Thermal management systems for electronic devices and related methods

Patent metadata

Field	Value
Publication number	US-12504797-B2
Application number	US-202217712010-A
Country	US
Kind code	B2
Filing date	Apr 1, 2022
Priority date	Apr 1, 2022
Publication date	Dec 23, 2025
Grant date	Dec 23, 2025

Abstract

Thermal Management Systems for electronic devices and related methods are disclosed. An example electronic housing includes a housing defining a cavity, electronics in the cavity, and a touch display over the electronics. A heat spreader has a first surface toward the electronics and a second surface opposite the first surface toward the touch display, where the heat spreader is to dissipate heat generated by the electronics. A glass cover is coupled to the housing and has a first side toward the touch display and a second side opposite the first side, where the glass cover is exposed external to the housing. An insulation layer is between the second surface of the heat spreader and the second side of the glass cover to restrict heat transfer from the electronics to the second side of the glass cover.

First claim

What is claimed:

1 . An electronic device comprising:
a housing defining a cavity; electronics in the cavity; a display over the electronics; a heat spreader having a first surface toward the electronics and a second surface opposite the first surface toward the display, the heat spreader to dissipate heat generated by the electronics; a glass cover coupled to the housing and having a first side toward the display and a second side opposite the first side, the glass cover exposed externally to the housing; and an insulation layer between the second surface of the heat spreader and the second side of the glass cover to restrict heat transfer from the electronics to the second side of the glass cover.

2 . The electronic device of claim 1 , wherein the insulation layer is defined by a vacuum chamber between the first side and the second side of the glass cover.

3 . The electronic device of claim 2 , wherein the glass cover includes support structures in the vacuum chamber of the glass cover.

4 . The electronic device of claim 1 , wherein the insulation layer is between the display and a display heat shield, the display heat shield between the electronics and the display.

5 . The electronic device of claim 1 , wherein the insulation layer is a vacuum pad.

6 . The electronic device of claim 5 , wherein the vacuum pad includes a vacuum chamber.

7 . The electronic device of claim 1 , wherein the insulation layer defines a vacuum chamber having a pressure that is less than atmospheric pressure.

8 . The electronic device of claim 1 , wherein the insulation layer includes a gas-filled chamber.

9 . The electronic device of claim 8 , wherein the gas-filled chamber includes at least one of argon, nitrous oxide, carbon dioxide, krypton, or xenon.

10 . An electronic device comprising:
a housing defining a cavity; a semiconductor package; a heat spreader, the heat spreader to dissipate heat generated by the semiconductor package; one or more displays; a display heat shield between the semiconductor package and at least one of the one or more displays; and a glass cover over at least one of the one or more displays, the glass cover including an insulation layer to reduce heat generated by the semiconductor package from spreading to the glass cover.

11 . The electronic device of claim 10 , wherein the insulation layer has an internal pressure that is less than atmospheric pressure.

12 . The electronic device of claim 10 , wherein the insulation layer includes a low thermal conductivity gas.

13 . The electronic device of claim 10 , wherein the glass cover includes:
a first glass; a second glass spaced from the first glass; and an edge seal around a perimeter of the first glass and a perimeter of the second glass to define a chamber between the first glass and the second glass.

14 . The electronic device of claim 13 , including spacers in the chamber to support at least one of the first glass or the second glass when less than atmospheric pressure is present in the chamber.

15 . The electronic device of claim 10 , wherein an air gap is provided between the semiconductor package and the display heat shield.

16 . The electronic device of claim 15 , wherein the air gap is less than approximately 0.4 millimeters and an overall thickness of the housing is less than approximately 6.5 millimeters.

17 . An electronic device comprising:
a first heat spreader; a circuit board; a semiconductor package between the first heat spreader and the circuit board; a ring plate; a second heat spreader, the ring plate between the circuit board and the second heat spreader; and an insulation layer between the circuit board, the ring plate, and the second heat spreader, the insulation layer having an internal pressure less than an atmospheric pressure.

18 . The electronic device of claim 17 , wherein the insulation layer includes a gas.

19 . The electronic device as defined in claim 17 , wherein the insulation layer is a chamber between a first side of the circuit board and an inner surface of the ring plate.

20 . The electronic device as defined in claim 19 , including a plurality of spacers in the chamber.

21 . The electronic device as defined in claim 17 , wherein the insulation layer is a vacuum pad.

Assignees

• Intel Corp

Inventors

• Lim Min Suet
• Ku Jeff
• Tan Fern Nee
• Lang John
• Nagarajan Kavitha
• Shaikh Javed
• Sekar Deepak

Classifications

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• G06F1/1626 Primary

  with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs] · CPC title

• G06F1/1637

  Details related to the display arrangement, including those related to the mounting of the display in the housing · CPC title