Directional coupler and electronic device having the same

Patent metadata

Field	Value
Publication number	US-12489192-B2
Application number	US-202217849846-A
Country	US
Kind code	B2
Filing date	Jun 27, 2022
Priority date	Apr 15, 2019
Publication date	Dec 2, 2025
Grant date	Dec 2, 2025

Abstract

A directional coupler according to various embodiment and an electronic device having the same are provided. The directional coupler includes a first layer having at least one conductive portion, a second layer disposed adjacent to the first layer in a first direction and having at least one conductive plate corresponding to the conductive portion of the first layer, a third layer disposed adjacent to the second layer in the first direction and including an RF signal transmission line, a fourth layer disposed adjacent to the third layer in the first direction and having a conductive line wound with at least one turn, and at least one conductive via electrically connecting the at least one conductive plate of the second layer and the conductive line of the fourth layer which is wound with at least one turn.

First claim

What is claimed is:

1 . A directional coupler comprising:
a first layer comprising at least one conductive portion; a second layer comprising at least one conductor that at least partially overlaps the at least one conductive portion of the first layer, the at least one conductor of the second layer including a board part, a first conductive plate, and a second conductive plate; an opening defined in the second layer, wherein the board part is formed at least partly around the opening, and wherein the first and second conductive plates are partially physically separated from the board part by the opening; a third layer comprising at least one RF signal transmission line; a fourth layer comprising a conductive line including at least one turn; wherein the second layer is provided between at least the first and third layers, and wherein the third layer is provided between at least the second and fourth layers; at least one conductive via configured to electrically connect the at least one conductor of the second layer and the conductive line of the fourth layer, and wherein the first layer, the second layer, the third layer, and the fourth layer are provided in a multi-layer printed circuit board so that the directional coupler is configured to form at least a part of the printed circuit board.

2 . The directional coupler of claim 1 , further comprising a spacer layer disposed between the second layer and the third layer and having at least one opening defined therein.

3 . The directional coupler of claim 1 , wherein a plurality of spacer layers are provided between at least the second layer and the third layer.

4 . The directional coupler of claim 1 , further comprising a first ground layer disposed adjacent to the first layer and electrically connected to the first layer.

5 . The directional coupler of claim 4 , further comprising a fifth layer comprising conductive lines that are electrically connected to the conductive line of the fourth layer.

6 . The directional coupler of claim 5 , further comprising a second ground layer disposed adjacent to the fifth layer and electrically connected to the fifth layer.

7 . The directional coupler of claim 1 , wherein the conductive via passes through the second layer, the third layer, and the fourth layer and is electrically disconnected from the RF signal transmission line of the third layer.

8 . The directional coupler of claim 1 , wherein:
each of the second layer, the third layer, and the fourth layer includes an opening, the openings including: a first opening region through which the conductive via passes, and a second opening region formed at least partially at a position proximate at least a part of the conductor of the second layer.

9 . The directional coupler of claim 1 , wherein the conductive line of the fourth layer is wound with a plurality of turns to form the inductor.

10 . The directional coupler of claim 1 , wherein:
the conductive line of the fourth layer includes a first inductor part that is wound with a number of turns and a second inductor part that is wound with the number of specified turns.

11 . The directional coupler of claim 1 , wherein:
a first end of the RF signal transmission line of the third layer forms at least part of an RF input port, and a second end of the RF signal transmission line of the third layer forms at least part of an RF output port; and at least one end of the conductive line of the fourth layer forms at least part of at least one of at least one terminal port and/or at least one coupling port.

12 . The directional coupler of claim 11 , wherein at least one passive element is electrically connected to at least one of the at least one terminal port and/or the at least one coupling port.

13 . An electronic device comprising:
a multilayer printed circuit board; at least one antenna; a transceiver; a directional coupler configured to extract at least some of signals output from the at least one antenna and to transmit a coupling signal to the transceiver; a processor; and a memory operatively connected to the processor, wherein the directional coupler comprises: a first layer comprising at least one conductive portion; a second layer comprising at least one conductor at least partly overlapping the at least one conductive portion of the first layer, the at least one conductor of the second layer including a board part, a first conductive plate, and a second conductive plate; an opening defined in the second layer, wherein the board part is formed at least partly around the opening, and wherein the first and second conductive plates are partially physically separated from the board part by the opening; a third layer comprising at least one RF signal transmission line; a fourth layer comprising a conductive line including at least one turn; wherein the second layer is provided between at least the first and third layers, and wherein the third layer is provided between at least the second and fourth layers; at least one conductive via configured to electrically connect the at least one conductor of the second layer and the conductive line of the fourth layer, and wherein the first layer, the second layer, the third layer, and the fourth layer are provided in the multi-layer printed circuit board so that the directional coupler is configured to form at least a part of the multi-layer printed circuit board.

14 . The electronic device of claim 13 , further comprising at least one spacer layer disposed between at least the second layer and the third layer and having at least one opening defined therein.

15 . The electronic device of claim 13 , further comprising a first ground layer disposed adjacent to the first layer and electrically connected to the first layer.

16 . The electronic device of claim 13 , wherein the conductive via passes through the second layer, the third layer, and the fourth layer and is electrically disconnected from the RF signal transmission line of the third layer.

17 . The electronic device of claim 13 , wherein the conductor of the second layer is formed as a conductive plate having a specified area to realize the capacitor, and the conductive line of the fourth layer is wound with a plurality of turns to form the inductor.

18 . The electronic device of claim 13 , wherein:
the conductor of the second layer includes a first conductive plate for a first capacitor, and a second conductive plate for a second capacitor; and the conductive line of the fourth layer includes a first inductor part that is wound with a number of turns and a second inductor part that is wound with the number of specified turns.

19 . The electronic device of claim 13 , wherein:
a first end of the RF signal transmission line of the third layer forms at least part of an RF input port, and a second end of the RF signal transmission line of the third layer forms at least part of an RF output port; and at least one end of the conductive line of the fourth layer forms at least part of at least one of at least one terminal port and/or at least one coupling port.

20 . A printed circuit board comprising:
a first layer configured to include at least one conductive portion; a second layer including at least one conductive plate that at least partly overlaps the at least one conductive portion of the first layer; an opening defined in the second layer, wherein the opening is at least partially filled with an insulator to at least partly surround the at least one conduc

Assignees

• Samsung Electronics Co Ltd

Inventors

• Park Jonghyun
• Yang Dongil
• Kang Jihee
• Kim Youngjoon

Classifications

• H05K1/024

  Dielectric details, e.g. changing the dielectric material around a transmission line · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K1/0243

  Printed circuits associated with mounted high frequency components · CPC title

• H03H7/004

  Capacitive coupling circuits not otherwise provided for · CPC title

• H03H7/482

  particularly adapted for use in common antenna systems · CPC title