Deformation detection sensor

Patent metadata

Field	Value
Publication number	US-12484448-B2
Application number	US-202217864019-A
Country	US
Kind code	B2
Filing date	Jul 13, 2022
Priority date	Jul 30, 2020
Publication date	Nov 25, 2025
Grant date	Nov 25, 2025

Abstract

A deformation detection sensor is provided that includes a detection electrode, a first ground electrode, a piezoelectric film sandwiched between the detection electrode and the first ground electrode, a substrate on which the detection electrode and a second ground electrode are formed, a wiring connected to the detection electrode, and a joint member that joins the wiring and the detection electrode.

First claim

The invention claimed is:

1 . A deformation detection sensor comprising:
a substrate; a detection electrode disposed on the substrate; a first ground electrode; a second ground electrode disposed on the substrate; a piezoelectric film disposed between the detection electrode and the first ground electrode; a wiring connected to the detection electrode; and a joint member that joins the wiring to the detection electrode, wherein the piezoelectric film is disposed on a first surface of the substrate that is opposite to a second surface of the substrate on which the joint member is disposed.

2 . The deformation detection sensor according to claim 1 , further comprising a reinforcing member configured to reinforce the substrate and that is connected to the second ground electrode.

3 . The deformation detection sensor according to claim 1 , wherein the detection electrode comprises a first electrode disposed on the first surface of the substrate and a second electrode disposed on the second surface of the substrate.

4 . The deformation detection sensor according to claim 3 , wherein the detection electrode includes a via conductor that electrically connects the first electrode and the second electrode.

5 . The deformation detection sensor according to claim 1 , wherein the first ground electrode comprises a conductive member coupled to the piezoelectric film and the first electrode disposed on the first surface of the substrate.

6 . The deformation detection sensor according to claim 1 , wherein the wiring is configured to be connected to an object of deformation detection.

7 . The deformation detection sensor according to claim 1 , wherein the joint member overlaps the first ground electrode in a plan view of the first surface of the substrate.

8 . The deformation detection sensor according to claim 3 , wherein the piezoelectric film is coupled to the first surface of the substrate with the first electrode of the detection electrode disposed therebetween.

9 . The deformation detection sensor according to claim 8 , wherein the joint member is coupled to the second surface of the substrate with the second electrode of the detection electrode disposed therebetween.

10 . The deformation detection sensor according to claim 1 , wherein the first ground electrode is disposed on a first main face of the piezoelectric film and the detection electrode is disposed on a second main face of the piezoelectric film opposite the first main surface.

11 . The deformation detection sensor according to claim 10 , wherein the detection electrode is disposed on the first surface of the substrate and the second ground electrode is disposed on the second surface of the substrate.

12 . The deformation detection sensor according to claim 1 , wherein the wiring includes a wiring substrate, a wiring ground electrode disposed on a first surface of the wiring substrate, and a wiring detection electrode disposed on a second surface of the wiring substrate opposite the first surface.

13 . The deformation detection sensor according to claim 12 , wherein the detection electrode is coupled to the wiring detection electrode by the joint member.

14 . The deformation detection sensor according to claim 1 , wherein the detection electrode is disposed at a position where the substrate overlaps the wiring and at a position that only partially overlaps the piezoelectric film in a plan view of the first surface of the substrate.

15 . The deformation detection sensor according to claim 14 , wherein the detection electrode is disposed at a position that excludes both ends of the substrate in a direction orthogonal to the plan view.

16 . The deformation detection sensor according to claim 15 , wherein the second ground electrode is disposed at a position that overlaps a whole face of the piezoelectric film in the plan view of the first surface of the substrate and at a position where the substrate overlaps the wiring in the plan view of the first surface of the substrate.

17 . A deformation detection sensor comprising:
a substrate having first and second surfaces that oppose each other; a detection electrode disposed on at least one of the first and second surfaces of the substrate; a first ground electrode disposed above the first surface of the substrate; a second ground electrode disposed on the substrate; a piezoelectric film disposed between the detection electrode and the first ground electrode; a wiring connected to the detection electrode; and a joint member that joins the wiring to the detection electrode, wherein the piezoelectric film is disposed above the first surface of the substrate.

18 . The deformation detection sensor according to claim 17 , wherein the piezoelectric film is disposed opposite to the second surface of the substrate on which the joint member is disposed, and the second ground electrode disposed directly on the first surface of the substrate.

19 . The deformation detection sensor according to claim 17 , wherein the detection electrode comprises a first electrode disposed on the first surface of the substrate and a second electrode disposed on the second surface of the substrate.

20 . The deformation detection sensor according to claim 19 ,
wherein the piezoelectric film is coupled to the first surface of the substrate with the first electrode of the detection electrode disposed therebetween, and wherein the joint member is coupled to the second surface of the substrate with the second electrode of the detection electrode disposed therebetween.

Assignees

• Murata Manufacturing Co

Inventors

• Harada Shingo
• Kano Hidekazu
• WATANABE Mei
• Kitada Hiroaki

Classifications

• H10N30/872

  Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices · CPC title

• H10N30/072

  by laminating or bonding of piezoelectric or electrostrictive bodies · CPC title

• H10N30/50

  having a stacked or multilayer structure · CPC title

• H10N30/03

  Assembling devices that include piezoelectric or electrostrictive parts · CPC title

• H10N30/87

  Electrodes or interconnections, e.g. leads or terminals · CPC title