Oral cavity sensor

Patent metadata

Field	Value
Publication number	US-12502113-B2
Application number	US-202217567575-A
Country	US
Kind code	B2
Filing date	Jan 3, 2022
Priority date	Jul 22, 2019
Publication date	Dec 23, 2025
Grant date	Dec 23, 2025

Abstract

An oral cavity sensor that includes a sensor portion having a flexible first resin layer and a pair of electrode portions on the flexible first resin layer and configured to measure pressure; and a flexible second resin layer covering the pair of electrode portions, wherein the flexible first resin layer is softer than the flexible second resin layer.

First claim

The invention claimed is:

1 . An oral cavity sensor comprising:
a sensor portion that includes a flexible first resin layer and a pair of electrode portions on the flexible first resin layer, the sensor portion being configured to measure pressure; a flexible second resin layer covering the pair of electrode portions; and a porous or mesh adhesive layer between the flexible first resin layer and each of the pair of electrode portions, wherein the flexible first resin layer is softer than the flexible second resin layer.

2 . The oral cavity sensor according to claim 1 , wherein the flexible second resin layer is configured as a cover member that is removable from the sensor portion.

3 . The oral cavity sensor according to claim 2 , wherein the cover member covers a side surface of the sensor portion that extends in a direction orthogonal to a stacking direction of the sensor portion.

4 . The oral cavity sensor according to claim 1 , wherein the flexible first resin layer is thinner than the flexible second resin layer.

5 . The oral cavity sensor according to claim 1 , wherein the flexible first resin layer has a larger compressive strain than the flexible second resin layer.

6 . The oral cavity sensor according to claim 1 , wherein the flexible first resin layer has a larger elongation than the flexible second resin layer.

7 . The oral cavity sensor according to claim 1 , wherein the flexible first resin layer has a smaller Young's modulus than the flexible second resin layer.

8 . The oral cavity sensor according to claim 1 , wherein the sensor portion configured to measure the pressure is a capacitive sensor portion.

9 . The oral cavity sensor according to claim 1 , further comprising a load distribution plate between the pair of electrode portions and the flexible second resin layer.

10 . The oral cavity sensor according to claim 9 , wherein the load distribution plate is harder than the flexible second resin layer.

11 . The oral cavity sensor according to claim 1 , wherein the flexible first resin layer has a higher relative permittivity than the flexible second resin layer.

12 . The oral cavity sensor according to claim 1 , wherein the flexible first resin layer and the flexible second resin layer are softer than a human tooth.

13 . The oral cavity sensor according to claim 1 , wherein the flexible second resin layer has a hardness of A10 to A50.

14 . The oral cavity sensor according to claim 1 , wherein the flexible first resin layer has a hardness of E53 or less.

15 . The oral cavity sensor according to claim 1 , wherein the pair of electrodes are respectively arranged on opposed main surfaces of the flexible first resin layer, and the flexible second resin layer is two flexible second resin layers that each cover a respective electrode portion of the pair of electrode portions.

16 . The oral cavity sensor according to claim 1 , wherein the pair of electrodes are comb-like electrodes arranged on a first main surface of the flexible first resin layer.

17 . The oral cavity sensor according to claim 1 , wherein the flexible second resin layer is made of silicone rubber, and the flexible first resin layer is made of an acrylic resin, a urethane resin, a silicone resin, a styrene resin, or a polyamide resin.

Assignees

• Murata Manufacturing Co

Inventors

• Takagi Jun
• Imoto Yuki
• Takahashi Tomoki

Classifications

• H05K2201/10151

  Sensor · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K1/0313

  Organic insulating material · CPC title

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title