Lanterns with elements for heat discharge

US12510098B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12510098-B2
Application numberUS-202118267511-A
CountryUS
Kind codeB2
Filing dateNov 16, 2021
Priority dateDec 16, 2020
Publication dateDec 30, 2025
Grant dateDec 30, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A pump assembly such as a centrifugal pump assembly includes a lantern arranged between a pump housing and a motor housing. Surface enlarging elements are arranged at the lantern for increasing heat dissipation and/or enhancing cooling air flow.

First claim

Opening claim text (preview).

The invention claimed is: 1 . A pump arrangement, comprising: a pump casing; a fan impeller; a motor casing; and a lantern having a first part that contacts the pump casing and a second part that contacts the motor casing; wherein the lantern has heat dissipating surface-enlarging elements that extend farther along a radially-outward direction of the lantern than the first and second parts, wherein the motor casing has cooling ribs which cooperate with the heat dissipating surface-enlarging elements of the lantern in such a way that: i) both the cooling ribs and the heat dissipating surface-enlarging elements each comprise portions that extend at least partially in the same direction, and ii) a stream of cooling air generated by the fan impeller flows successively over the cooling ribs of the motor casing and the heat dissipating surface-enlarging elements of the lantern. 2 . The pump arrangement as claimed in claim 1 , wherein a lantern internal diameter remains constant and a lantern external diameter is widened over an axial length of a base body of the lantern. 3 . The pump arrangement as claimed in claim 2 , wherein the lantern external diameter is wider on a pump side of the lantern than on a motor side of the lantern. 4 . The pump arrangement as claimed in claim 1 , wherein the lantern is rotationally symmetric. 5 . The pump arrangement as claimed in claim 1 , wherein the heat dissipating surface-enlarging elements are arranged on a base body of the lantern. 6 . The pump arrangement as claimed in claim 1 , wherein the thermal conductivity of the heat dissipating surface-enlarging elements is more than 150 W/m-K. 7 . The pump arrangement as claimed in claim 1 , wherein the thermal conductivity of a base body of the lantern is less than 40 W/m-K. 8 . The pump arrangement as claimed in claim 5 , wherein the heat dissipating surface-enlarging elements are guide elements configured to: i) guide a stream of cooling air over the pump housing, and ii) reduce flow resistance by guiding the stream of cooling air in such a way that it does not strike the pump casing at right angles. 9 . The pump arrangement as claimed in claim 8 , wherein the heat dissipating surface-enlarging elements are oriented axially. 10 . The pump arrangement as claimed in claim 8 , wherein the heat dissipating surface-enlarging elements are oriented radially. 11 . The pump arrangement as claimed in claim 9 , wherein the heat dissipating surface-enlarging elements have at least one of a plate shape, a trapezoidal shape, a curved shape, a triangular shape and an annular shape. 12 . The pump arrangement as claimed in claim 10 , wherein the heat dissipating surface-enlarging elements have at least one of a plate shape, a trapezoidal shape, a curved shape, a triangular shape and an annular shape.

Assignees

Inventors

Classifications

  • by increasing the heat transfer surface · CPC title

  • heat insulation or conduction · CPC title

  • F04D13/06Primary

    the pump being electrically driven · CPC title

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Frequently asked questions

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What does patent US12510098B2 cover?
A pump assembly such as a centrifugal pump assembly includes a lantern arranged between a pump housing and a motor housing. Surface enlarging elements are arranged at the lantern for increasing heat dissipation and/or enhancing cooling air flow.
Who is the assignee on this patent?
Ksb Se & Co Kgaa
What technology area does this patent fall under?
Primary CPC classification F04D29/5893. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Dec 30 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).