Multi-layer photoresist systems and methods for manufacturing electrochemical deposition printheads

Patent metadata

Field	Value
Publication number	US-12487520-B2
Application number	US-202418428830-A
Country	US
Kind code	B2
Filing date	Jan 31, 2024
Priority date	Aug 3, 2023
Publication date	Dec 2, 2025
Grant date	Dec 2, 2025

Abstract

A method of forming a printhead of an electrochemical deposition system includes applying at least one first photosensitive resist layer onto a substrate including a connection circuit, exposing a portion of the at least one first photosensitive resist layer to a first light such that a first-layer region is defined, applying at least one second photosensitive resist layer onto the at least one first photosensitive resist layer, and exposing a portion of the at least one second photosensitive resist layer to a second light such that a second-layer region, at least partially overlapping the first-layer region, is defined. The method further includes developing the at least one first photosensitive resist layer and the at least one second photosensitive resist layer to remove the second-layer region and at least a portion of the first-layer region, such that an aperture is formed with an overhang portion.

First claim

What is claimed is:

1 . A method of forming a printhead of an electrochemical deposition system, the method comprising:
applying at least one first photosensitive resist layer onto a substrate comprising a connection circuit; exposing a portion of the at least one first photosensitive resist layer to a first light such that a plurality of first-layer regions, spaced apart from each other, are defined by the portion of the at least one first photosensitive resist layer exposed to the first light; applying at least one second photosensitive resist layer onto the at least one first photosensitive resist layer; exposing a portion of the at least one second photosensitive resist layer to a second light such that a plurality of second-layer regions, spaced apart from each other and each located within a footprint of a corresponding one of the plurality of first-layer regions, are defined by the portion of the at least one second photosensitive resist layer exposed to the second light; developing the at least one first photosensitive resist layer and the at least one second photosensitive resist layer to remove the plurality of second-layer regions and at least a portion of each one of the plurality of first-layer regions, such that a plurality of apertures are formed through the at least one first photosensitive layer and the at least one second photosensitive layer and such that an overhanging portion of the at least one second photosensitive layer overhangs the at least one first photosensitive layer; applying a metallic material onto the substrate through one or more of the plurality of apertures such that the metallic material is capable of establishing an electrical connection with the connection circuit; and removing the at least one first photosensitive resist layer and the at least one second photosensitive resist layer from the substrate.

2 . The method according to claim 1 , wherein applying the metallic material onto the substrate comprises sputtering a sputtering metallic material onto the substrate.

3 . The method according to claim 2 , wherein applying the metallic material onto the substrate further comprises plating a plating metallic material onto the sputtering metallic material by electrically energizing the connection circuit.

4 . The method according to claim 3 , wherein the step of plating the plating metallic material onto the sputtering metallic material, by electrically energizing the connection circuit, occurs after the step of removing the at least one first photosensitive resist layer and the at least one second photosensitive resist layer from the substrate.

5 . The method according to claim 2 , wherein an area of the metallic material applied onto the connection circuit is greater than an area occupied by the connection circuit.

6 . The method according to claim 2 , wherein an area of the metallic material applied onto the connection circuit is less than an area occupied by the connection circuit.

7 . The method according to claim 1 , wherein:
applying the metallic material onto the substrate comprises applying a layer of the metallic material onto the substrate, through the aperture, and onto the at least one second photosensitive resist layer; and removing the at least one first photosensitive resist layer and the at least one second photosensitive resist layer from the substrate also removes a portion of the layer of the metallic material on the at least one second photosensitive resist layer.

8 . The method according to claim 1 , wherein an area of the metallic material applied onto the substrate is greater than a second-layer area of the second-layer region.

9 . The method according to claim 1 , wherein:
exposing the portion of the at least one first photosensitive resist layer to the first light to define the first-layer region comprises positioning a first patterned mask onto the at least one first photosensitive resist layer and transmitting the first light through a pattern in the first patterned mask; and exposing the portion of the second photosensitive resist layer to the second light to define the second-layer region comprises positioning a second patterned mask onto the at least one second photosensitive resist layer and transmitting the second light through a pattern in the second patterned mask.

10 . The method according to claim 1 , wherein developing the at least one first photosensitive resist layer and the at least one second photosensitive resist layer comprises concurrently exposing the first-layer region and the second-layer region to at least one solvent.

11 . The method according to claim 1 , wherein:
the at least one first photosensitive resist layer defines a first portion of the aperture having a first width in a width direction; the at least one second photosensitive resist layer defines a second portion of the aperture having a second width in the width direction; and the first width is greater than the second width.

12 . The method according to claim 11 , wherein:
the second width is constant in a height direction away from the substrate and perpendicular to the width direction; and the first width decreases in the height direction.

13 . The method according to claim 1 , wherein the at least one first photosensitive resist layer comprises at least two first photosensitive resist layers.

14 . The method according to claim 13 , wherein:
a first-layer area of a portion of the first-layer region defined by an inner one of the at least two first photosensitive resist layers is greater than a first-layer area of a portion of the first-layer region defined by an outer one of the at least two first photosensitive resist layers; and the outer one of the at least two first photosensitive resist layers is interposed between the inner one of the at least two first photosensitive resist layers and the at least one second photosensitive resist layer.

15 . The method according to claim 1 , wherein:
the substrate has a non-planar topography; the at least one first photosensitive resist layer is applied onto the non-planar topography of the substrate; and the metallic material is applied onto the non-planar topography of the substrate through the aperture.

16 . The method according to claim 15 , wherein:
the substrate comprises a base and a polyimide insulator layer coupled to the base; and the non-planar topography is defined by the polyimide insulator layer.

17 . The method according to claim 1 , further comprising heat treating the at least one first photosensitive resist layer after exposing the portion of the at least one first photosensitive resist layer to the first light and before applying the at least one second photosensitive resist layer onto the at least one first photosensitive resist layer.

18 . The method according to claim 1 , wherein:
the at least one first photosensitive resist layer is made of a first photosensitive resist material; the at least one second photosensitive resist layer is made of a second photosensitive resist material; and the first photosensitive resist material and the second photosensitive resist material are different types of photosensitive resist material.

19 . The method according to claim 1 , further comprising applying at least one of an adhesive promoter or a mixing barrier between the at least one first photosensitive resist layer and the at least one second photosensitive resist layer.

20 . The method according to claim 1 , wherein the at least one first photo

Assignees

• Fabric8Labs Inc

Inventors

• White Edward
• Shailendar Shiv
• Nicholl Ryan
• Pain David

Classifications

• G03F7/2022

  Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure · CPC title

• G03F7/094 Primary

  Multilayer resist systems, e.g. planarising layers · CPC title

• C23F17/00

  Multi-step processes for surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by subclass C21D or C22F or class C25 (coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups C23C2/00 - C23C26/00, or by combinations of methods providedfor in subclasses C23C and C25D, C23C28/00) · CPC title

• G03F7/0015

  Production of aperture devices, microporous systems or stamps · CPC title

• C25D1/003

  3D structures, e.g. superposed patterned layers · CPC title