Multilayer fluidic devices and methods for their fabrication

Patent metadata

Field	Value
Publication number	US-12508587-B2
Application number	US-202418750918-A
Country	US
Kind code	B2
Filing date	Jun 21, 2024
Priority date	Mar 13, 2013
Publication date	Dec 30, 2025
Grant date	Dec 30, 2025

Abstract

A fluidic device including an inorganic solid support attached to an organic solid support by a bonding layer, wherein the inorganic solid support has a rigid structure and wherein the bonding layer includes a material that absorbs radiation at a wavelength that is transmitted by the inorganic solid support or the organic solid support; and a channel formed by the inorganic solid support and the organic solid support, wherein the bonding layer that attaches the inorganic solid support to the organic solid support provides a seal against liquid flow. Methods for making fluidic devices, such as this, are also provided.

First claim

What is claimed is:

1 . A method for making a multilayer device, comprising:
(a) providing an inorganic solid support and an organic solid support having a cutout region in a shape of a fluidic channel, wherein the inorganic solid support comprises a rigid structure and electrically conductive features present at a location of the inorganic solid support corresponding to a bottom surface of the fluidic channel and absent from a surface area of the inorganic solid support that is to bond to the organic solid support; (b) providing a radiation-absorbing material, wherein the radiation-absorbing material is not a metal; (c) contacting the inorganic solid support, the organic solid support, and the radiation-absorbing material in a configuration wherein a portion of the radiation-absorbing material is present at an interface between the surface area of the inorganic solid support and the organic solid support; and (d) applying compression at the interface and melting at least a portion of the organic solid support or the inorganic solid support by irradiating the portion of the radiation-absorbing material with radiation, then resolidifying the at least the portion of the organic solid support or the inorganic solid support to form a bonding layer between the inorganic solid support and the organic solid support, wherein the fluidic channel is defined at the cutout region and the organic solid support defines walls of the fluidic channel.

2 . The method of claim 1 , wherein the providing of the inorganic solid support comprises creating a chemically reactive layer at the surface area of the inorganic solid support that occurs at the interface.

3 . The method of claim 2 , wherein the creating of the chemically reactive layer comprises silanizing the surface area of the inorganic solid support.

4 . The method of claim 1 , wherein:
the radiation-absorbing material is contained in the organic solid support.

5 . The method of claim 1 , wherein the irradiating of the portion of the radiation-absorbing material is irradiating by a laser at a wavelength in the UV, VIS or IR regions of the spectrum.

6 . The method of claim 1 , wherein the radiation passes through the inorganic solid support or through the organic solid support during the irradiating of the portion of the radiation-absorbing material.

7 . The method of claim 1 , wherein:
the organic solid support comprises a thermoplastic; and the inorganic solid support comprises glass.

8 . The method of claim 1 , wherein the radiation-absorbing material comprises a dye or carbon black.

9 . The method of claim 1 , wherein the electrically conductive features comprise indium tin oxide.

10 . The method of claim 1 , further comprising:
(e) providing a second inorganic solid support; (f) contacting the second inorganic solid support with the organic solid support in a configuration wherein a second portion of the radiation-absorbing material is present at a second interface between the second inorganic solid support and the organic solid support; and (g) applying compression at the second interface and melting at least a second portion of the organic solid support or the second inorganic solid support by irradiating the second portion of the radiation-absorbing material with the radiation, then resolidifying the at least the second portion of the organic solid support or the second inorganic solid support to form a second bonding layer between the second inorganic solid support and the organic solid support, wherein the second inorganic solid support encloses the fluidic channel.

11 . The method as defined in claim 1 , further comprising forming the electrically conductive features by depositing a metal on the inorganic solid support to form an array of metal features at the location corresponding to the fluidic channel.

Assignees

• Illumina Inc

Inventors

• Fisher Jeffrey S
• Moon John A
• Venkatesan Bala Murali

Classifications

• C12Q1/6874

  involving nucleic acid arrays, e.g. sequencing by hybridisation · CPC title

• B29L2031/34

  Electrical apparatus, e.g. sparking plugs or parts thereof · CPC title

• B29L2009/005

  coated · CPC title

• B29C66/739

  characterised by the material of the parts to be joined being a thermoplastic or a thermoset · CPC title

• B01L2300/12

  Specific details about materials · CPC title