Photosensor

Patent metadata

Field	Value
Publication number	US-12507498-B2
Application number	US-202218052473-A
Country	US
Kind code	B2
Filing date	Nov 3, 2022
Priority date	Dec 9, 2021
Publication date	Dec 23, 2025
Grant date	Dec 23, 2025

Abstract

A photosensor including first and second conductive layers disposed on a main surface and a back surface of a substrate is provided. A conductive via layer is disposed between the conductive layers. A light emitting element and an integrated circuit (IC) including a light receiving element are mounted on the first conductive layer. The photosensor includes a translucent covering member that covers the light emitting element and the IC together with the first conductive layer. The covering member includes a groove between the light emitting element and the IC in a plan view. The first conductive layer includes a first mounting portion on which the light emitting element is mounted and a second mounting portion on which the IC is mounted. The light emitting device is electrically connected to the IC via the first mounting portion, the conductive via layer, the second conductive layer and the second mounting portion.

First claim

The invention claimed is:

1 . A photosensor, comprising:
a substrate; a first conductive layer, disposed on a main surface of the substrate; a second conductive layer, disposed on a back surface of the substrate; a conductive via layer, disposed between the first conductive layer and the second conductive layer; a light emitting element, mounted on the first conductive layer; an integrated circuit (IC), mounted on the first conductive layer and including a light receiving element, wherein the IC includes a driving circuit for the light emitting element; and a covering member being translucent, disposed on the substrate, covering the light emitting element and the IC together with the first conductive layer, and including a groove between the light emitting element and the IC in a plan view of the substrate, wherein the first conductive layer includes:
a first mounting portion, on which the light emitting element is mounted; and a second mounting portion, on which the IC is mounted, and
the light emitting element is electrically connected to the IC through the first mounting portion, the conductive via layer, the second conductive layer and the second mounting portion, wherein the light emitting element includes:
a first electrode, disposed on a main surface of the light emitting element; and
a second electrode, disposed on a back surface of the light emitting element, wherein
the second electrode of the light emitting element is electrically connected to the driving circuit through the first mounting portion, the conductive via layer, the second conductive layer, and the second mounting portion.

2 . The photosensor of claim 1 , wherein the driving circuit includes a plurality of switching elements connected in series between the second electrode of the light emitting element and a ground terminal.

3 . The photosensor of claim 1 , wherein
the first mounting portion and the second mounting portion are physically cut by the groove, the first mounting portion is arranged in a first region of the substrate defined by the groove, the second mounting portion is arranged in a second region of the substrate defined by the groove, the light emitting element is connected to the first mounting portion by a first wire, and the IC is connected to the second mounting portion by a second wire.

4 . The photosensor of claim 1 , wherein
the first mounting portion and the second mounting portion are physically cut by the groove, the first mounting portion is arranged in a first region of the substrate defined by the groove, the second mounting portion is arranged in a second region of the substrate defined by the groove, the light emitting element is connected to the first mounting portion by a first wire, and the IC is connected to the second mounting portion by a second wire.

5 . The photosensor of claim 2 , wherein
the first mounting portion and the second mounting portion are physically cut by the groove, the first mounting portion is arranged in a first region of the substrate defined by the groove, the second mounting portion is arranged in a second region of the substrate defined by the groove, the light emitting element is connected to the first mounting portion by a first wire, and the IC is connected to the second mounting portion by a second wire.

6 . The photosensor of claim 3 , wherein
the second conductive layer includes:
a first conductive pattern, supplied with a first power supply voltage; and
a second conductive pattern, supplied with a second power supply voltage less than the first power supply voltage,
the first power supply voltage is supplied from the first conductive pattern to the first mounting portion through a first via conductor disposed in the first region of the substrate, and the second power supply voltage is supplied from the second conductive pattern to the second mounting portion through a second via conductor disposed in the second region of the substrate.

7 . The photosensor of claim 4 , wherein
the second conductive layer includes:
a first conductive pattern, supplied with a first power supply voltage; and
a second conductive pattern, supplied with a second power supply voltage less than the first power supply voltage,
the first power supply voltage is supplied from the first conductive pattern to the first mounting portion through a first via conductor disposed in the first region of the substrate, and the second power supply voltage is supplied from the second conductive pattern to the second mounting portion through a second via conductor disposed in the second region of the substrate.

8 . The photosensor of claim 3 , wherein
the first region is less than ⅕ of an area of the main surface of the substrate, and the second region is greater than ⅘ of the area of the main surface of the substrate.

9 . The photosensor of claim 6 , wherein
the first region is less than ⅕ of an area of the main surface of the substrate, and the second region is greater than ⅘ of the area of the main surface of the substrate.

10 . The photosensor of claim 1 , wherein
the first mounting portion includes:
a first element-side conductive pattern, including an element placement region on which the second electrode of the light emitting element is mounted; and
a second element-side conductive pattern, including a wire bonding region connected by a wire to the first electrode of the light emitting element,
the second mounting portion includes a plurality of circuit-side conductive patterns including a plurality of circuit placement regions and a plurality of wire bonding regions, the IC is mounted in a rectangular placement region including the plurality of circuit placement regions, the plurality of wire bonding regions are connected to a plurality of pads of the IC by a plurality of wires, the wire bonding region of the second element-side conductive pattern and the plurality of wire bonding regions of the plurality of circuit-side conductive patterns are arranged along one side of the substrate.

11 . The photosensor of claim 10 , wherein the substrate has a rectangular shape in the plan view, and one side of the substrate is a longer side of the substrate.

12 . A photosensor, comprising:
a substrate; a first conductive layer, disposed on a main surface of the substrate; a second conductive layer, disposed on a back surface of the substrate; a conductive via layer, disposed between the first conductive layer and the second conductive layer; a light emitting element, mounted on the first conductive layer; an integrated circuit (IC), mounted on the first conductive layer and including a light receiving element; and a covering member being translucent, disposed on the substrate, covering the light emitting element and the IC together with the first conductive layer, and including a groove between the light emitting element and the IC in a plan view of the substrate wherein the first conductive layer includes:
a first mounting portion, on which the light emitting element is mounted; and
a second mounting portion, on which the IC is mounted, and
the light emitting element is electrically connected to the IC through the first mounting portion, the conductive via layer, the second conductive layer and the second mounting portion, wherein the conductive via layer penetrates the substrate.

13 . The photosensor of claim 1 , wherein
the covering member includes:
a first covering portion, covering the light emitting element; and
a second covering portion, covering the IC, and
the first covering portion and the second covering port

Assignees

• Rohm Co Ltd

Inventors

• Masaki Takaaki

Classifications

• H10F77/50 Primary

  Encapsulations or containers (for photovoltaic modules H10F19/80) · CPC title

• H01S5/04256

  characterised by the configuration · CPC title

• H01S5/183

  having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] · CPC title

• H10F55/255

  formed in, or on, a common substrate · CPC title

• H01S5/0262

  Photo-diodes, e.g. transceiver devices, bidirectional devices (H01S5/0265 takes precedence) · CPC title