Vapor chamber and manufacturing method of the same
US-2020355444-A1 · Nov 12, 2020 · US
Vapor chamber and manufacturing method thereof
US12490409B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12490409-B2 |
| Application number | US-202217891112-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 18, 2022 |
| Priority date | Apr 25, 2022 |
| Publication date | Dec 2, 2025 |
| Grant date | Dec 2, 2025 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A vapor chamber and a manufacturing method thereof are disclosed. The vapor chamber includes a first housing, multiple supporting columns, a capillary structure, a second housing, a bonding layer, and a working fluid. The first housing includes an inner surface. Each supporting column is disposed on the inner surface of the first housing and includes an end surface. The capillary structure is disposed on the inner surface of the first housing. The second housing is sealed with the first housing correspondingly to jointly define a chamber. The bonding layer is formed between the inner surface of the first housing and the end surfaces of the supporting columns. The working fluid is arranged inside the chamber. Accordingly, it is able to swiftly changing the positions of the supporting columns according to the actual cooling needs, thereby significantly reducing the manufacturing time required.
First claim
Opening claim text (preview).
What is claimed is: 1 . A vapor chamber, comprising: a first housing, comprising a first inner surface; a first capillary structure, disposed on the first inner surface; a second housing, comprising a second inner surface, sealed with the first housing correspondingly to jointly define a chamber; a second capillary structure, disposed on the second inner surface; a plurality of supporting columns disposed in the chamber, each one of the supporting columns comprising a first end surface and a second end surface: a first bonding layer, formed between the first inner surface and entirely the first end surface; a second bonding layer, formed between the second inner surface and the second end surface; a primary cooling zone offset from the center of the vapor chamber and a secondary cooling zone, wherein a distribution density of the supporting columns in the primary cooling zone is greater than a distribution density of the supporting columns in the secondary cooling zone; and a working fluid, arranged inside the chamber, wherein the first capillary structure is a metal mesh comprising a plurality of first through holes, and each one of the first through holes is adapted to sheathe each one of the supporting columns to be fixed on the first inner surface correspondingly; wherein the first bonding layer and a second bonding layer comprise a curing copper paste made of a copper powder base mixing with a bonding agent: wherein the second capillary structure comprises a plurality of second through holes, and each one of the second through holes is adapted to sheathe each one of the supporting columns to be fixed on the second inner surface correspondingly. 2 . The vapor chamber according to claim 1 , wherein each one of the supporting columns further comprises a capillary tissue covering a circumferential surface thereof.
Assignees
Inventors
Classifications
with tubes having a capillary structure · CPC title
Spacing means · CPC title
Reinforcing means · CPC title
Means for filling or sealing heat pipes · CPC title
the conduits having a particular shape, e.g. non-circular cross-section, annular (F28D15/0241, F28D15/0266 take precedence) · CPC title
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- What does patent US12490409B2 cover?
- A vapor chamber and a manufacturing method thereof are disclosed. The vapor chamber includes a first housing, multiple supporting columns, a capillary structure, a second housing, a bonding layer, and a working fluid. The first housing includes an inner surface. Each supporting column is disposed on the inner surface of the first housing and includes an end surface. The capillary structure is d…
- Who is the assignee on this patent?
- Taiwan Microloops Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K7/2029. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 02 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).