Method of producing glass substrate having hole and glass laminate for annealing

US12508672B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12508672-B2
Application numberUS-202218071241-A
CountryUS
Kind codeB2
Filing dateNov 29, 2022
Priority dateOct 30, 2018
Publication dateDec 30, 2025
Grant dateDec 30, 2025

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

First claim

Opening claim text (preview).

What is claimed is: 1 . A glass laminate for annealing, comprising: a glass substrate having a hole; a first support substrate placed under the glass substrate; and a second support substrate placed under the first support substrate, wherein the first support substrate has a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, and wherein a thermal expansion coefficient of the second support substrate is less than or equal to 10 ppm/K, wherein the first support substrate is larger than the glass substrate, and the second support substrate is larger than the first support substrate. 2 . The glass laminate of claim 1 , wherein the first support substrate has a first surface in contact with the glass substrate, the first surface of the first support substrate having an arithmetic mean roughness Ra greater than or equal to 0.1 μm and less than or equal to 2.0 μm. 3 . The glass laminate of claim 2 , wherein the arithmetic mean roughness Ra is greater than or equal to 0.3 μm and less than or equal to 1.5 μm. 4 . The glass laminate of claim 1 , wherein the second support substrate has a first surface in contact with the first support substrate, the first surface of the second support substrate having a flatness of less than or equal to 600 μm. 5 . The glass laminate of claim 1 , wherein the first support substrate has a thermal expansion coefficient that is the same as the thermal expansion coefficient of the glass substrate. 6 . The glass laminate of claim 1 , wherein the first support substrate has the same composition as the glass substrate. 7 . The glass laminate of claim 1 , wherein the thermal expansion coefficient of the first support substrate has a difference from the thermal expansion coefficient of the glass substrate of less than or equal to 0.1 ppm/K. 8 . The glass laminate of claim 1 , wherein the thermal expansion coefficient of the first support substrate has a difference from the thermal expansion coefficient of the glass substrate of less than or equal to 0.05 ppm/K. 9 . The glass laminate of claim 1 , wherein the thermal expansion coefficient of the second support substrate is less than or equal to 5 ppm/K. 10 . The glass laminate of claim 1 , wherein the thermal expansion coefficient of the second support substrate is less than or equal to 1 ppm/K. 11 . The glass laminate of claim 1 , wherein the second support substrate comprises quartz glass or a ceramic. 12 . The glass laminate of claim 1 , wherein the glass substrate has a residual stress around the hole of less than or equal to 30 MPa. 13 . The glass laminate of claim 1 , wherein the glass substrate has a residual stress around the hole of less than or equal to 20 MPa. 14 . The glass laminate of claim 1 , wherein the second support substrate has a thermal expansion coefficient of about 0.55 ppm/K. 15 . The glass laminate of claim 1 , wherein the glass substrate has a strain point of about 670° C. 16 . The glass laminate of claim 1 , wherein the glass substrate has a softening point of about 950° C. 17 . The glass laminate of claim 1 , wherein the glass substrate has thermal expansion coefficient of about 3.8 ppm/K. 18 . The glass laminate of claim 1 , wherein the first support substrate has a first surface in contact with the glass substrate, the first surface of the first support substrate having a chamfered side. 19 . A glass laminate for annealing, comprising: a glass substrate having a hole; a first support substrate placed under the glass substrate; and a second support substrate placed under the first support substrate, wherein the first support substrate has a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, and wherein a thermal expansion coefficient of the second support substrate is less than or equal to 1 ppm/K. 20 . A glass laminate for annealing, comprising: a glass substrate having a hole; a first support substrate placed under the glass substrate; and a second support substrate placed under the first support substrate, wherein the first support substrate has a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, and wherein a thermal expansion coefficient of the second support substrate is less than or equal to 10 ppm/K, wherein the second support substrate comprises quartz glass or a ceramic.

Assignees

Inventors

Classifications

  • Ceramics or glasses · CPC title

  • Thermal properties · CPC title

  • comprising glass as the main or only constituent of a layer, next to another layer of a specific {material} · CPC title

  • Preliminary treatment · CPC title

  • Surface treatment of glass, not in the form of fibres or filaments, by etching (etching or surface-brightening compositions, in general C09K13/00) · CPC title

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What does patent US12508672B2 cover?
A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of…
Who is the assignee on this patent?
Agc Inc
What technology area does this patent fall under?
Primary CPC classification B23K26/362. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 30 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).