Techniques for controlling overburden planarization
US-2024151971-A1 · May 9, 2024 · US
US12493138B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12493138-B2 |
| Application number | US-202217654860-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 15, 2022 |
| Priority date | Mar 17, 2021 |
| Publication date | Dec 9, 2025 |
| Grant date | Dec 9, 2025 |
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Embodiments of the present disclosure generally relate to encapsulated optical devices and methods of forming encapsulated optical devices. The optical devices include a plurality of optical device structures disposed on a substrate. An encapsulation coating is disposed over the plurality of optical device structures. The encapsulation coating includes a ratio of encapsulation material to solvent. A plurality of gaps are formed in the optical device. The plurality of gaps are formed when the solvent is evaporated from the encapsulation coating. The material composition of the encapsulation coating, the width and device angle of the plurality of optical device structures, as well as process parameters of the spin on coating process, the curing process, the baking process, the drying process, and the developing process will affect the formation of the plurality of gaps and the depth at which the plurality of gaps are formed.
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What is claimed is: 1 . An optical device formed by a method, comprising: disposing an encapsulation coating over a first substrate, over a plurality of optical device structures, and between adjacent optical device structures of the plurality of optical device structures, wherein the encapsulation coating fills an entire area between each of the adjacent optical device structures, the encapsulation coating including a material composition with a ratio of an encapsulation material to a solvent of about 1:10 to about 1:1; and forming a plurality of gaps, the plurality of gaps defined by the adjacent optical device structures of the plurality of optical device structures, the first substrate, and the encapsulation coating, the forming of the plurality of gaps including evaporating the solvent from the encapsulation coating such that between each of the adjacent optical device structures, the plurality of gaps have a depth from a lower surface of the encapsulation coating to the first substrate. 2 . The optical device of claim 1 , wherein a difference of a refractive index of a device material of the plurality of optical device structures and a refractive index of the material composition of the encapsulation coating is about 0.6 to about 1.0 and a difference of the refractive index of the device material of the plurality of optical device structures and a refractive index of air disposed in the plurality of gaps is about 1.0 to about 1.6. 3 . The optical device of claim 1 , wherein the encapsulation coating is an anti-reflective coating layer. 4 . A method, comprising: disposing a first encapsulation coating over a first substrate, over a plurality of optical device structures, and between adjacent optical device structures of the plurality of optical device structures, wherein the first encapsulation coating fills an entire area between each of the optical device structures, the first encapsulation coating including a material composition with a ratio of an encapsulation material to a solvent of about 1:10 to about 1:1; and forming a plurality of gaps, the plurality of gaps defined by the adjacent optical device structures of the plurality of optical device structures, the first substrate, and the first encapsulation coating, the forming of the plurality of gaps including evaporating the solvent from the first encapsulation coating such that between each of the adjacent optical device structures the plurality of gaps have a depth from a lower surface of the first encapsulation coating to the first substrate. 5 . The method of claim 4 , wherein the depth is between 10% and 100% of a height of each optical device structure. 6 . The method of claim 5 , further comprising depositing a second encapsulation coating over a second substrate, wherein increasing a concentration of solvent in the second encapsulation coating increases a second depth of a second plurality of gaps relative to the plurality of gaps of the first substrate. 7 . The method of claim 5 , further comprising depositing a second encapsulation coating over a second substrate, wherein decreasing a concentration of solvent in the second encapsulation coating decreases a second depth of a second plurality of gaps relative to the plurality of gaps of the first substrate. 8 . The method of claim 4 , further comprising exposing the first encapsulation coating to ultraviolet (UV) radiation in a curing process, the curing process performed with a dosage of about 0.05 J/cm 2 to about 10 J/cm 2 . 9 . The method of claim 4 , further comprising baking the first encapsulation coating at a temperature between about 50° C. and about 200° C. 10 . The method of claim 4 , further comprising rotating the first substrate at a rotation rate of between about 500 rpm and about 4000 rpm. 11 . The method of claim 4 , wherein the first encapsulation coating is an anti-reflective coating layer. 12 . The method of claim 4 , wherein air disposed in the plurality of gaps has a refractive index of about 1.0, a device material of the plurality of optical device structures has a refractive index between about 2.0 to about 2.6, and the material composition has a refractive index of about 1.4 to about 2.0. 13 . The method of claim 4 , wherein cross-sections of the plurality of optical device structures include circular, triangular, and elliptical shaped cross-sections. 14 . The method of claim 1 , further comprising rotating the first substrate at a rotation rate to increase or decrease the depth of the plurality of gaps. 15 . The method of claim 14 , wherein the rotation rate is between about 500 rpm and about 4000 rpm. 16 . The method of claim 1 , wherein the encapsulation coating and the solvent have different viscosities. 17 . The method of claim 16 , wherein a viscosity of the encapsulation coating is between about 10 centipoise (cP) and about 10,000 cP, and a viscosity of the solvent is less than about 10 cP. 18 . The method of claim 4 , further comprising rotating the first substrate at a rotation rate to increase or decrease the depth of the plurality of gaps. 19 . The method of claim 4 , wherein the first encapsulation coating and the solvent have different viscosities. 20 . The method of claim 19 , wherein a viscosity of the first encapsulation coating is between about 10 centipoise (cP) and about 10,000 cP, and a viscosity of the solvent is less than about 10 cP.
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