Material for locating gas leak, method for locating gas leak, material for repairing gas leak, method for repairing gas leak, and device for repairing gas leak

Patent metadata

Field	Value
Publication number	US-12492268-B2
Application number	US-202117907294-A
Country	US
Kind code	B2
Filing date	Mar 4, 2021
Priority date	Mar 27, 2020
Publication date	Dec 9, 2025
Grant date	Dec 9, 2025

Abstract

Provided is a gas leak locating material used for locating a gas leaking position by application thereof at a position suspected to have a gas leak. The gas leak locating material satisfies the following formula: A/B≥21.0, where A represents a viscosity (Pa·s) of the gas leak locating material at 25° C. at a shear rate of 0.1 s −1 and B represents a viscosity (Pa·s) of the gas leak locating material at 25° C. at a shear rate of 10 s −1 . The gas leak locating material has an elastic modulus E′ of 10 MPa or higher at 50° C. after being cured.

First claim

The invention claimed is:

1 . A gas leak locating material used for locating a gas leaking position by application of the gas leak locating material at a position suspected to have a gas leak, wherein
the gas leak locating material contains a curable resin composition containing a polymerizable compound and a polymerization initiator, the gas leak locating material satisfies a formula: A/B≥21.0, where A represents a viscosity (Pa·s) of the gas leak locating material at 25° C. at a shear rate of 0.1 s −1 and B represents a viscosity (Pa·s) of the gas leak locating material at 25° C. at a shear rate of 10 s −1 , and the gas leak locating material has an elastic modulus E′ of 10 MPa or higher at 50° C. after being cured, where the elastic modulus E′ is determined by performing a temperature sweep using a rheometer in tensile mode at a frequency of 10 Hz, with a temperature elevation rate of 10° C./min, over a temperature range from 25° C. through 100° C., on a cured sample of 1 mm thickness.

2 . The gas leak locating material according to claim 1 ,
wherein the viscosity A of the gas leak locating material at 25° C. at the shear rate of 0.1 s −1 is 500 Pa's or higher.

3 . The gas leak locating material according to claim 1 ,
wherein the gas leak locating material further contains a colorant.

4 . The gas leak locating material according to claim 1 ,
wherein the gas leak locating material cures by irradiation with light having a wavelength of 420 nm or shorter.

5 . A gas leak repairing material, comprising:
the gas leak locating material according to claim 1 , wherein the gas leak locating material is used for repairing the gas leaking position.

6 . A gas leak locating method, comprising:
forming a coating film formed of the gas leak locating material according to claim 1 at the position suspected to have the gas leak, and locating a position at which a hole opens in the coating film due to the gas leak as the gas leaking position.

7 . A gas leak repairing method, comprising:
curing the coating film in which the gas leaking position located by the gas leak locating method according to claim 6 is included; and closing the gas leaking position that has been cured, with a gas leak repairing material, and curing the gas leak repairing material, wherein the gas leak repairing material contains a curable resin composition containing a polymerizable compound and a polymerization initiator, the gas leak repairing material satisfies a formula: A/B≥21.0, where A represents a viscosity (Pa's) of the gas leak locating material at 25° C. at a shear rate of 0.1 s −1 and B represents a viscosity (Pa's) of the gas leak locating material at 25° C. at a shear rate of 10 s −1 , and the gas leak locating material has an elastic modulus E′ of 10 MPa or higher at 50° C. after being cured, where the elastic modulus E′ is determined by performing a temperature sweep using a rheometer in tensile mode at a frequency of 10 Hz, with a temperature elevation rate of 10° C./min, over a temperature range from 25° C. through 100° C., on a cured sample of 1 mm thickness.

8 . A gas leak repairing method, comprising:
curing the coating film with a tubular member disposed at the gas leaking position in the coating film in which the gas leaking position located by the gas leak locating method according to claim 6 is included, and filling the tubular member with a gas leak repairing material, subsequently connecting an openable/closable valve in an open state thereof to the tubular member that bores by a gas leaking pressure, and closing the openable/closable valve, wherein the gas leak repairing material contains a curable resin composition containing a polymerizable compound and a polymerization initiator, wherein the gas leak repairing material satisfies a formula: A/B≥21.0, where A represents a viscosity (Pa's) of the gas leak locating material at 25° C. at a shear rate of 0.1 s −1 and B represents a viscosity (Pa's) of the gas leak locating material at 25° C. at a shear rate of 10 s −1 , and the gas leak locating material has an elastic modulus E′ of 10 MPa or higher at 50° C. after being cured, where the elastic modulus E′ is determined by performing a temperature sweep using a rheometer in tensile mode at a frequency of 10 Hz, with a temperature elevation rate of 10° C./min, over a temperature range from 25° C. through 100° C., on a cured sample of 1 mm thickness.

9 . A gas leak repairing device, comprising:
a light source; and a film-shaped member or a tape-shaped member on an emitting side of the light source, the film-shaped member or the tape-shaped member having ultraviolet transmittance, wherein the gas leak repairing material according to claim 5 is attachable on the film-shaped member and the tape-shaped member.

10 . The gas leak repairing device according to claim 9 ,
wherein surfaces of the film-shaped member and the tape-shaped member have releasability.

11 . A gas leak repairing method, comprising:
using the gas leak repairing device according to claim 9 .

12 . The gas leak locating material according to claim 1 ,
wherein the curable resin composition is cured by photo-curing, thermal curing, two-pack mixing, moisture curing, or a combination thereof.

Assignees

• Dexerials Corp

Inventors

• Mori Yasutaka
• Kubota Takaaki
• Abe Tetsuya

Classifications

• F16L55/18

  Appliances for use in repairing pipes (F16L55/10 takes precedence) · CPC title

• F16L55/175 Primary

  by using materials which fill a space around the pipe before hardening · CPC title

• C09B67/0033

  Blends of pigments; Mixtured crystals; Solid solutions · CPC title

• C08F2/44

  Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers · CPC title

• C08F2/50

  with sensitising agents · CPC title