LED display unit group and display panel

Patent metadata

Field	Value
Publication number	US-12495651-B2
Application number	US-202117910295-A
Country	US
Kind code	B2
Filing date	Mar 25, 2021
Priority date	Mar 31, 2020
Publication date	Dec 9, 2025
Grant date	Dec 9, 2025

Abstract

Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units. The circuit board includes N metal wiring layers stacked in sequence and an insulating plate disposed between adjacent metal wiring layers, and the N metal wiring layers are electrically connected through conductive vias on the insulating plate. The pixel units are arranged in an array of m rows and n columns and disposed on the circuit board. Each pixel unit includes at least two LED light-emitting chips with different emitted colors, each LED light-emitting chip is fixed on a first metal wiring layer. The first metal wiring layer includes m common A-electrode pads, A-electrode pads, and B-electrode pads. All the A-electrode pads corresponding to each row of pixel units are integrally formed with and electrically connected to one corresponding common A-electrode pad.

First claim

What is claimed is:

1 . A light-emitting diode (LED) display unit group, comprising:
a circuit board comprising N metal wiring layers stacked in sequence and at least one insulating plate, wherein each of the at least one insulating plate is disposed between adjacent metal wiring layers among the N metal wiring layers, the N metal wiring layers are electrically connected through conductive vias on the at least one insulating plate, and N≥2; and pixel units arranged in an array of m rows and n columns and disposed on the circuit board, wherein each of the pixel units comprises at least two LED light-emitting chips with different emitted colors, each of the at least two LED light-emitting chips is fixed on a first metal wiring layer among the N metal wiring layers, m≥2, and n≥2; wherein the first metal wiring layer comprises m common A-electrode pads, a plurality of A-electrode pads, and a plurality of B-electrode pads, wherein the plurality of A-electrode pads are disposed in one-to-one correspondence with A electrodes of LED light-emitting chips, the plurality of B-electrode pads are disposed in one-to-one correspondence with B electrodes of the LED light-emitting chips, and all A-electrode pads corresponding to each row of pixel units in the pixel units are integrally formed with and electrically connected to one of the m common A-electrode pads corresponding to the each row of pixel units; and each of the m common A-electrode pads comprises at least one bend part, and a bending direction of the at least one bend part of one of the m common A-electrode pads corresponding to a first row of pixel units in the pixel units is opposite to a bending direction of the at least one bend part of one of the m common A-electrode pads corresponding to an m-th row of pixel units in the pixel units; wherein in two adjacent pixel units of the pixel units in a same row, a direction of a connection line from an A electrode to a B electrode of one of the at least two LED light-emitting chips in one of the two adjacent pixel units is opposite to a direction of a connection line from an A electrode to a B electrode of one of the at least two LED light-emitting chips in another one of the two adjacent pixel units.

2 . The LED display unit group of claim 1 , wherein an N-th metal wiring layer among the N metal wiring layers comprises m common A-electrode pins and 3n common B-electrode pins, wherein one of the m common A-electrode pins is electrically connected to one of the m common A-electrode pads corresponding to A electrodes of all LED light-emitting chips in one row of pixel units in the pixel units, and one of the 3n common B-electrode pins is electrically connected to a plurality of B-electrode pads corresponding to B electrodes of all LED light-emitting chips with a same emitted color in one column of pixel units in the pixel units.

3 . The LED display unit group of claim 1 , wherein a plurality of A-electrode pads of one of the pixel units in an i-th column and a row, a plurality of A-electrode pads of one of the pixel units in an (i+1)-th column and the same row, and one of the m common A-electrode pads connected to the plurality of A-electrode pads of the one of the pixel units in the i-th column and the row and the plurality of A-electrode pads of the one of the pixel units in the (i+1)-th column and the same row are U-shaped, wherein i<n.

4 . The LED display unit group of claim 3 , wherein a plurality of B-electrode pads of the one of the pixel units in the i-th column and the row and a plurality of B-electrode pads of the one of the pixel units in the (i+1)-th column and the same row are disposed in a U-shaped opening, wherein i is an odd number.

5 . The LED display unit group of claim 1 , wherein conductive vias electrically connected to a plurality of B-electrode pads corresponding to all the at least two LED light-emitting chips of each of the pixel units are not on a same vertical line.

6 . The LED display unit group of claim 1 , wherein each of the pixel units comprises following three LED light-emitting chips: a LED light-emitting chip with a first emitted color, a LED light-emitting chip with a second emitted color, and a LED light-emitting chip with a third emitted color, wherein the three LED light-emitting chips with different emitted colors are in one-to-one correspondence with three B-electrode pads of the plurality of B-electrode pads, and the three B-electrode pads in one-to-one correspondence with the three LED light-emitting chips with different emitted colors are a first B-electrode pad corresponding to the LED light-emitting chip with the first emitted color, a second B-electrode pad corresponding to the LED light-emitting chip with the second emitted color, and a third B-electrode pad corresponding to the LED light-emitting chip with the third emitted color, respectively.

7 . The LED display unit group of claim 6 , wherein in a case where N=4, a metal wire connecting all first B-electrode pads of each column of pixel units in the pixel units and a metal wire connecting all third B-electrode pads of each column of pixel units in the pixel units are disposed on a third metal wiring layer among the N metal wiring layers.

8 . The LED display unit group of claim 6 , wherein in a case where N=4, a metal wire connecting all second B-electrode pads of each column of pixel units in the pixel units is disposed on a second metal wiring layer among the N metal wiring layers.

9 . The LED display unit group of claim 1 , wherein an identification mark for identifying electrodes of pins is disposed on one of the at least one insulating plate in contact with an N-th metal wiring layer among the N metal wiring layers.

10 . The LED display unit group of claim 2 , wherein an identification mark that is used for identifying electrodes of pins and is made of a same material as the m common A-electrode pins and the 3 n common B-electrode pins is disposed on one of the at least one insulating plate in contact with an N-th metal wiring layer among the N metal wiring layers, and the identification mark is not electrically connected.

11 . The LED display unit group of claim 10 , wherein a distance between every two adjacent ones of the identification mark, the m common A-electrode pins, and the 3 n common B-electrode pins is the same.

12 . A display panel, comprising a light-emitting diode (LED) display unit group, wherein the LED display unit group comprises:
a circuit board comprising N metal wiring layers stacked in sequence and at least one insulating plate, wherein each of the at least one insulating plate is disposed between adjacent metal wiring layers among the N metal wiring layers, the N metal wiring layers are electrically connected through conductive vias on the at least one insulating plate, and N≥2; and pixel units arranged in an array of m rows and n columns and disposed on the circuit board, wherein each of the pixel units comprises at least two LED light-emitting chips with different emitted colors, each of the at least two LED light-emitting chips is fixed on a first metal wiring layer among the N metal wiring layers, m≥2, and n≥2; wherein the first metal wiring layer comprises m common A-electrode pads, a plurality of A-electrode pads, and a plurality of B-electrode pads, wherein the plurality of A-electrode pads are disposed in one-to-one correspondence with A electrodes of LED light-emitting chips, the plurality of B-electrode pads are disposed in one-to-one correspondence with B electrodes of the LED light-emitting chips, and all A-electrode pads corresponding to each row of pixel units in the pixel units are integrally formed with and electrically connected to

Assignees

• Foshan Nationstar Optoelectronics Co Ltd

Inventors

• Qin Kuai
• Xie Shaojia
• Gu Feng
• Cai Bin
• Fan Kailiang
• Peng Zhuang

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H29/142

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title

• H10H20/831

  characterised by their shape · CPC title

• H10H20/857 Primary

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/0364

  of interconnections · CPC title