Controlled-force thermal management device installation

Patent metadata

Field	Value
Publication number	US-12501585-B2
Application number	US-202217826864-A
Country	US
Kind code	B2
Filing date	May 27, 2022
Priority date	Oct 21, 2021
Publication date	Dec 16, 2025
Grant date	Dec 16, 2025

Abstract

Systems and methods for controlled-force thermal management device installation that helps thermal management of emerging, next-generation devices are provided. A system includes a mounting assembly for a thermal management device. The mounting assembly includes a fastener and a coupler. The system further includes a compression and locking interface configured to lock with the coupler and compress the mounting assembly to a predetermined loading point using a controlled force. The fastener is installed when the mounting assembly is at the predetermined loading point.

First claim

What is claimed is:

1 . A system comprising:
a mounting assembly for a thermal management device, the mounting assembly including a fastener and a coupler; and a compression and locking interface that comprises a main body with rails that define an aperture and that locks with the coupler while compressing the mounting assembly to a predetermined loading point by a controlled force such that the fastener is installed when the mounting assembly is at the predetermined loading point.

2 . The system of claim 1 , wherein the fastener is spring-loaded, and wherein a spring of the fastener compresses to the predetermined loading point while locked with the coupler prior to the fastener being secured therein.

3 . The system of claim 2 , wherein the fastener is inserted through at least one of a first installation hole of the thermal management device or a second hole of a printed circuit board to attach the thermal management device to the printed circuit board.

4 . The system of claim 2 , wherein the coupler is an annular bushing that houses the spring of the fastener and has an external annular rim, and wherein the compression and locking interface has at least one internal rail that is configured to latch to a portion of the external annular rim.

5 . The system of claim 1 , wherein the compression and locking interface retracts from the mounting assembly after the fastener is installed.

6 . The system of claim 1 , further comprising:
a driving mechanism connected to the compression and locking interface and is configured to drive the compression and locking interface, at the controlled force.

7 . The system of claim 6 , wherein the driving mechanism is connected to the compression and locking interface and continuously drives the compression and locking interface at the controlled force until a target mounting force is reached.

8 . A system comprising:
a mounting assembly for a thermal management device, the mounting assembly including a fastener and a coupler; and a compression and locking interface that locks with the coupler and compresses the mounting assembly to a predetermined loading point such that the fastener is installed when the mounting assembly is at the predetermined loading point, wherein the compression and locking interface comprises:
a pusher configured to lock with the coupler and compress the mounting assembly based on a controlled force; and
a driver, nested inside the pusher, configured to install the fastener when the predetermined loading point is reached.

9 . The system of claim 8 , wherein the driver is integrally formed with the pusher and freely rotates within the pusher.

10 . The system of claim 8 , wherein the pusher is a hollow cylinder configured to provide a vertical controlled mounting force and is positioned collinearly to the fastener.

11 . The system of claim 8 , wherein the fastener is spring-loaded with a spring, and wherein the spring of the fastener compresses to the predetermined loading point while the pusher is locked with the coupler prior to the fastener being secured therein.

12 . The system of claim 8 , wherein the fastener is configured to be inserted through at least one of a first installation hole of the thermal management device or a second hole of a printed circuit board to attach the thermal management device to the printed circuit board.

13 . The system of claim 8 , wherein the mounting assembly is embedded into a cavity in the thermal management device and the pusher is configured to fit into the cavity to lock with the coupler.

14 . The system of claim 8 , wherein the coupler is an annular bushing that houses a spring for the fastener and the pusher includes at least one internal rail that latches to a portion of an external annular rim of the coupler from above.

15 . A method for securing a thermal management device onto a printed circuit board using a system, the method comprising:
providing the system having a mounting assembly that includes a fastener and a coupler and a compression and locking interface that includes a main body with rails that define an aperture; locking, by the compression and locking interface, with the coupler of the mounting assembly for the thermal management device; compressing, by the compression and locking interface, the mounting assembly to a predetermined loading point based on a controlled force; and installing the fastener of the mounting assembly into an installation hole in the thermal management device when the mounting assembly is at the predetermined loading point to secure the thermal management device onto the printed circuit board.

16 . The method of claim 15 , wherein the compression and locking interface compresses the mounting assembly after locking with the coupler.

17 . The method of claim 15 , wherein the fastener is spring-loaded, and compressing the mounting assembly includes:
compressing the mounting assembly until a spring of the fastener compresses to the predetermined loading point while being locked with the coupler.

18 . The method of claim 17 , wherein installing the fastener of the mounting assembly includes:
inserting the fastener through the installation hole of the thermal management device and through another hole of the printed circuit board to attach the thermal management device to the printed circuit board.

19 . The method of claim 17 , wherein the coupler is an annular bushing that houses the spring of the fastener and has an external annular rim, and wherein locking with the coupler of the mounting assembly includes:
latching at least one internal rail of the compression and locking interface to a portion of the external annular rim.

20 . The method of claim 15 , wherein locking with the coupler of the mounting assembly includes locking, by a pusher of the compression and locking interface, with the coupler,
wherein installing the fastener includes installing the fastener by a driver of the compression and locking interface when the predetermined loading point is reached, the driver being nested inside the pusher.

21 . The method of claim 20 , wherein installing the fastener further includes:
freely rotating the driver within the pusher to install the fastener.

22 . The method of claim 20 , wherein the pusher is a hollow cylinder positioned collinearly to the fastener, and compressing the mounting assembly includes:
providing a vertical controlled mounting force to the mounting assembly.

23 . The method of claim 20 , wherein the mounting assembly is embedded into a cavity in the thermal management device, and the method further comprising:
inserting the pusher into the cavity in the thermal management device to lock with the coupler.

Assignees

• Cisco Tech Inc

Inventors

• Twiss Robert Gregory

Classifications

• H10W40/625

  Clamping parts not primarily conducting heat · CPC title

• H10W40/611 Primary

  Bolts or screws · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H05K13/0882

  Control systems for mounting machines or assembly lines, e.g. centralized control, remote links, programming of apparatus and processes as such (H05K13/083 takes precedence) · CPC title

• G05D15/00

  Control of mechanical force or stress; Control of mechanical pressure · CPC title