Conductive polymer adhesive and method of preparing the same

Patent metadata

Field	Value
Publication number	US-12509591-B2
Application number	US-202217703694-A
Country	US
Kind code	B2
Filing date	Mar 24, 2022
Priority date	Dec 31, 2021
Publication date	Dec 30, 2025
Grant date	Dec 30, 2025

Abstract

Disclosed is a conductive polymer composite according to various embodiments of the present invention in order to implement the above-described object. The conductive polymer composite may include a polymer adhesive which includes a curable polymer and a curing agent, a conductive filler made of a metal having electrical properties, and a substituting agent configured to substitute for or remove a lubricant layer applied on the conductive filler.

First claim

What is claimed is:

1 . A conductive polymer composite, comprising:
a polymer adhesive which includes a curable polymer and a curing agent; a conductive filler comprising metal particles having electrical properties, wherein the conductive filler previously has had a lubricant layer; and a substituting agent, which comprises a succinic acid surrounding the metal particles by removing and substituting the lubricant layer, which previously has been applied on the conductive filler, wherein the succinic acid is included in a content that is greater than 0 parts by weight and is less than or equal to 10 parts by weight with respect to 100 parts by weight of the metal particles, and wherein the succinic acid surrounding the metal particles adjusts an interaction between the metal particles to improve electrical conductivity of the conductive filler, wherein the succinic acid is present in the conductive polymer composite after the conductive polymer composite is bonded to a flexible substrate.

2 . The conductive polymer composite of claim 1 , wherein the polymer adhesive has a viscosity of 3,000 mPa·s to 150,000 mPa·s, at a temperature range of 20° C. to 40° C. before curing has initiated.

3 . The conductive polymer composite of claim 1 , wherein the polymer adhesive has a bulk tensile strength of 0.1 MPa to 100 MPa and a volume shrinkage ratio of 1% to 20% after curing.

4 . The conductive polymer composite of claim 1 , wherein the polymer adhesive includes 10 to 200 parts by weight of the curing agent with respect to 100 parts by weight of the curable polymer.

5 . The conductive polymer composite of claim 1 , wherein the conductive polymer composite includes 100 to 500 parts by weight of the conductive filler with respect to 100 parts by weight of the polymer adhesive.

6 . The conductive polymer composite of claim 1 , wherein the polymer adhesive includes at least one selected from among an epoxy resin, a silicone-based resin, a urethane-based resin, an acrylic-based resin, an isoprene-based resin, a chloroprene-based resin, a fluoro-based resin, butadiene rubber, and styrene-butadiene rubber.

7 . The conductive polymer composite of claim 1 , wherein the polymer adhesive is a silicone-based resin.

8 . The conductive polymer composite of claim 1 , wherein the metal particles comprise at least one selected from among gold (Au), silver (Ag), copper (Cu), nickel (Ni), aluminum (Al), platinum (Pt), ruthenium (Ru), rhodium (Rh), tungsten (W), cobalt (Co), palladium (Pd), titanium (Ti), tantalum (Ta), iron (Fe), molybdenum (Mo), hafnium (Hf), lanthanum (La), and iridium (Ir).

9 . The conductive polymer composite of claim 1 , wherein the metal particles are in a form of at least one of wires, flakes, particles, or tubes, and are dispersed in an organic solvent.

10 . The conductive polymer composite of claim 1 , wherein the metal particles have a diameter of 100 nm to 200 nm, a diameter of 1 μm to 4 μm, or a diameter of 5 μm to 10 μm.

11 . The conductive polymer composite of claim 1 , wherein:
the conductive polymer composite is attachable on a flexible substrate and is used as an electrode when bonded to the flexible substrate; and the flexible substrate is a substrate made of at least one selected from among a silicone-based resin, a urethane-based resin, polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polytetrafluoroethylene (PTFE), polystyrene (PS), and polyethersulfonate (PES).

12 . The conductive polymer composite of claim 1 , wherein the metal particles are silver flakes, and the succinic acid surrounding the silver flakes adjusts an interaction between the silver flakes to improve electrical conductivity of the conductive filler.

13 . The conductive polymer composite of claim 1 , wherein the conductive polymer composite has an adhesive strength of 0.8 to 22 N/mm 2 .

14 . A flexible electronic device comprising the conductive polymer composite of claim 1 .

15 . The flexible electronic device of claim 14 , wherein the flexible electronic device is at least one of a flexible display, a flexible transistor, a flexible sensor, an actuator, and a solar cell.

16 . A flexible electronic device comprising:
a flexible substrate in which an auxetic including a plurality of unit structures is formed; and a flexible electrode formed on the flexible substrate through a conductive polymer composite, wherein the conductive polymer composite includes: a polymer adhesive which includes a curable polymer and a curing agent; a conductive filler comprising metal particles having electrical properties, wherein the conductive filler previously has had a lubricant layer; and a substituting agent, which comprises a succinic acid surrounding the metal particles by removing and substituting the lubricant layer, which previously has been applied on the conductive filler, wherein the succinic acid is included in a content that is greater than 0 parts by weight and is less than or equal to 10 parts by weight with respect to 100 parts by weight of the metal particles, and wherein the succinic acid surrounding the metal particles adjusts an interaction between the metal particles to improve electrical conductivity of the conductive filler, wherein the succinic acid is present in the conductive polymer composite after the conductive polymer composite is bonded to the flexible substrate.

Assignees

• Korea Inst Sci & Tech

Inventors

• Kim Heesuk
• Jung Jeein
• Chung Seungjun
• Son Jeonggon
• Lee Phillip
• Ko Youngpyo

Classifications

• C08J7/044

  Forming conductive coatings; Forming coatings having anti-static properties · CPC title

• C08K2201/003

  Additives being defined by their diameter · CPC title

• C08K2201/005

  Additives being defined by their particle size in general · CPC title

• C08K2201/001

  Conductive additives · CPC title

• C08K9/04

  Ingredients treated with organic substances {(treated with macromolecular compounds C08K9/08)} · CPC title