Deposition mask package and deposition mask packaging method
US-2019237349-A1 · Aug 1, 2019 · US
Deposition mask package and deposition mask packaging method
US12508797B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12508797-B2 |
| Application number | US-202418732759-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 4, 2024 |
| Priority date | Sep 29, 2016 |
| Publication date | Dec 30, 2025 |
| Grant date | Dec 30, 2025 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A deposition mask package according to the present embodiment includes a receiving portion, a lid portion that faces the receiving portion, a deposition mask that is arranged between the receiving portion and the lid portion and has an effective region in which a plurality of through-holes is formed. The receiving portion has a first opposing surface facing the lid portion and a concave portion provided on the first opposing surface. The concave portion is covered by a first flexible film. The effective region of the deposition mask is arranged on the concave portion with the first flexible film interposed therebetween.
First claim
Opening claim text (preview).
The invention claimed is: 1 . A deposition mask packaging method for packaging a deposition mask, which includes a first surface, a second surface positioned opposite to the first surface, and a plurality of through-holes extending from the first surface to the second surface, the deposition mask packaging method comprising: obtaining a deposition mask stacked body having the deposition mask and an interposed sheet stacked on each of the first surface and the second surface of the deposition mask, the deposition mask stacked body placed on a receiving portion; arranging a lid portion on the deposition mask stacked body such that the receiving portion and the lid portion face each other; and sandwiching the deposition mask stacked body between the receiving portion and the lid portion, wherein a difference between a thermal expansion coefficient of the deposition mask and a thermal expansion coefficient of the interposed sheets is 7 ppm/° C. or less, and wherein each interposed sheet is formed in a flat shape comprising no holes. 2 . The deposition mask packaging method according to claim 1 , wherein the interposed sheets have a dimension such that a circumferential edge of the interposed sheets protrude from the deposition mask over an entire circumference as viewed along a stacking direction of the deposition mask. 3 . The deposition mask packaging method according to claim 1 , wherein the deposition mask and the interposed sheets are formed using an iron alloy containing nickel in an amount of 30% by mass to 54% by mass. 4 . The deposition mask packaging method according to claim 1 , wherein the deposition mask and the interposed sheets are formed using an iron alloy containing chromium. 5 . The deposition mask packaging method according to claim 1 , wherein a material forming the interposed sheets is identical to a material forming the deposition mask. 6 . The deposition mask packaging method according to claim 1 , wherein a thickness of the interposed sheets is 20 μm to 100 μm. 7 . The deposition mask packaging method according to claim 1 , wherein a thickness of the deposition mask is 15 μm or more. 8 . The deposition mask packaging method according to claim 1 , wherein the receiving portion has a first opposing surface facing the lid portion and a concave portion provided on the first opposing surface, ends on both sides in a first direction of the deposition mask are arranged on the first opposing surface of the receiving portion, a dimension of the interposed sheets in a second direction orthogonal to the first direction is smaller than a dimension of the concave portion in the second direction.
Assignees
Inventors
Classifications
Package configurations · CPC title
Packaging contents into primary and secondary packaging · CPC title
Packaging fragile or shock-sensitive articles other than bottles; Unpacking eggs (embedding articles in shock-absorbing media B65B55/20) · CPC title
by closing hinged lids · CPC title
in bags · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US12508797B2 cover?
- A deposition mask package according to the present embodiment includes a receiving portion, a lid portion that faces the receiving portion, a deposition mask that is arranged between the receiving portion and the lid portion and has an effective region in which a plurality of through-holes is formed. The receiving portion has a first opposing surface facing the lid portion and a concave portion…
- Who is the assignee on this patent?
- Dainippon Printing Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B65D71/02. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 30 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).