Cooling apparatus for power module

Patent metadata

Field	Value
Publication number	US-12484187-B2
Application number	US-202318389091-A
Country	US
Kind code	B2
Filing date	Nov 13, 2023
Priority date	Jun 28, 2023
Publication date	Nov 25, 2025
Grant date	Nov 25, 2025

Abstract

A cooling apparatus for power modules includes a manifold cover and a pin plate, and generates vertical turbulent flow of the cooling fluid in such a way as to spray the cooling fluid vertically onto the heat-generating surface using cooling fins of a pin plate configured in the lengthwise and vertical directions of a manifold cover, which ensures cooling efficiency while minimizing flow rate losses caused by the vertical turbulent flow by improving the flow efficiency of the cooling fluid. The manifold cover is provided with a plurality of flow paths for the circulation of the cooling fluid that have different directions respectively for the inflow and the circulation of the cooling fluid and are different in volume or width, minimizing pressure losses during fluid circulation and resolving cooling imbalances through the cooling fins.

First claim

What is claimed is:

1 . A cooling apparatus for a power module, the apparatus comprising:
a cooling channel section; a manifold cover configured to circulate cooling fluid and house the power module and the cooling channel section matching the power module, wherein the cooling channel section includes a plurality of guide flow paths among which a first flow path is formed to have a first end portion open on an upstream side and a decreasing cross-sectional area toward a downstream side in a first direction and a second flow path is formed to have a first end portion open on the downstream side and an increasing cross-sectional area toward the downstream side from a second end portion of the second flow in the first direction; and a pin plate housed in the manifold cover, contacting with the power module, and including cooling pins facing the cooling channel section and extending in a second direction crossing the first direction, allowing the cooling fluid entering the first flow path to flow between the cooling pins and then exit through the second flow path.

2 . The apparatus of claim 1 ,
wherein the first flow path of the cooling channel section is formed with the first end portion open on the upstream side and a second end portion closed on the downstream side for the cooling fluid to enter from the open first end portion of the first flow path and circulate through the cooling fins, and wherein the second flow path is formed with the second end portion closed on the upstream side and the first end portion open on the downstream side for the cooling fluid entered through the cooling fins to circulate toward the downstream side.

3 . The apparatus of claim 1 , wherein the first flow path of the channel cooling section decreases in height toward the downstream side.

4 . The apparatus of claim 3 , wherein the second flow path increases in height toward the downstream side.

5 . The apparatus of claim 3 , wherein the second flow path increases in width toward the downstream side.

6 . The apparatus of claim 1 , wherein the first flow path decreases in width toward the downstream side.

7 . The apparatus of claim 6 , wherein the second flow path increases in height toward the downstream side.

8 . The apparatus of claim 6 , wherein the second flow path increases in width toward the downstream side.

9 . The apparatus of claim 1 , wherein the manifold cover includes a barrier portion formed between the first flow path and the second flow path separating the first flow path and the second flow path.

10 . The apparatus of claim 1 ,
wherein the power module is in plural and the manifold cover houses the plurality of power modules and the cooling channel section is in plural and the plurality of cooling channel sections corresponding to the plurality of power modules, and wherein the plurality of cooling channel sections include a connecting duct connecting a second flow path of a first cooling channel section located on the upstream side among the plurality of cooling channel sections and a first flow path of a second cooling channel section located on the downstream side among the plurality of cooling channel sections to fluidically-communicate with each other.

11 . The apparatus of claim 10 , wherein the connecting duct includes:
an inlet portion formed on the downstream side and connected to the second flow path of the first cooling channel section; and an outlet portion branched out and extending diagonally from the inlet portion and connected to at least two of first flow paths of the second cooling channel section, for merging outlet portions of different connecting ducts with one of first flow paths of adjacent different connecting ducts.

12 . The apparatus of claim 11 , wherein the connecting duct forms a triangular shape at a branching point from the inlet portion to the outlet portion.

13 . The apparatus of claim 1 ,
wherein the power module is in plural and the plurality of power modules include a first power module, a second power module, and a third power module in the first direction, wherein the manifold cover houses the first power module, the second power module, and the third power module in the first direction, and wherein the cooling channel section includes a first cooling channel section, a second cooling channel section, and a third cooling channel section in the first direction.

14 . The apparatus of claim 13 ,
wherein the third cooling channel section is smaller in volume for the guide flow paths than the first cooling channel section and the second cooling channel section.

15 . The apparatus of claim 13 , wherein the first power module is configured in a U phase of power, the second power module is configured in a V phase of power, and the third power module is configured in a W phase of power.

Assignees

• Hyundai Motor Co Ltd
• Kia Corp

Inventors

• Kwon Se Heun
• Park Hyong Joon
• Lee Sang Hun

Classifications

• H05K7/20927 Primary

  Liquid coolant without phase change · CPC title

• H05K7/20263

  Heat dissipaters releasing heat from coolant · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20218

  using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954) · CPC title

• H05K7/20272 Primary

  Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title