Electrical connector using tunable hot melt adhesive material

Patent metadata

Field	Value
Publication number	US-12489256-B2
Application number	US-202318332841-A
Country	US
Kind code	B2
Filing date	Jun 12, 2023
Priority date	Jun 12, 2023
Publication date	Dec 2, 2025
Grant date	Dec 2, 2025

Abstract

An electrical connector assembly having a printed circuit board, signal wires, and an impedance mold. The signal wires transmit signals at a determined signal speed. The signal wires have ends which are connected to the printed circuit board. The impedance mold cooperates with the printed circuit and the signal wires. The impedance mold is formed from a tunable hot melt adhesive composition. A dielectric constant of the tunable hot melt adhesive composition is lowered to be compatible with the desired signal performance characteristics of the signals transmitted over the signal wires to the printed circuit board.

First claim

The invention claimed is:

1 . An electrical connector assembly comprising:
a printed circuit board; signal wires for transmitting signals at a determined signal speed, the signal wires having ends which are connected to the printed circuit board; an impedance mold which cooperates with the printed circuit and the signal wires, the impedance mold formed from a tunable hot melt adhesive composition having an initial dielectric constant; wherein a dielectric constant of the tunable hot melt adhesive composition is tuned to have a lower dielectric constant as compared the initial dielectric constant of said composition in order to be compatible with the desired signal performance characteristics of the signals transmitted over the signal wires to the printed circuit board.

2 . The electrical connector assembly as recited in claim 1 , wherein ground members are positioned over the portions of the insulated wires.

3 . The electrical connector assembly as recited in claim 2 , wherein the ground members are encapsulated by the impedance mold.

4 . The electrical connector assembly as recited in claim 3 , wherein the ground members are positioned over bent portions of the ends of the wires.

5 . The electrical connector assembly as recited in claim 4 , wherein the ground members are mounted and secured the ground rake of the circuit board.

6 . The electrical connector assembly as recited in claim 1 , wherein the tunable hot melt adhesive composition can be formed from a thermoplastic or thermoset polymer.

7 . The electrical connector assembly as recited in claim 1 , wherein the tunable hot melt adhesive composition has a density of less than 0.87 g/mL.

8 . The electrical connector assembly as recited in claim 1 , wherein the tunable hot melt adhesive composition is tuned to achieve a dielectric constant of the material to about 2.5.

9 . The electrical connector assembly as recited in claim 1 , wherein the tunable hot melt adhesive composition is tuned to achieve a dielectric constant of the material to about 1.6.

10 . The electrical connector assembly as recited in claim 1 , wherein the tunable hot melt adhesive composition comprises a polymer.

11 . The electrical connector assembly as recited in claim 10 , wherein the tunable hot melt adhesive composition is either a thermoplastic polymer or a thermoset polymer.

12 . The electrical connector assembly as recited in claim 11 , wherein the thermoplastic polymers are chosen from the group consisting of:
polyamides, polyolefins, polyurethanes, and ethylene vinyl acetate.

13 . The electrical connector assembly as recited in claim 11 , wherein the thermoset polymers are chosen from the group consisting of: epoxies, cyanoacrylates, and reactive polyurethanes.

14 . The electrical connector assembly as recited in claim 1 , wherein the tunable hot melt adhesive composition comprises at least one filler.

15 . The electrical connector assembly as recited in claim 14 , wherein the at least one filler is chosen from the group consisting of: thermoplastic hollow spheres and hollow glass spheres.

16 . The electrical connector assembly as recited in claim 14 , wherein the size of the at least one filler is selected to maintain the desired viscosity, dielectric constant and dissipation factor of the tunable hot melt adhesive composition.

17 . The electrical connector assembly as recited in claim 14 , wherein the at least one filler is about 0.5 to about 35 weight percent of the tunable hot melt adhesive composition.

18 . The electrical connector assembly as recited in claim 1 , wherein the tunable hot melt adhesive composition comprises a polymer, a filler and additives.

19 . The electrical connector assembly as recited in claim 18 , wherein the additional additives are in the range of about 0.5% to about 10% by weight of the tunable hot melt adhesive composition.

20 . The electrical connector assembly as recited in claim 1 , wherein the tunable hot melt adhesive composition comprises a polymer, a filler, and additives and has a density in the range of about 0.32 g/mL to about 0.73 g/mL.

Assignees

• Te Connectivity Solutions Gmbh

Inventors

• Orris David Patrick
• Kharel Aakriti
• Morgan Chad William

Classifications

• H01R12/53

  connecting to cables except for flat or ribbon cables · CPC title

• H01R13/504

  different pieces being moulded, cemented, welded, e.g. ultrasonic welding, or swaged together · CPC title

• H01R13/6477 Primary

  by variation of dielectric properties · CPC title

• H01R13/6658 Primary

  on printed circuit board (H01R13/6666 - H01R13/6691 take precedence) · CPC title

• H01R12/71

  for rigid printing circuits or like structures · CPC title