multilayer ceramic capacitor of claim 4 , wherein a length of the first non-conductive resin layer is greater than a length of the first conductive resin layer, and a length of the second non-conductive resin layer is greater than a length of the second conductive resin layer. 6 . The multilayer ceramic capacitor of claim 1 , wherein the first electrode layer further includes a first extension portion disposed on at least one of the third surface, the fourth surface, the fifth surface, or the sixth surface of the ceramic main body, and the second electrode layer further includes a second extension portion disposed on at least one of the third surface, the fourth surface, the fifth surface, or the sixth surface of the ceramic main body. 7 . The multilayer ceramic capacitor of claim 6 , wherein the first extension portion is covered by the first non-conductive resin layer, and the second extension portion is covered by the second non-conductive resin layer. 8 . The multilayer ceramic capacitor of claim 6 , wherein the first non-conductive resin layer includes a first end portion in contact with the first electrode layer, and a second end portion opposing the first end portion in the first direction, and the second non-conductive resin layer includes a third end portion in contact with the second electrode layer, and a fourth end portion opposing the third end portion in the first direction. 9 . The multilayer ceramic capacitor of claim 8 , wherein the first conductive resin layer covers the second end portion of the first non-conductive resin layer, and the second conductive resin layer covers the fourth end portion of the second non-conductive resin layer. 10 . The multilayer ceramic capacitor of claim 8 , wherein the first conductive resin layer exposes the second end portion of the first non-conductive resin layer, and the second conductive resin layer exposes the fourth end portion of the second non-conductive resin layer. 11 . The multilayer ceramic capacitor of claim 8 , wherein a length of the first non-conductive resin layer is greater than a length of the first conductive resin layer, and a length of the second non-conductive resin layer is greater than a length of the second conductive resin layer. 12 . The multilayer ceramic capacitor of claim 1 , wherein the first electrode layer includes copper (Cu) or nickel (Ni), and the second electrode layer includes copper (Cu) or nickel (Ni). 13 . The multilayer ceramic capacitor of claim 1 , wherein the first non-conductive resin layer includes epoxy, and the second non-conductive resin layer includes epoxy. 14 . The multilayer ceramic capacitor of claim 1 , wherein the first conductive resin layer includes a conductive metal and epoxy, and the second conductive resin layer includes a conductive metal and epoxy. 15 . The multilayer ceramic capacitor of claim 1 , wherein the first conductive resin layer includes an intermetallic compound and epoxy, and the second conductive resin layer includes an intermetallic compound and epoxy. 16 . The multilayer ceramic capacitor of claim 1 , wherein the first plating layer includes a first layer disposed on the first external electrode and a second layer disposed on the first layer, and the second plating layer includes a third layer disposed on the second external electrode and a fourth layer disposed on the third layer. 17 . The multilayer ceramic capacitor of claim 16 , wherein the first layer and the third layer include nickel (Ni), and the second layer and the fourth layer include tin (Sn). 18 . A multilayer ceramic capacitor, comprising: a ceramic main body that includes a first surface and a second surface facing in a first direction, a third surface and a fourth surface facing in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface facing in a third direction and connecting the first surface and the second surface; a plurality of first internal electrodes and a plurality of second internal electrodes that are disposed inside the ceramic main body; a non-conductive resin layer that is disposed on at least one of the third surface, the fourth surface, the fifth surface, or the sixth surface of the ceramic main body; a first external electrode and a second external electrode that are disposed outside the cera
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