Apparatus and method for treating substrate

Patent metadata

Field	Value
Publication number	US-12506018-B2
Application number	US-202418407848-A
Country	US
Kind code	B2
Filing date	Jan 9, 2024
Priority date	Oct 7, 2019
Publication date	Dec 23, 2025
Grant date	Dec 23, 2025

Abstract

The apparatus includes a support unit to support the substrate in a treatment space of a process chamber, a first fluid supply unit to supply a supercritical fluid having an organic solvent dissolved in the supercritical fluid, to the treatment space, a second fluid supply unit to supply the supercritical fluid having no organic solvent dissolved in the supercritical fluid, to the treatment space, an exhaust unit to exhaust the treatment space, a controller to control the first fluid supply unit, the second fluid supply unit, and the exhaust unit. The controller controls the first and second fluid supply units such that the supercritical fluid having no organic solvent dissolved in the supercritical fluid is supplied to the treatment space through the second fluid supply unit, after the supercritical fluid mixed with the organic solvent is supplied to the treatment space through the first fluid supply unit.

First claim

What is claimed is:

1 . A method for treating a substrate, the method comprising:
performing a liquid treatment process for the substrate by supplying a first organic solvent onto the substrate in a liquid treating device; carrying the substrate from the liquid treating device to a supercritical device; and performing a drying process to remove the first organic solvent remaining on the substrate in the supercritical device, wherein the drying process comprises
supplying a supercritical fluid having a second organic solvent dissolved therein to a treatment space after introducing the substrate into the treatment space inside the supercritical device, and
subsequently, supplying the supercritical fluid having no organic solvent dissolved therein to the treatment space.

2 . The method of claim 1 , wherein the method further comprising:
pressurizing the treatment space by supplying the supercritical fluid after the substrate is introduced into the treatment space; treating the substrate using the supercritical fluid by supplying the supercritical fluid to the treatment space; and reducing pressure by exhausting the supercritical fluid out of the treatment space after the substrate is treated, wherein the supplying the supercritical fluid having the second organic solvent dissolved therein to the treatment space is performed in the pressurizing the treatment space.

3 . The method of claim 2 , wherein the supplying the supercritical fluid having no organic solvent dissolved therein to the treatment space is performed in the treating the substrate using the supercritical fluid.

4 . The method of claim 1 , wherein the supercritical fluid is carbon dioxide (CO 2 ).

5 . The method of claim 1 , wherein the first organic solvent and the second organic solvent are isopropyl alcohol (IPA).

6 . A method for treating a substrate, the method comprising:
performing a liquid treatment process on the substrate; and performing a drying process on the substrate to remove a liquid remaining on the substrate after the liquid treatment process, the drying process comprising
sequentially performing pressurizing a treatment space by supplying a supercritical fluid after the substrate is introduced into the treatment space,
treating the substrate using the supercritical fluid by supplying the supercritical fluid to the treatment space, and
reducing pressure by exhausting the supercritical fluid out of the treatment space after the substrate is completely treated,
wherein the supercritical fluid and an organic solvent are simultaneously supplied to the treatment space in the pressurizing the treatment space.

7 . The method of claim 6 , wherein the pressurizing includes:
supplying the organic solvent to the treatment space in a state that the organic solvent is dissolved in the supercritical fluid.

8 . The method of claim 6 , wherein the treating includes:
supplying only the supercritical fluid to the treatment space, without the organic solvent.

9 . The method of claim 6 , wherein the pressurizing includes:
adjusting a mixing ratio of the supercritical fluid supplied to the treatment space and having the organic solvent, which is dissolved in the supercritical fluid, such that the organic solvent is provided to be 1 wt % or less in the treatment space.

10 . The method of claim 6 , wherein the supercritical fluid is carbon dioxide (CO 2 ).

11 . The method of claim 6 , wherein the organic solvent is isopropyl alcohol (IPA).

12 . A method for treating a substrate, the method comprising:
treating the substrate with an organic solvent; and drying the substrate after the treating by removing the organic solvent, which remains on the substrate, by supplying a supercritical fluid onto the substrate, wherein the removing comprises simultaneously supplying the supercritical fluid and the organic solvent to a treatment space.

13 . The method of claim 12 , wherein the treating of the substrate includes:
introducing the substrate into the treatment space; and supplying, to the treatment space, the supercritical fluid having the organic solvent dissolved in the supercritical fluid.

14 . The method of claim 12 , further comprising:
introducing the substrate into the treatment space; supplying, to the treatment space, the supercritical fluid having the organic solvent dissolved in the supercritical fluid; and supplying the supercritical fluid having no organic solvent dissolved in the supercritical fluid to the treatment space.

15 . The method of claim 14 , further comprising:
supplying, to the treatment space, the supercritical fluid having the organic solvent dissolved in the supercritical fluid, after the organic solvent is dissolved in the supercritical fluid outside the treatment space.

16 . The method of claim 14 , further comprising:
adjusting a mixing ratio of the supercritical fluid supplied to the treatment space and having the organic solvent dissolved in the supercritical fluid such that the organic solvent is provided to 1 wt % or less in the treatment space.

17 . The method of claim 12 , wherein the treating of the substrate is performed by repeatedly supplying the supercritical fluid to the treatment space and exhausting the treatment space.

18 . The method of claim 12 , wherein the supercritical fluid is carbon dioxide (CO 2 ).

19 . The method of claim 12 , wherein the organic solvent is isopropyl alcohol.

20 . The method of claim 1 , wherein the first organic solvent and the second organic solvent are a same kind of organic solvent.

Assignees

• Semes Co Ltd

Inventors

• Lim Eui Sang
• Lee Young Hun
• Jung Jinwoo
• PARK Miso
• Ahn Byongwook
• Lee Yong Hee

Classifications

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P70/15

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0406 Primary

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title