Composite material capable of measuring bending deformation, spring including the same, and manufacturing method thereof

US12480556B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12480556-B2
Application numberUS-202117562667-A
CountryUS
Kind codeB2
Filing dateDec 27, 2021
Priority dateApr 15, 2021
Publication dateNov 25, 2025
Grant dateNov 25, 2025

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  5. First independent claim

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Abstract

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Provided is a composite material capable of measuring bending deformation, the composite material including: a first conductive composite body that is bendable; a dielectric body that is bendable and compressible; and a second conductive composite body that is bendable, wherein the first conductive composite body and the second conductive composite body are respectively stacked on both surfaces of the dielectric body, and heights of the first conductive composite body and the second conductive composite body from the dielectric body are different from each other.

First claim

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What is claimed is: 1 . A composite material capable of measuring bending deformation, the composite material comprising: a planar homogenous first conductive composite body that is bendable; a planar dielectric body that is bendable and compressible; and a planar homogenous second conductive composite body that is bendable, the composite material having a length dimension that is substantially larger than a thickness dimension, wherein the thickness of the composite material is comprised of the planar first conductive composite body, the planar dielectric body, and the planar second conductive composite body, wherein the first conductive composite body and the second conductive composite body are respectively stacked on and connected to both surfaces of the dielectric body, wherein when the composite material is bent with respect to the length dimension, the bending causes a compression of the planar dielectric body, which results in a change in capacitance between the first conductive composite body and the second conductive composite body, wherein the change in capacitance is substantially greater due to bending along the length dimension compared to a force applied normal to the first or second composite body, wherein the change in capacitance can be used to measure the bending deformation of the composite material, wherein heights of the first conductive composite body and the second conductive composite body from the dielectric body are different from each other, wherein the first conductive composite body is provided in an inner diameter direction and the second conductive composite body is provided in an outer diameter direction, and the second conductive composite body is thinner than the first conductive composite body. 2 . The composite material capable of measuring bending deformation of claim 1 , wherein the dielectric body is a compressible foam. 3 . The composite material capable of measuring bending deformation of claim 2 , wherein the dielectric body is a foam comprising at least one selected from the group consisting of polyvinyl chloride (PVC), polyurethane (PU), melamine, polymethacrylimide (PMI), polyethylene terephthalate (PET), and polyvinylidene fluoride (PVDF). 4 . The composite material capable of measuring bending deformation of claim 1 , wherein the composite material is capable of measuring bending deformation without any sensors, traces, or protrusions between an outer surface of the first conductive composite body and an outer surface of the second conductive composite body. 5 . The composite material capable of measuring bending deformation of claim 4 , wherein the first and second conductive composite bodies comprise at least one selected from the group consisting of a uni-directional carbon fiber composite, a carbon fabric composite, and a short carbon fiber composite. 6 . The composite material capable of measuring bending deformation of claim 1 , wherein the first conductive composite body and the second conductive composite body are carbon fiber reinforced plastics. 7 . The composite material capable of measuring bending deformation of claim 1 , wherein the first conductive composite body and the second conductive composite body are in bent shapes. 8 . The composite material capable of measuring bending deformation of claim 1 , wherein the dielectric body has a lower density than the first conductive composite body and the second conductive composite body. 9 . The composite material capable of measuring bending deformation of claim 1 , wherein the dielectric body is a foam comprising at least one selected from the group consisting of polyvinyl chloride (PVC), polyurethane (PU), melamine, polymethacrylimide (PMI), polyethylene terephthalate (PET), and polyvinylidene fluoride (PVDF). 10 . The composite material capable of measuring bending deformation of claim 1 , wherein the first and second conductive composite bodies comprise at least one selected from the group consisting of a uni-directional carbon fiber composite, a carbon fabric composite, and a short carbon fiber composite. 11 . A spring capable of measuring bending deformation of itself, the spring comprising: a planar first conductive composite body that is bendable; a planar dielectric body that is bendable and compressible; and a planar second conductive composite body that is bendable, wherein the first conductive composite body and the second conductive composite body are respectively stacked on both surfaces of the dielectric body, wherein heights of the first conductive composite body and the second conductive composite body from the dielectric body are different from each other, wherein deformation of the dielectric body in a thickness direction is greater than deformation in length or other directions according to bending deformation of the composite material, causing a change in capacitance between the first conductive composite body and the second conductive composite body, wherein the change in capacitance can be used to measure the bending deformation of the spring, wherein the spring is capable of measuring bending deformation without any sensors, traces, or protrusions between an outer surface of the first conductive composite body and an outer surface of the second conductive composite body, wherein the first conductive composite body is provided in an inner diameter direction and the second conductive composite body is provided in an outer diameter direction, and the second conductive composite body is thinner than the first conductive composite body. 12 . The spring of claim 11 , wherein the composite material of the spring is configured to store elastic energy produced when the spring is compressed in the dielectric body and then release the elastic energy upon recovery. 13 . The spring of claim 11 , wherein an amount of compression of the spring can be measured based on the deformation of the dielectric body in the thickness direction. 14 . The spring of claim 11 , wherein an amount of compression of the spring can be measured based on a change in capacitance between the first conductive composite body and the second conductive composite body.

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What does patent US12480556B2 cover?
Provided is a composite material capable of measuring bending deformation, the composite material including: a first conductive composite body that is bendable; a dielectric body that is bendable and compressible; and a second conductive composite body that is bendable, wherein the first conductive composite body and the second conductive composite body are respectively stacked on both surfaces…
Who is the assignee on this patent?
Korea Advanced Inst Sci & Tech
What technology area does this patent fall under?
Primary CPC classification G01B7/22. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 25 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).