Fabrication apparatus, fabrication method, and recording medium
US-2022402040-A1 · Dec 22, 2022 · US
Lamination fabricating method
US12502711B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12502711-B2 |
| Application number | US-202318177991-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 3, 2023 |
| Priority date | Mar 4, 2022 |
| Publication date | Dec 23, 2025 |
| Grant date | Dec 23, 2025 |
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- Title
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Abstract
Official abstract text for this publication.
A lamination fabricating method includes forming a powder layer including a powder for three-dimensional fabrication, applying a fabrication liquid to the powder layer, repeating the forming of the powder layer and the forming the powder layer to form a fabricated object, and forming a base layer prior to the forming of the powder layer. A powder filling rate of the base layer is higher than a powder filling rate of the powder layer.
First claim
Opening claim text (preview).
The invention claimed is: 1 . A lamination fabricating method, comprising: forming a powder layer including a powder for three-dimensional fabrication; applying a fabrication liquid to the powder layer; repeating the forming of the powder layer and the applying of the fabrication liquid to form a fabricated object; and forming a base layer including the powder on a fabrication stage prior to the forming of the powder layer, wherein the forming of the base layer is repeatedly performed without changing a height of the fabrication stage, and a powder filling rate of the base layer is higher than a powder filling rate of the powder layer. 2 . The lamination fabricating method according to claim 1 , wherein the base layer has an average thickness of 2.0 mm or less. 3 . The lamination fabricating method according to claim 1 , wherein after the forming of the base layer, only the forming of the powder layer is performed, and then the repeating of the forming of the powder layer and the applying of the fabrication liquid is performed to form the fabricated object. 4 . The lamination fabricating method according to claim 1 , wherein the powder filling rate of the base layer is 50% or more and 85% or less. 5 . The lamination fabricating method according to claim 1 , wherein the powder filling rate of the powder layer is 50% or more and 85% or less.
Assignees
Inventors
Classifications
Process control · CPC title
using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber · CPC title
for controlling or regulating additive manufacturing processes · CPC title
for controlling or regulating additive manufacturing processes · CPC title
Processes of additive manufacturing · CPC title
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Frequently asked questions
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- What does patent US12502711B2 cover?
- A lamination fabricating method includes forming a powder layer including a powder for three-dimensional fabrication, applying a fabrication liquid to the powder layer, repeating the forming of the powder layer and the forming the powder layer to form a fabricated object, and forming a base layer prior to the forming of the powder layer. A powder filling rate of the base layer is higher than a …
- Who is the assignee on this patent?
- Yamashita Yasuyuki, Takagi Hisataka, Ricoh Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B22F10/14. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 23 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 10 related publications on this page (citations in our corpus or others sharing the same primary CPC).