Module and component

Patent metadata

Field	Value
Publication number	US-12495485-B2
Application number	US-202218060007-A
Country	US
Kind code	B2
Filing date	Nov 30, 2022
Priority date	Jun 10, 2020
Publication date	Dec 9, 2025
Grant date	Dec 9, 2025

Abstract

A module includes: a substrate including a first surface and including first and second sides; a component as a first component mounted on the first surface; a first sealing resin arranged to cover the first surface and the first component; and a first shield film. An inclined portion is formed in the substrate. The substrate includes a first lead electrode arranged to be exposed to the inclined portion along the first side, and a second lead electrode arranged to be exposed to the inclined portion along the second side, and each of these is connected to the first shield film. A height of the second lead electrode is different from a height of the first lead electrode.

First claim

The invention claimed is:

1 . A module comprising:
a substrate including a first surface and including first and second sides; a first component mounted on the first surface; a first sealing resin arranged to cover the first surface and the first component; and a first shield film covering upper and side surfaces of the first sealing resin and at least a part of a side surface of the substrate, wherein when viewed in a cross section taken along a plane perpendicular to the first surface, an inclined portion is provided in the substrate, the substrate includes a first lead electrode arranged to be exposed to the inclined portion along the first side, and a second lead electrode arranged to be exposed to the inclined portion along the second side, each of the first lead electrode and the second lead electrode is connected to the first shield film, a position of the inclined portion in a height direction along the second side is different from a position of the inclined portion in a height direction along the first side, the first side and the second side are perpendicular to each other in a plan view, each of the first lead electrode and the second lead electrode has a film shape parallel to the first surface, and no via conductor connecting to each of the first lead electrode and the second lead electrode is exposed to the inclined portion.

2 . The module according to claim 1 , wherein
when viewed in the cross section, the inclined portion has a downward convex curved shape.

3 . The module according to claim 2 , wherein
at least one of the first lead electrode and the second lead electrode is exposed to a lower end of the inclined portion.

4 . The module according to claim 1 , wherein
the substrate includes a second surface as a surface opposite to the first surface, and a second component is mounted on the second surface.

5 . The module according to claim 4 , further comprising
a second sealing resin arranged to cover the second surface and the second component, wherein the first shield film further covers a side surface of the second sealing resin.

6 . A module comprising:
a substrate including a first surface and a second surface facing opposite to the first surface, and including first and second sides; a first component mounted on the first surface; a first sealing resin arranged to cover the first surface and the first component; a first shield film covering upper and side surfaces of the first sealing resin and a part of a side surface of the substrate; a second sealing resin arranged to cover the second surface; and a second shield film covering another part of the side surface of the substrate, wherein when viewed in a cross section taken along a plane perpendicular to the first surface, the substrate includes a first inclined portion provided on an area of the substrate closer to the first surface and a second inclined portion provided on an area of the substrate closer to the second surface, the substrate includes a first lead electrode arranged to be exposed to the first inclined portion along the first side, and a second lead electrode arranged to be exposed to the second inclined portion along the second side, the first shield film covers the first inclined portion, the first lead electrode is connected to the first shield film, the second shield film covers the second inclined portion, the second lead electrode is connected to the second shield film, a position of the first inclined portion in a height direction along the second side is different from a position of the first inclined portion in a height direction along the first side, the first side and the second side are perpendicular to each other in a plan view, and each of the first lead electrode and the second lead electrode has a film shape parallel to the first surface, and no via conductor connecting to each of the first lead electrode and the second lead electrode is exposed to the inclined portion.

7 . The module according to claim 6 , wherein
the first shield film and the second shield film are spaced apart from each other.

8 . A component comprising:
a base member including a first surface and including first and second sides; and a shield film covering at least a side surface of the base member, wherein when viewed in a cross section taken along a plane perpendicular to the first surface, an inclined portion is provided, the base member includes a first lead electrode arranged to be exposed to the inclined portion along the first side, and a second lead electrode arranged to be exposed to the inclined portion along the second side, each of the first lead electrode and the second lead electrode is connected to the shield film, a position of the inclined portion in a height direction along the second side is different from a position of the inclined portion in a height direction along the first side, the first side and the second side are perpendicular to each other in a plan view, each of the first lead electrode and the second lead electrode has a film shape parallel to the first surface, and no via conductor connecting to each of the first lead electrode and the second lead electrode is exposed to the inclined portion.

9 . The module according to claim 2 wherein
the substrate includes a second surface as a surface opposite to the first surface, and a second component is mounted on the second surface.

10 . The module according to claim 3 , wherein
the substrate includes a second surface as a surface opposite to the first surface, and a second component is mounted on the second surface.

Assignees

• Murata Manufacturing Co

Inventors

• Otsubo Yoshihito
• Hatase Minoru

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W42/20

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/014

  using batch processing · CPC title