Method of assembling an optical device and optical device assembled according to the same

Patent metadata

Field	Value
Publication number	US-12483769-B2
Application number	US-202318204470-A
Country	US
Kind code	B2
Filing date	Jun 1, 2023
Priority date	Jun 7, 2022
Publication date	Nov 25, 2025
Grant date	Nov 25, 2025

Abstract

Method of assembling an optical device including providing a circuit board having an imager mounted thereto, wherein the imager has an active region. A housing is provided having a support for supporting the circuit board and an opening for an optical path to form an image at a known image position relative to the opening. The circuit board is placed on the support and its position is adjusted using one or more manipulators to align the active region with the image position. The circuit board may then be secured in an aligned position.

First claim

The invention claimed is:

1 . A method of assembling an optical device, the method comprising:
providing a circuit board having an imager mounted thereto, wherein the imager has an active region; providing a housing having a support for supporting the circuit board and an opening for an optical path to form an image at a known image position relative to the opening; placing the circuit board on the support; adjusting the position of the circuit board on the support using one or more manipulators inserted through the opening to align the active region with the image position; and securing the circuit board in the aligned position.

2 . The method of claim 1 , wherein the step of adjusting the position of the circuit board includes rotating the circuit board on the support to align the active region with the image position.

3 . The method of claim 1 , wherein the step of providing the housing includes providing a lens holder part of the housing and a backing part of the housing for connection to the lens holder part.

4 . The method of claim 3 , further comprising the step of fitting the lens holder part and the backing part together once the circuit board has been placed on the support, and wherein the support is formed in the backing part.

5 . The method of claim 3 , wherein the step of securing the circuit board in an aligned position includes connecting the lens holder part to the backing part and fixing the connection therebetween.

6 . The method of claim 5 , wherein the housing further includes one or more clamping formations, wherein the step of securing the circuit board includes the one or more clamping formations clamping the circuit board against the support.

7 . The method of claim 1 , wherein the step of providing a housing includes providing the support with an engagement surface for engaging the circuit board, wherein the engagement surface includes at least one of a heatsink surface for conducting heat away from the circuit board and a grounding surface for grounding the circuit board.

8 . The method of claim 1 , further comprising the step of projecting a projected image onto the known image position using a projector and the step of adjusting the position of the circuit board includes aligning the active region with the projected image.

9 . An optical device manufactured according to the method of claim 1 .

10 . A manufacturing apparatus for use during the method according to claim 1 , the apparatus comprising one or more manipulators and a controller configured to control the one or more manipulators to align the active region with the image position.

Assignees

• Aptiv Tech Ltd
• Aptiv Technologies AG

Inventors

• Rafalowski Arkadiusz
• Hebda Pawel

Classifications

• H04N23/55

  Optical parts specially adapted for electronic image sensors; Mounting thereof · CPC title

• H04N23/52

  Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements · CPC title

• H04N23/695

  Control of camera direction for changing a field of view, e.g. pan, tilt or based on tracking of objects · CPC title

• H04N23/51

  Housings · CPC title

• H04N23/54 Primary

  Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils · CPC title