Method and apparatus for in-situ thermal management and heat treatment of additively manufacturing components

Patent metadata

Field	Value
Publication number	US-12502825-B2
Application number	US-202017092824-A
Country	US
Kind code	B2
Filing date	Nov 9, 2020
Priority date	Nov 9, 2020
Publication date	Dec 23, 2025
Grant date	Dec 23, 2025

Abstract

Methods for in-situ solution heat treating an additively manufactured metallic component in order to increase the mechanical properties thereof and systems to perform the same. The method can include depositing filler material on a substrate forming a deposition layer, measuring the temperature of a heat affected zone corresponding to the deposition layer, and solution heat treating the deposition layer subsequent to the depositing and proximate to the deposition head. The solution heat treating can include heating the deposition layer to a solution temperature so as to achieve solution heat treatment and controlling the cooling rate of the deposition layer to at or above the critical cooling rate of the filler material until a target temperature is reached. Optionally, the method can include inducing an electron flow in the deposition layer to electromagnetically stir molten filler material in the heat affected zone.

First claim

What is claimed is:

1 . A method of additively manufacturing a metallic component, the method comprising:
a. depositing, using a deposition head operatively controlled by a central processing unit, filler material on a substrate forming a deposition layer; b. measuring, via a temperature sensor controlled by the central processing unit, a temperature of a heat affected zone corresponding to the deposition layer; c. solution heat treating the deposition layer subsequent to the depositing, wherein said solution heat treating comprises: heating the deposition layer using a heat source to a solution temperature so as to achieve solution heat treatment, and using a cooling source, controlling a cooling rate of the deposition layer to at or above the critical cooling rate of the filler material until a target temperature is reached; and d. repeating steps (a)-(c) for multiple deposition layers as the metallic component is being formed; wherein the deposition head, the heat source, and the cooling source are connected so that, when the deposition head, the heat source, and the cooling source move, the deposition head, the heat source, and the cooling source move together, in unison, in relation to the substrate on one side of the metallic component while performing steps (a)-(d).

2 . The method of claim 1 , wherein the filler material is one of: an aluminum alloy, a titanium alloy, a precipitation hardening stainless steel, an austenitic corrosion resistant steel, a martensitic corrosion resistant steel, or a nickel base alloy.

3 . The method of claim 2 , wherein the solution temperature is one of: when the filler material is the aluminum alloy, 850-1025 degrees Fahrenheit; when the filler material is the titanium alloy, 1400-1925 degrees Fahrenheit; when the filler material is the precipitation hardening stainless steel, 1750-1950 degrees Fahrenheit; when the filler material is the austenitic corrosion resistant steel, 1750-2050 degrees Fahrenheit; when the filler material is the martensitic corrosion resistant steel, 1750-1950 degrees Fahrenheit; and when the filler material is the nickel base alloy, 1700-2200 degrees Fahrenheit.

4 . The method of claim 2 , wherein the critical cooling rate is one of: when the filler material is the aluminum alloy, 50-1000 degrees Fahrenheit per second; when the filler material is the titanium alloy, 1-1000 degrees Fahrenheit per second; when the filler material is the precipitation hardening stainless steel, 1-1000 degrees Fahrenheit per second; when the filler material is the austenitic corrosion resistant steel, 1-1000 degrees Fahrenheit per second; when the filler material is the martensitic corrosion resistant steel, 30-1000 degrees Fahrenheit per second; and when the filler material is the nickel base alloy, 1-1000 degrees Fahrenheit per second.

5 . The method of claim 2 , wherein the target temperature is one of: when the filler material is the aluminum alloy, −50 to 200 degrees Fahrenheit; when the filler material is the titanium alloy, 70 to 900 degrees Fahrenheit; when the filler material is the precipitation hardening stainless steel, −100 to 70 degrees Fahrenheit; when the filler material is the austenitic corrosion resistant steel, −100 to 70 degrees Fahrenheit; when the filler material is the martensitic corrosion resistant steel, 70 to 250 degrees Fahrenheit; and when the filler material is the nickel base alloy, 70 to 1000 degrees Fahrenheit.

6 . The method of claim 1 , wherein the temperature sensor controlled by the central processing unit is an infrared pyrometer.

7 . The method of claim 1 further comprising preheating the substrate prior to the depositing the filler material on the substrate.

8 . The method of claim 7 further comprising preheating the filler material prior to the depositing the filler material on the substrate.

9 . The method of claim 1 , wherein the heating the deposition layer to a solution temperature is performed via an induction heater controlled by the central processing unit.

10 . The method of claim 1 , wherein the controlling the cooling rate of the deposition layer includes quenching the deposition layer using a cryogenic spray nozzle controlled by the central processing unit.

11 . The method of claim 1 , further comprising:
inducing, via a voltage source controlled by the central processing unit and via leads attached to the substrate, an electron flow in the deposition layer, wherein the depositing includes forming a heat affected zone in the deposition layer and the substrate including molten filler material, and wherein the inducing the electron flow includes pulsing current from the leads into the substrate to electromagnetically stir the molten filler material in the heat affected zone.

12 . The method of claim 11 further comprising adjusting, via the central processing unit, one of: current density of the voltage source, frequency of a current induced by the voltage source, polarity of the voltage source, or pulsing parameters of the voltage source.

13 . A system for in-situ solution heat treating an additively manufactured component, the system comprising:
a deposition head; a temperature sensor; a heat source; a cooling source; and a central processing unit configured to control the operation of the deposition head, the temperature sensor, the heat source, and the cooling source to perform the method of claim 1 .

14 . The system of claim 13 further comprising a voltage source, wherein the central processing unit is further configured to control the operation of voltage source in order to induce an electron flow in the deposition layer, wherein step (a) includes forming a heat affected zone in the deposition layer and the substrate including molten filler material, and wherein the inducing the electron flow includes electromagnetically stirring the molten filler material in the heat affected zone.

Assignees

• Sprit Aerosystems Inc
• Spirit Aerosys Inc

Inventors

• Nasserrafi Rahbar
• Toivonen Paul R
• Hicks Jr Gerald E
• Klenosky Daniel R

Classifications

• C22F1/002

  by rapid cooling or quenching; cooling agents used therefor · CPC title

• B33Y40/00

  Auxiliary operations or equipment, e.g. for material handling · CPC title

• B22F10/50

  Treatment of workpieces or articles during build-up, e.g. treatments applied to fused layers during build-up · CPC title

• B22F10/30

  Process control · CPC title

• B29C71/02

  Thermal after-treatment {(B29C71/0063 and B29C71/0072 take precedence)} · CPC title