Busbar assembly and circuit assembly

Patent metadata

Field	Value
Publication number	US-12489284-B2
Application number	US-202318449097-A
Country	US
Kind code	B2
Filing date	Aug 14, 2023
Priority date	Aug 12, 2022
Publication date	Dec 2, 2025
Grant date	Dec 2, 2025

Abstract

A busbar assembly contains: an electrical busbar having two end faces, a bottom surface, a top surface, and two side faces connecting the bottom surface and the top surface, and a metallic busbar heatsink having a bottom wall and at least two cooling fins extending from the bottom wall. The cooling fins together with the bottom wall forming a receiving space for receiving the busbar and the busbar is arranged in the receiving space in such a manner that at least one of the two side faces of the busbar is in planar contact with one of the cooling fins.

First claim

The invention claimed is:

1 . A busbar assembly, comprising:
an electrical busbar having two end faces, a bottom surface, a top surface and two side faces connecting said bottom surface and said top surface; and a metallic busbar heatsink having a bottom wall and at least two cooling fins extending from said bottom wall, said cooling fins together with said bottom wall forming a receiving space for receiving said electrical busbar, and said electrical busbar disposed in said receiving space such that at least one of said two side faces of said electrical busbar is in planar contact with one of said cooling fins.

2 . The busbar assembly according to claim 1 , further comprising an electrical insulator disposed between one of said cooling fins and at least one of said side faces of said electrical busbar in contact with said one cooling fin.

3 . The busbar assembly according to claim 2 , wherein said electrical insulator is formed from an electrically insulating polymer material applied at least to said cooling fins.

4 . The busbar assembly according to claim 1 , wherein an air gap is present between said bottom surface of said electrical busbar and said bottom wall of said metallic busbar heatsink.

5 . The busbar assembly according to claim 1 , further comprising a heat-conducting foil disposed between at least one of said cooling fins and at least one of said side faces of said electrical busbar in contact with said one cooling fin.

6 . The busbar assembly according to claim 2 , further comprising a fixing element disposed in said receiving space and pushes said electrical busbar laterally toward at least one of said cooling fins and fixes said electrical busbar in position.

7 . The busbar assembly according to claim 6 , wherein said fixing element is integrated into said electrical insulator.

8 . The busbar assembly according to claim 7 , wherein said fixing element is formed as a spring element applying a spring force and is installed in said receiving space under pre-tension.

9 . The busbar assembly according to claim 1 , further comprising a potting compound filling said receiving space.

10 . The busbar assembly according to claim 1 , further comprising a housing having a housing wall, wherein said bottom wall of said metallic busbar heatsink is connected to said housing wall of said housing.

11 . The busbar assembly according to claim 10 , wherein said bottom wall has alignment slots formed therein for aligning said metallic busbar heatsink relative to said housing wall.

12 . The busbar assembly according to claim 10 , further comprising a housing heatsink, wherein said housing wall is connected to said housing heatsink on one side facing away from said bottom wall.

13 . The busbar assembly according to claim 1 , wherein said electrical busbar has a profile that is curved at least in some sections in a longitudinal extension direction and said cooling fins of said metallic busbar heatsink are matched to said profile, namely being curved in at least some sections.

14 . The busbar assembly according to claim 1 , wherein:
said electrical busbar is one of a plurality of electrical busbars; and said at least two cooling fins are two of a plurality of said cooling fins, each two of said cooling fins form a respective said receiving space for a respective one of said electrical busbars, and wherein one of said electrical busbars is disposed in each said receiving space of said metallic busbar heatsink such that at least one of said two side surfaces of said respective electrical busbar is in a planar contact with one of said cooling fins.

15 . The busbar assembly according to claim 14 , wherein said plurality of electrical busbars in said metallic busbar heatsink are disposed next to each other and parallel to each other.

16 . A circuit assembly, comprising:
a first electrical component having a first electrical connection point; a second electrical component having a second electrical connection point; and a busbar assembly, containing:
an electrical busbar having two end faces, a bottom surface, a top surface and two side faces connecting said bottom surface and said top surface; and
a metallic busbar heatsink having a bottom wall and at least two cooling fins extending from said bottom wall, said cooling fins together with said bottom wall forming a receiving space for receiving said electrical busbar, and said electrical busbar disposed in said receiving space such that at least one of said two side faces of said electrical busbar is in planar contact with one of said cooling fins; and
said electrical busbar is electrically connected to said first connection point on a first section and electrically connected to said second connection point on a second section.

Assignees

• Vitesco Tech Gmbh

Inventors

• Decker Michael

Classifications

• H02G5/066

  Devices for maintaining distance between conductor and enclosure · CPC title

• H02G5/04

  Partially-enclosed installations, e.g. in ducts and adapted for sliding or rolling current collection · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H02G5/10 Primary

  Cooling · CPC title

• H01M50/507 Primary

  comprising an arrangement of two or more busbars within a container structure, e.g. busbar modules · CPC title