Light emitting device

Patent metadata

Field	Value
Publication number	US-12484350-B2
Application number	US-202318307015-A
Country	US
Kind code	B2
Filing date	Apr 26, 2023
Priority date	Nov 30, 2015
Publication date	Nov 25, 2025
Grant date	Nov 25, 2025

Abstract

A light emitting device including a first light emitting element and an optical member disposed over the first light emitting element. The optical member includes a light transmissive member and a ceramic component. The light transmissive member has a first upper surface, a second upper surface, and a lower surface opposing to the first upper surface and a second upper surface. The ceramic component is disposed on the second upper surface of the light transmissive member. The light transmissive member and the ceramic component each has a portion that overlaps with the first light emitting element when viewed in plan view.

First claim

What is claimed is:

1 . A light emitting device comprising:
a first light emitting element having an upper surface; and an optical member disposed over the first light emitting element, wherein the optical member comprises:
a light transmissive member having a first upper surface, a second upper surface, and a lower surface opposing to the first upper surface and the second upper surface, and
a ceramic component having a lower surface disposed on the second upper surface of the light transmissive member,
wherein the light transmissive member has a portion that overlaps with the first light emitting element when viewed in a plan view, wherein the lower surface of the ceramic component has a portion that overlaps with the upper surface of the first light emitting element when viewed in the plan view, wherein the first light emitting element is bonded to the light transmissive member using an adhesive material, and wherein a reflective film is disposed on an uppermost surface of the ceramic component.

2 . The light emitting device according to claim 1 , wherein the optical member has a rectangular cross-sectional shape.

3 . The light emitting device according to claim 1 , wherein the optical member has a rectangular parallelepiped shape.

4 . The light emitting device according to claim 1 , wherein the light transmissive member contains a phosphor.

5 . The light emitting device according to claim 1 , further comprising a resin containing a light reflective member,
wherein the resin covers lateral surfaces of the optical member.

6 . The light emitting device according to claim 1 , further comprising a second light emitting element having an upper surface,
wherein the optical member extends over the second light emitting element and is disposed over the upper surface of the second light emitting element.

7 . The light emitting device according to claim 6 , further comprising a resin containing a light reflective member,
wherein the resin covers lateral surfaces of the optical member.

8 . The light emitting device according to claim 7 , further comprising a mounting board,
wherein the first light emitting element and the second light emitting element are mounted to the mounting board, and wherein the mounting board has a wiring that directly connects the first light emitting element to the second light emitting element.

9 . The light emitting device according to claim 8 , wherein at least a portion of the wiring is exposed from the resin.

10 . The light emitting device according to claim 1 , wherein the ceramic component extends outward beyond an outer perimeter of the light transmissive member when viewed in the plan view.

11 . The light emitting device according to claim 1 , wherein the light transmissive member is formed of an inorganic material.

12 . The light emitting device according to claim 1 , wherein an upper surface area of the first upper surface of the light transmissive member is 50 % or less than a lower surface area of the lower surface of the light transmissive member.

13 . The light emitting device according to claim 1 , wherein the ceramic component partially overlaps the light transmissive member when viewed in the plan view.

14 . The light emitting device according to claim 13 , wherein the light transmissive member entirely overlaps the first light emitting element when viewed in the plan view.

15 . The light emitting device according to claim 1 , wherein the light transmissive member entirely overlaps the first light emitting element when viewed in the plan view.

16 . The light emitting device according to claim 1 , wherein the lower surface of the ceramic component has an additional portion that does not overlap with the first light emitting element when viewed in the plan view.

17 . The light emitting device according to claim 1 ,
wherein the light transmissive member having the first upper surface, the second upper surface, and the lower surface is a one piece member, wherein the lower surface is entirely a planar surface, and wherein the ceramic component covers an entirety of the second upper surface of the light transmissive member when viewed in the plan view.

18 . The light emitting device according to claim 17 , wherein an outermost lateral surface of the ceramic component is aligned with an outermost lateral surface of the light transmissive member.

19 . A light emitting device comprising:
a first light emitting element having an upper surface; and an optical member disposed over the first light emitting element, wherein the optical member comprises:
a light transmissive member having a first upper surface, a second upper surface, and a lower surface opposing to the first upper surface and the second upper surface, and
a ceramic component having a lower surface disposed on the second upper surface of the light transmissive member,
wherein the light transmissive member has a portion that overlaps with the first light emitting element when viewed in a plan view, wherein the lower surface of the ceramic component has a portion that overlaps with the upper surface of the first light emitting element when viewed in the plan view, wherein the first light emitting element is bonded to the light transmissive member using an adhesive material, and wherein a reflective film is disposed on an upper surface of the ceramic component, the upper surface of the ceramic component facing in a direction opposite to the first light emitting element.

Assignees

• Nichia Corp

Inventors

• Tomonari Masakatsu
• Sano Masahiko

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10H20/8583

  not being in contact with the bodies · CPC title

• H10H20/8582

  characterised by their shape · CPC title

• H10H20/8514

  characterised by their shape, e.g. plate or foil · CPC title