Metal-clad laminate

Patent metadata

Field	Value
Publication number	US-12485651-B2
Application number	US-202418828729-A
Country	US
Kind code	B2
Filing date	Sep 9, 2024
Priority date	Mar 27, 2024
Publication date	Dec 2, 2025
Grant date	Dec 2, 2025

Abstract

A metal-clad laminate is provided. The metal-clad laminate includes: a dielectric layer, which has a dielectric material; and a conductive layer, which is disposed on at least one side of the dielectric layer. The dielectric material includes a fluoropolymer (A) and a filler (B). The fluoropolymer (A) has a crystallinity of not less than 40%. The filler (B) has a specific surface area of less than 2.5 m2/g.

First claim

What is claimed is:

1 . A metal-clad laminate, comprising:
a dielectric layer, which comprises a dielectric material; and a conductive layer, which is disposed on at least one side of the dielectric layer, wherein the dielectric material comprises a fluoropolymer (A) and a filler (B), the fluoropolymer (A) has a crystallinity ranging from 40% to 80%, and the filler (B) has a specific surface area ranging from 0.3 m 2 /g to less than 2.5 m 2 /g.

2 . The metal-clad laminate of claim 1 , wherein the filler (B) has a specific surface area ranging from 0.3 m 2 /g to 2.0 m 2 /g.

3 . The metal-clad laminate of claim 1 , wherein the filler (B) is selected from the group consisting of silicon dioxide, alumina, magnesium oxide, magnesium hydroxide, calcium carbonate, talc, clay, aluminum nitride, boron nitride, aluminum hydroxide, silicon aluminum carbide, silicon carbide, sodium carbonate, titanium dioxide, zinc oxide, zirconium oxide, quartz, diamond powder, diamond-like powder, graphite, calcined kaolin, pryan, mica, hydrotalcite, glass bead, ceramic whisker, carbon nanotube, nanosized inorganic powder, strontium titanate, and combinations thereof.

4 . The metal-clad laminate of claim 1 , wherein based on the total weight of the dielectric material, the amount of the filler (B) ranges from 34 wt % to 59 wt %.

5 . The metal-clad laminate of claim 1 , wherein the fluoropolymer (A) is selected from the group consisting of polytetrafluoroethylene (PTFE), fluorinated ethylene propylene copolymer (FEP copolymer), polyfluoroalkoxy alkane (PFA), polychlorotrifluoroethylene (PCTFE), polyvinylidene difluoride (PVDF), polyvinyl fluoride (PVF), ethylene-tetrafluoroethylene copolymer (ETFE copolymer), ethylene-chloro trifluoroethylene copolymer (ECTFE copolymer), and combinations thereof.

6 . The metal-clad laminate of claim 1 , wherein the fluoropolymer (A) has a fluorine atom content of 60% or more based on the total atom number of repeating units of the fluoropolymer (A).

7 . The metal-clad laminate of claim 1 , wherein based on the total weight of the dielectric material, the amount of the fluoropolymer (A) ranges from 40 wt % to 65 wt %.

8 . The metal-clad laminate of claim 1 , wherein the dielectric layer further comprises a reinforcing material.

9 . The metal-clad laminate of claim 1 , wherein the conductive layer is a copper conductive layer.

10 . The metal-clad laminate of claim 1 , wherein the conductive layer is a patterned conductive layer.

Assignees

• Taiwan Union Technology Corp

Inventors

• Liu Shur-Fen
• Tang Jui-Hsiang

Classifications

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title

• H05K1/02

  Details · CPC title

• H05K1/0306 Primary

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• B32B2262/101

  Glass fibres · CPC title

• B32B2307/204

  Di-electric · CPC title