Strain decoupled sensor
US-10422642-B2 · Sep 24, 2019 · US
US12507595B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12507595-B2 |
| Application number | US-202117499927-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 13, 2021 |
| Priority date | Oct 16, 2020 |
| Publication date | Dec 23, 2025 |
| Grant date | Dec 23, 2025 |
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A vibrating structure angular rate sensor includes a mount, a planar vibrating structure and a plurality of compliant supports extending between the mount and the planar vibrating structure to support the vibrating structure thereby allowing the planar vibrating structure to oscillate in its plane relative to the mount in response to an electrical excitation. A first set of transducers is arranged on the planar vibrating structure to apply, in use, an electrical excitation to the planar vibrating structure and to sense, in use, motion resulting from oscillation of the planar vibrating structure in its plane. A plurality of capacitive regions is fixed at a distance from the planar vibrating structure in its plane. The capacitive regions form a second set of transducers configured to apply, in use, an electrostatic force to the planar vibrating structure which induces a change in the frequency of oscillation of the planar vibrating structure.
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The invention claimed is: 1 . A vibrating structure angular rate sensor, comprising: a mount; a planar vibrating structure; a plurality of compliant supports extending between the mount and the planar vibrating structure to support the vibrating structure, thereby allowing the planar vibrating structure to oscillate in its plane relative to the mount in response to an electrical excitation; a first set of transducers arranged on the planar vibrating structure to apply, in use, an electrical excitation to the planar vibrating structure and to sense, in use, motion resulting from oscillation of the planar vibrating structure in its plane, wherein the first set of transducers comprises a first set of piezoelectric electrodes formed on the surface of the planar vibrating structure; and a plurality of capacitive regions fixed at a distance from the planar vibrating structure in its plane, wherein the capacitive regions form a second set of transducers configured to apply, in use, an electrostatic force to the planar vibrating structure which induces a change in the frequency of oscillation of the planar vibrating structure. 2 . The vibrating structure angular rate sensor of claim 1 , wherein a first subset of the first set of transducers is configured to cause the planar vibrating structure to oscillate relative to the mount in a primary mode; a second subset of the first set of transducers is configured to sense motion resulting from oscillation of the planar vibrating structure relative to the mount in a secondary mode induced by Coriolis force when an angular rate is applied around an axis substantially perpendicular to the plane of the planar vibrating structure; a third subset of the first set of transducers is configured to sense motion resulting from oscillation of the planar vibrating structure in the primary mode; and the second set of transducers is configured to apply an electrostatic force to the planar vibrating structure which induces a change in the frequency of oscillation in the primary mode and/or secondary mode so as to match the frequencies. 3 . The vibrating structure angular rate sensor of claim 2 , wherein a fourth subset of the first set of transducers is configured to apply an electrical excitation to null the oscillation of the planar vibrating structure in the secondary mode. 4 . The vibrating structure angular rate sensor of claim 3 , wherein the plurality of capacitive regions is arranged symmetrically around the planar vibrating structure in a circumferential arrangement. 5 . The vibrating structure angular rate sensor of claim 1 , further comprising: a magnetic circuit, configured to produce a magnetic field perpendicular to the plane of the planar vibrating structure, and wherein the first set of transducers comprises conductive tracking formed on a surface of the planar vibrating structure. 6 . The vibrating structure angular rate sensor of claim 1 , further comprising: a first set of electrical connections to the first set of transducers; and a second set of electrical connections to the second set of transducers, the first and second sets of electrical connections being independent of one another. 7 . The vibrating structure angular rate sensor of claim 1 , wherein the compliant supports comprise conductive tracking extending between the mount and the first set of transducers; the structure further comprising a direct electrical connection to the second set of transducers. 8 . The vibrating structure angular rate sensor of claim 1 , wherein one or more of the plurality of capacitive regions is fixed at a distance d 1 from the planar vibrating structure and at a distance d 2 from the compliant supports, wherein d 2 >d 1 . 9 . A method of forming a vibrating structure angular rate sensor, comprising: modifying a first substrate to define a planar vibrating structure and a plurality of compliant supports, the compliant supports extending between a mount formed from the first substrate and the planar vibrating structure to support the planar vibrating structure, thereby allowing the planar vibrating structure to oscillate relative to the mount in response to an electrical excitation; forming a first set of transducers on the planar vibrating structure for applying an electrical excitation to the vibrating structure and for sensing motion resulting from oscillation of the planar vibrating structure, wherein the first set of transducers comprises a first set of piezoelectric electrodes formed on the surface of the planar vibrating structure; and forming a plurality of capacitive regions, fixed at a distance from the planar vibrating structure in its plane, wherein the capacitive regions form a second set of transducers for applying an electrostatic force to the planar vibrating structure to induce a change in the frequency of oscillation of the planar vibrating structure. 10 . The method of claim 9 , wherein forming the plurality of capacitive regions comprises modifying the first substrate to define the plurality of capacitive regions in the same material layer. 11 . The method of claim 9 , wherein forming the plurality of capacitive regions comprises: modifying the first substrate to define a plurality of regions; then fixing the first substrate to a second substrate, the second substrate comprising support sections configured to support the plurality of capacitive regions; and then separating each of the regions into a pair of electrically isolated capacitive regions. 12 . The method of claim 9 wherein forming the first set of transducers comprises forming conductive tracking on a surface of the planar vibrating structure. 13 . The method of claim 9 , wherein forming the second set of transducers comprises forming a set of electrodes on the capacitive regions having an electrical connection independent of the first set of transducers.
Electrodes or interconnections, e.g. leads or terminals · CPC title
Gyroscopes · CPC title
Variable capacitors · CPC title
Transducers for transforming electrical into mechanical energy or vice versa (dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00) · CPC title
by measuring frequency of generated current or voltage {(in general G01R23/00)} · CPC title
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