Electronic component having element body and internal conductors and electronic component device

Patent metadata

Field	Value
Publication number	US-12488942-B2
Application number	US-202318522738-A
Country	US
Kind code	B2
Filing date	Nov 29, 2023
Priority date	Jan 31, 2023
Publication date	Dec 2, 2025
Grant date	Dec 2, 2025

Abstract

An electronic component includes: an element body including first and second end surfaces opposing each other and a side surface coupling the first and second end surfaces; first and second internal conductors in the element body; a first external electrode on the first end surface; a second external electrode on the second end surface; and first and second external conductors on the side surface. The first and second external conductors are separated from the first and second external electrodes. The first internal conductor is electrically connected to the first external electrode and the first external conductor. The second internal conductor is electrically connected to the second external electrode and the second external conductor. The first external conductor is located between the first external electrode and the second external conductor. The second external conductor is located between the second external electrode and the first external conductor.

First claim

What is claimed is:

1 . An electronic component, comprising:
an element body including a first end surface and a second end surface opposing each other and a side surface coupling the first end surface and the second end surface; a plurality of internal conductors in the element body; a first external electrode on the first end surface and a second external electrode on the second end surface, each including an electrode layer in which migration is relatively prone to occur; and a first external conductor and a second external conductor disposed in a direction in which the first end surface and the second end surface oppose each other and separated from the first external electrode and the second external electrode, on the side surface, each including a conductor layer in which migration is less prone to occur than in the electrode layer, wherein the plurality of internal conductors includes a first internal conductor electrically connected to the first external electrode and the first external conductor and a second internal conductor electrically connected to the second external electrode and the second external conductor, the first internal conductor and the second internal conductor opposing each other in a direction orthogonal to the direction in which the first end surface and the second end surface oppose each other, the first external conductor is located between the first external electrode and the second external conductor, the second external conductor is located between the second external electrode and the first external conductor, and a first shortest distance between the first external electrode and the first external conductor and a second shortest distance between the second external electrode and the second external conductor are smaller than a shortest distance between the first external conductor and the second external conductor.

2 . The electronic component according to claim 1 , wherein
the element body has a rectangular parallelepiped shape, the side surface includes a first side surface, a second side surface, a third side surface, and a fourth side surface that are adjacent to the end surface and the second end surface, and the first external conductor and the second external conductor are disposed over the first side surface, the second side surface, the third side surface, and the fourth side surface.

3 . The electronic component according to claim 2 , wherein
the first side surface and the second side surface oppose each other, the first internal conductor is physically connected to a portion included in the first external conductor and located on the first side surface, and the second internal conductor is physically connected to a portion included in the second external conductor and located on the second side surface.

4 . The electronic component according to claim 2 , wherein
the first internal conductor is physically connected to a portion included in the first external conductor and located on the first side surface, and the second internal conductor is physically connected to a portion included in the second external conductor and located on the first side surface.

5 . The electronic component according to claim 1 , wherein
the first internal conductor is connected to the first external conductor at a plurality of portions of the first internal conductor, and the second internal conductor is connected to the second external conductor at a plurality of portions of the second internal conductor.

6 . The electronic component according to claim 1 , wherein
the side surface includes a first main surface arranged to include a mounting surface, a second main surface opposing the first main surface, and a pair of side surfaces that are adjacent to the first main surface, the second main surface, the first end surface, and the second end surface and oppose each other, the electrode layer includes a conductive resin layer continuously covering a part of the main surface, a part of a corresponding end surface of the first end surface and the second end surface, and a part of each of the pair of side surfaces, the first internal conductor opposes the second internal conductor in a direction in which the pair of side surfaces oppose each other, and is physically connected to a portion included in the first external conductor and located on the first main surface, and the second internal conductor is physically connected to a portion included in the second external conductor and located on the first main surface.

7 . The electronic component according to claim 6 , wherein
each of the first external conductor and the second external conductor is disposed over the first main surface and a portion of each of the pair of side surfaces.

8 . The electronic component according to claim 7 , wherein
a first height of a portion included in each of the first external conductor and the second external conductor and located on the portion of each of the pair of side surfaces in a direction orthogonal to the first main surface is larger than or equal to a second height of the conductive resin layer in the direction orthogonal to the first main surface.

9 . The electronic component according to claim 1 , wherein
the side surface includes a first main surface arranged to include a mounting surface, a second main surface opposing the first main surface, and a pair of side surfaces that are adjacent to the first main surface, the second main surface, the first end surface, and the second end surface and oppose each other, the electrode layer includes a conductive resin layer continuously covering a part of the main surface, a part of a corresponding end surface of the first end surface and the second end surface, and a part of each of the pair of side surfaces, the first internal conductor opposes the second internal conductor in a direction in which the first main surface and the second main surface oppose each other, and is physically connected to a portion included in the first external conductor and located on at least one side surface of the pair of side surfaces, and the second internal conductor is physically connected to a portion included in the second external conductor and located on at least one side surface of the pair of side surfaces.

10 . The electronic component according to claim 9 , wherein
an internal conductor, among the plurality of internal conductors, between the second main surface and an end edge included in the conductive resin layer and located closer to the second main surface, in the direction in which the first main surface and the second main surface oppose each other, is not electrically connected to either the first external conductor or the second external conductor.

11 . The electronic component according to claim 1 , wherein
the electrode layer includes a conductive resin layer including a plurality of silver particles, and the conductor layer includes a metal layer in which migration is less prone to occur than in silver.

12 . An electronic component device, comprising:
the electronic component according to claim 1 ; and an electronic device on which the electronic component is mounted, the first external conductor and the second external conductor are not physically connected to the electronic device.

13 . An electronic component, comprising:
an element body including a first end surface and a second end surface opposing each other and a side surface coupling the first end surface and the second end surface; a plurality of internal conductors in the element body; a first external electrode on the first end surface and a second external e

Assignees

• Tdk Corp

Inventors

• Nagai Yuichi
• Morita Ken
• Takata Kyohei
• Okui Yasuhiro
• Nagashima Yoshitaka

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title