Preform assembly

US12486430B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12486430-B2
Application numberUS-202118034431-A
CountryUS
Kind codeB2
Filing dateOct 21, 2021
Priority dateOct 28, 2020
Publication dateDec 2, 2025
Grant dateDec 2, 2025

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  1. Title

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  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A tape comprising: a backing layer; and an epoxy resin layer adhered to a first surface of the backing layer in a spiral pattern, the first surface providing a first level of adherence to the epoxy resin layer so that when the epoxy resin layer is applied to a surface the backing layer can be removed from the epoxy resin layer.

First claim

Opening claim text (preview).

The invention claimed is: 1 . An assembly comprising: a first piece comprising a first reinforcement material; a second piece comprising a second reinforcement material; and an epoxy resin layer adhered to the first piece and the second piece such that the first piece is adhered to the second piece by the epoxy resin layer, the epoxy resin layer having a spiral pattern comprising (i) a plurality of overlapping loops extending in a first direction and (ii) an epoxy resin having a viscosity of between 10000 mPa·s and 40000 mPa·s. 2 . The assembly according to claim 1 , comprising an epoxy-based matrix material, wherein the spiral pattern allows the epoxy-based matrix material to penetrate through the resin layer and avoid dry spots in the first and second pieces. 3 . The assembly according to claim 2 , wherein the epoxy resin layer is soluble in the epoxy-based matrix material. 4 . The assembly according to claim 1 , wherein the epoxy resin layer can be used to set the first and second pieces in a final configuration during a resin transfer process. 5 . The assembly according to claim 1 , comprising a resin for a resin transfer process, wherein the epoxy resin layer is formed of a material that does not contaminate the resin for the resin transfer process. 6 . The assembly according to claim 5 , wherein the epoxy resin layer does not have a hardener present, and the resin for the resin transfer process has a hardener present. 7 . The assembly according to claim 5 , wherein the epoxy resin layer does not have a hardener present, and the resin for the resin transfer process is UV curable. 8 . The assembly according to claim 1 , wherein the first and second reinforcement materials comprise carbon fibre. 9 . The assembly according to claim 1 , wherein the plurality of overlapping loops are asymmetric about a second direction that is perpendicular to the first direction, and a loop of the plurality of overlapping loops overlaps four adjacent loops of the plurality of overlapping loops. 10 . A tape comprising: a backing layer; and an epoxy resin layer adhered to a first surface of the backing layer in a spiral pattern comprising a plurality of overlapping loops extending along a length of the first surface, the first surface providing a first level of adherence to the epoxy resin layer so that when the epoxy resin layer is applied to a surface the backing layer can be removed from the epoxy resin layer, wherein the epoxy resin layer comprises an epoxy resin having a viscosity of between 10000 mPa·s and 40000 mPa·s. 11 . The tape according to claim 10 , wherein the epoxy resin layer is adhered along the whole length of the first surface. 12 . The tape according to claim 10 , wherein the backing layer has a width and the epoxy resin layer is adhered across part of the width of the first surface. 13 . The tape according to claim 12 , wherein the epoxy resin layer is adhered across a central portion of the width of the first surface. 14 . The tape according to claim 10 , wherein the backing layer comprises a second surface, the epoxy resin layer contacting the second surface when the tape is rolled, wherein the second surface has a second level of adherence to the epoxy resin layer, the second level of adherence being lower than the first level of adherence so that when the tape is unrolled the epoxy resin layer remains adhered to the first surface. 15 . The tape according to claim 10 , wherein a size of a first loop of the plurality of overlapping loops has substantially the same size as a second loop of the plurality of overlapping loops. 16 . The tape according to claim 10 , wherein the plurality of overlapping loops extending along the length of the first surface are asymmetric about a second direction that is perpendicular to a first direction in which the length of the first surface extends. 17 . The tape according to claim 10 , wherein a loop of the plurality of overlapping loops overlaps four adjacent loops of the plurality of overlapping loops. 18 . A tape comprising: a backing layer having a length and a width, the backing layer having a first surface and a second surface; and an epoxy resin layer adhered to the first surface of the backing layer in a spiral pattern comprising a plurality of overlapping loops extending along a length of the first surface, the first surface providing a first level of adherence to the epoxy resin layer so that when the epoxy resin layer is applied to a third surface the backing layer can be removed from the epoxy resin layer, wherein the epoxy resin layer is adhered to the backing layer along the length of the first surface and across a central portion of the width of the first surface, wherein the epoxy resin layer comprises an epoxy resin having a viscosity of between 10000 mPa·s and 40000 mPa·s, and wherein the epoxy resin layer contacts the second surface of the backing layer when the tape is rolled, wherein the second surface has a second level of adherence to the epoxy resin layer, the second level of adherence being lower than the first level of adherence so that when the tape is unrolled the epoxy resin layer remains adhered to the first surface. 19 . The tape according to claim 18 , wherein a size of a first loop of the plurality of overlapping loops has substantially the same size as a second loop of the plurality of overlapping loops. 20 . The tape according to claim 18 , wherein the plurality of overlapping loops are asymmetric about a second direction that is perpendicular to a first direction in which the length of the first surface extends. 21 . The tape according to claim 18 , wherein a loop of the plurality of overlapping loops overlaps four adjacent loops of the plurality of overlapping loops.

Assignees

Inventors

Classifications

  • Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

  • characterized by process specific features · CPC title

  • the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape · CPC title

  • Presence of epoxy resin · CPC title

  • characterized by the structural features of the adhesive itself · CPC title

Patent family

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Frequently asked questions

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What does patent US12486430B2 cover?
A tape comprising: a backing layer; and an epoxy resin layer adhered to a first surface of the backing layer in a spiral pattern, the first surface providing a first level of adherence to the epoxy resin layer so that when the epoxy resin layer is applied to a surface the backing layer can be removed from the epoxy resin layer.
Who is the assignee on this patent?
Mclaren Automotive Ltd
What technology area does this patent fall under?
Primary CPC classification C09J7/201. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 02 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).