Manufacturing method of insert case for semiconductor device and semiconductor device

Patent metadata

Field	Value
Publication number	US-12488995-B2
Application number	US-202117341625-A
Country	US
Kind code	B2
Filing date	Jun 8, 2021
Priority date	Nov 20, 2020
Publication date	Dec 2, 2025
Grant date	Dec 2, 2025

Abstract

A manufacturing method of an insert case for a semiconductor device includes: placing a terminal inside a mold and fixing a central portion of the terminal by bringing a slide core into contact with the central portion of the terminal; with the central portion of the terminal fixed by the slide core, filling an inside of the mold with resin to mold an insert case; and separating the slide core from the terminal and taking out the insert case from the mold.

First claim

The invention claimed is:

1 . A manufacturing method of an insert case for a semiconductor device comprising:
placing a terminal inside a mold and fixing a central portion of the terminal by bringing a slide core into contact with the central portion of the terminal; with the central portion of the terminal fixed by the slide core, filling an inside of the mold with resin to mold an insert case to embed a portion of the slide core in the molded insert case; and separating the slide core from the terminal and the case and taking out the insert case from the mold, wherein the terminal includes a plurality of terminals arranged in parallel to each other, and the slide core is inserted between the adjacent terminals, and the mold is configured such that when taking out the insert case from the mold, the insert case has a frame shape surrounding a hollow interior, and the terminal is exposed from respective sides of the insert case.

2 . The manufacturing method of an insert case for a semiconductor device according to claim 1 , wherein when the terminal is placed inside the mold, an end portion of the terminal is fixed with the mold.

3 . The manufacturing method of an insert case for a semiconductor device according to claim 1 , wherein
a cutout is provided in the terminal, and the slide core is inserted into the cutout.

4 . The manufacturing method of an insert case for a semiconductor device according to claim 3 , wherein a portion of the terminal where the cutout is provided extends to outside of the resin of the insert case.

5 . The manufacturing method of an insert case for a semiconductor device according to claim 2 , wherein a cutout is provided in the terminal, and
the slide core is inserted into the cutout.

6 . The manufacturing method of an insert case for a semiconductor device according to claim 5 , wherein a portion of the terminal where the cutout is provided extends to outside of the resin of the insert case.

7 . The manufacturing method of an insert case for a semiconductor device according to claim 1 , wherein the mold further comprises:
a first portion, and a second portion, the first portion and the second portion are brought together to create the inside of the mold, and the slide core is spaced from an interface formed by the first and second portions when brought together.

8 . The manufacturing method of an insert case for a semiconductor device according to claim 1 , wherein the terminal placed inside the mold has a bend.

9 . The manufacturing method of an insert case for a semiconductor device according to claim 8 , wherein the mold includes an upper portion and a lower portion, and the slide core moves laterally in a horizontal direction with respect to the upper portion and the lower portion when bringing the slide core into contact with the central portion of the terminal.

10 . The manufacturing method of an insert case for a semiconductor device according to claim 8 , further comprising placing an other terminal inside the mold and fixing a central portion of the other terminal by bringing an other slide core into contact with the central portion of the other terminal, wherein
the slide core and the other slide core move in opposite directions when being brought into contact respectively with the central portion of the terminal and the central portion of the other terminal.

11 . The manufacturing method of an insert case for a semiconductor device according to claim 1 , further comprising placing an other terminal inside the mold and fixing a central portion of the other terminal by bringing an other slide core into contact with the central portion of the other terminal, wherein
the slide core and the other slide core move in opposite directions when being brought into contact respectively with the central portion of the terminal and the central portion of the other terminal.

12 . A manufacturing method of an insert case for a semiconductor device comprising:
placing a terminal inside a mold and fixing a central portion of the terminal by bringing a slide core into contact with the central portion of the terminal; with the central portion of the terminal fixed by the slide core, filling an inside of the mold with resin to mold an insert case to embed a portion of the slide core in the molded insert case; and separating the slide core from the terminal and the case and taking out the insert case from the mold, wherein the terminal includes a plurality of terminals arranged in parallel to each other, and the slide core is inserted between the adjacent terminals, and the mold includes an upper portion and a lower portion, and the slide core moves laterally with respect to the upper portion and the lower portion when bringing the slide core into contact with the central portion of the terminal.

13 . The manufacturing method of an insert case for a semiconductor device according to claim 12 , further comprising placing an other terminal inside the mold and fixing a central portion of the other terminal by bringing an other slide core into contact with the central portion of the other terminal, wherein
the slide core and the other slide core move in opposite directions when being brought into contact respectively with the central portion of the terminal and the central portion of the other terminal.

Assignees

• Mitsubishi Electric Corp

Inventors

• Masumoto Hiroyuki

Classifications

• H10W76/157

  having interconnections parallel to the insulating or insulated base · CPC title

• H10W74/016

  using moulds · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title