Display module, display device and heat dissipation assembly

Patent metadata

Field	Value
Publication number	US-12484204-B2
Application number	US-202118246368-A
Country	US
Kind code	B2
Filing date	Nov 18, 2021
Priority date	Dec 1, 2020
Publication date	Nov 25, 2025
Grant date	Nov 25, 2025

Abstract

A display module, display device and heat dissipation assembly are provided. The display module includes a display panel and a heat dissipation structure. The heat dissipation structure includes an adhesive layer adhered to a back side of the display panel, a first foam layer located on a side of the adhesive layer away from the display panel, a heat dissipation layer located on a side of the first foam layer away from the adhesive layer, and a second foam layer located on a side of the heat dissipation layer away from the first foam layer. The second foam layer has a plurality of missing avoidance areas.

First claim

What is claimed is:

1 . A display module, comprising:
a display panel; and a heat dissipation structure, comprising an adhesive layer adhered to a back side of the display panel, a first foam layer located on a side of the adhesive layer away from the display panel, a heat dissipation layer located on a side of the first foam layer away from the adhesive layer, and a second foam layer located on a side of the heat dissipation layer away from the first foam layer, wherein the second foam layer has a plurality of missing avoidance areas.

2 . The display module according to claim 1 , wherein the heat dissipation layer comprises a metallic aluminum film and an RF shielding film, the metallic aluminum film has a first side away from the second foam layer and a second side close to the second foam layer, and the RF shielding film is disposed on at least one of the first side and the second side.

3 . The display module according to claim 2 , wherein the RF shielding film is disposed on the second side of the metallic aluminum film.

4 . The display module according to claim 2 , wherein the RF shielding film is a metallic nickel film.

5 . The display module according to claim 2 , wherein the heat dissipation layer has a thickness of 40 μm to 60 μm.

6 . The display module according to claim 1 , wherein the display panel is flexible and comprises a display part, a bonding part located on a back side of the display part and a bending part connecting the display part to the bonding part,
wherein the adhesive layer is adhered to the back side of the display part, the plurality of missing avoidance areas comprise at least a first missing avoidance area, and the bonding part is located in the first missing avoidance area.

7 . The display module according to claim 6 , wherein
the plurality of missing avoidance areas further comprises a second missing avoidance area, and the second missing avoidance area is contiguous with the first missing avoidance area, the display module further comprising a chip-on-film (COF) and a main flexible circuit board, the main flexible circuit board is located in the second missing avoidance area, a part of the COF is located in the first missing avoidance area and electrically connected to the bonding part, and another part of the COF is located in the second missing avoidance area and electrically connected to the main flexible circuit board.

8 . The display module according to claim 7 , wherein the plurality of missing avoidance areas further comprises a third missing avoidance area for accommodating a middle frame-grounded structure and a fourth missing avoidance area for accommodating a camera.

9 . The display module according to claim 1 , wherein a ratio between a of the second foam layer and a thickness of the heat dissipation structure is from 0.4 to 0.6.

10 . The display module according to claim 9 , wherein the thickness of the second foam layer is from 0.1 mm to 0.3 mm.

11 . A heat dissipation assembly, comprising:
a heat dissipation structure, comprising an adhesive layer which can be adhered to a back side of a display panel, a first foam layer located on a side of the adhesive layer away from the display panel, a heat dissipation layer located on a side of the first foam layer away from the adhesive layer, and a second foam layer located on a side of the heat dissipation layer away from the first foam layer, wherein the second foam layer has a plurality of missing avoidance areas; a plurality of filling parts, each filling in one of the missing avoidance areas, wherein the filling part is adhered to the heat dissipation layer, and a plane of the filling part away from the display panel is flush with a plane of the second foam layer away from the display panel; and a protective film layer, located on a side of each of the second foam layer and the filling parts away from the heat dissipation layer and covering the heat dissipation structure.

12 . The heat dissipation assembly according to claim 11 , wherein the filling part has a same elastic modulus as the second foam layer.

13 . The heat dissipation assembly according to claim 11 , wherein the protective film layer is adhered to the filling part, and an adhesion stress between the protective film layer and the filling part is greater than an adhesion stress between the filling part and the heat dissipation layer.

14 . The heat dissipation assembly according to claim 13 , wherein
the plurality of missing avoidance areas comprises a first missing avoidance area, a second missing avoidance area, a third missing avoidance area and a fourth missing avoidance area, and the protective film layer comprises a first protective part, a second protective part and a third protective part, the first protective part covers the first missing avoidance area, the second protective part covers the second missing avoidance area, and the third protective part covers the third missing avoidance area and the fourth missing avoidance area.

15 . A display device, comprising
a middle frame structure, having a mounting plate and a side plate coupled to the mounting plate, the side plate and the mounting plate form a mounting groove by surrounding the mounting groove; and a display module, mounted in the mounting groove, wherein the display module comprises: a display panel; and a heat dissipation structure, comprising an adhesive layer adhered to a back side of the display panel, a first foam layer located on a side of the adhesive layer away from the display panel, a heat dissipation layer located on a side of the first foam layer away from the adhesive layer, and a second foam layer located on a side of the heat dissipation layer away from the first foam layer, wherein the second foam layer has a plurality of missing avoidance areas, wherein the second foam layer is mounted to face the mounting plate.

16 . The display device according to claim 15 , wherein the heat dissipation layer comprises a metallic aluminum film and an RF shielding film, the metallic aluminum film has a first side away from the second foam layer and a second side close to the second foam layer, and the RF shielding film is disposed on at least one of the first side and the second side.

17 . The display device according to claim 16 , wherein the RF shielding film is disposed on the second side of the metallic aluminum film.

18 . The display device according to claim 15 , wherein the display panel is flexible and comprises a display part, a bonding part located on a back side of the display part and a bending part connecting the display part to the bonding part,
wherein the adhesive layer is adhered to the back side of the display part, the plurality of missing avoidance areas comprise at least a first missing avoidance area, and the bonding part is located in the first missing avoidance area.

19 . The display device according to claim 18 , wherein
the plurality of missing avoidance areas further comprises a second missing avoidance area, and the second missing avoidance area is contiguous with the first missing avoidance area, the display module further comprising a chip-on-film (COF) and a main flexible circuit board, the main flexible circuit board is located in the second missing avoidance area, a part of the COF is located in the first missing avoidance area and electrically connected to the bonding part, and another part of the COF is located in the second missing avoidance area and electrically connected to the main flexible circuit board.

Assignees

• Chengdu Boe Optoelect Tech Co
• Boe Technology Group Co Ltd
• Beijing Boe Technology Dev Co Ltd

Inventors

• Cui Zhihong
• Feng Binfeng

Classifications

• H05K9/0081

  Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K9/0003 takes precedence) · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K2201/10128

  Display · CPC title

• H05K9/0054

  specially adapted for display applications · CPC title