Display substrate and preparation method thereof, and display apparatus each including partition region provides with at least one partition dam surrounding function hole

Patent metadata

Field	Value
Publication number	US-12477932-B2
Application number	US-202117913172-A
Country	US
Kind code	B2
Filing date	Nov 29, 2021
Priority date	Nov 29, 2021
Publication date	Nov 18, 2025
Grant date	Nov 18, 2025

Abstract

Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a display region and at least one hole region located in the display region, the hole region includes a function hole and a partition region surrounding the function hole, the partition region is provided with at least one partition dam surrounding the function hole; the partition dam includes a first partition layer disposed on a base substrate and a second partition layer disposed on a side of the first partition layer away from the base substrate, at least one partition layer includes a second sub-layer and a third sub-layer disposed on a side of the second sub-layer away from the base substrate, the third sub-layer has a protrusion with respect to a sidewall of the second sub-layer, and the protrusion and the sidewall of the second sub-layer form an inwardly recessed structure.

First claim

The invention claimed is:

1 . A display substrate, comprising a display region and at least one hole region located in the display region, wherein the hole region comprises a function hole and a partition region surrounding the function hole, and the partition region is provided with at least one partition dam surrounding the function hole; the partition dam comprises a first partition layer disposed on a base substrate and a second partition layer disposed on a side of the first partition layer away from the base substrate, at least one partition layer of the first partition layer and the second partition layer comprises a second sub-layer and a third sub-layer disposed on a side of the second sub-layer away from the base substrate, the third sub-layer has a protrusion with respect to a sidewall of the second sub-layer, the protrusion and the sidewall of the second sub-layer form an inwardly recessed structure,
wherein the at least one partition layer further comprises a first sub-layer, and the second sub-layer is disposed on a side of the first sub-layer away from the base substrate, and wherein the first partition layer comprises a first conductive sub-layer, a second conductive sub-layer disposed on a side of the first conductive sub-layer away from the base substrate, and a third conductive sub-layer disposed on a side of the second conductive sub-layer away from the base substrate; along a direction away from the function hole, a width of the second conductive sub-layer is smaller than each of widths of the first conductive sub-layer and the third conductive sub-layer, an orthographic projection of the second conductive sub-layer on the base substrate is within each of a range of an orthographic projection of the first conductive sub-layer and a range of an orthographic projection of the third conductive sub-layer on the base substrate, the first conductive sub-layer and the third conductive sub-layer have protrusions with respect to a sidewall of the second conductive sub-layer, and the protrusions and the sidewall of the second conductive sub-layer form an inwardly recessed structure.

2 . The display substrate according to claim 1 , wherein the second partition layer comprises a first metal sub-layer disposed on a side of the first partition layer away from the base substrate, a second metal sub-layer disposed on a side of the first metal sub-layer away from the base substrate, and a third metal sub-layer disposed on a side of the second metal sub-layer away from the base substrate; along the direction away from the function hole, a width of the second metal sub-layer is smaller than each of widths of the first metal sub-layer and the third metal sub-layer, an orthographic projection of the second metal sub-layer on the base substrate is within each of a range of an orthographic projection of the first metal sub-layer and a range of an orthographic projection of the third metal sub-layer on the base substrate, the first metal sub-layer and the third metal sub-layer have protrusions with respect to a sidewall of the second metal sub-layer, and the protrusions and the sidewall of the second metal sub-layer form an inwardly recessed structure.

3 . The display substrate according to claim 2 , wherein along the direction away from the function hole, a width of the first metal sub-layer is smaller than a width of the first conductive sub-layer, and an orthographic projection of the first metal sub-layer on the base substrate is within a range of an orthographic projection of the first conductive sub-layer on the base substrate.

4 . The display substrate according to claim 2 , wherein along the direction away from the function hole, the width of the second metal sub-layer is smaller than the width of the second conductive sub-layer, and the orthographic projection of the second conductive sub-layer on the base substrate is within a range of an orthographic projection of the second metal sub-layer on the base substrate.

5 . The display substrate according to claim 2 , wherein along the direction away from the function hole, a width of the third metal sub-layer is smaller than a width of the third conductive sub-layer, and an orthographic projection of the third conductive sub-layer on the base substrate is within a range of an orthographic projection of the third metal sub-layer on the base substrate.

6 . The display substrate according to claim 2 , wherein along the direction away from the function hole, a width of the third metal sub-layer is less than or equal to a width of the first metal sub-layer, and an orthographic projection of the third metal sub-layer on the base substrate is within a range of an orthographic projection of the first metal sub-layer on the base substrate; a width of the third conductive sub-layer is less than or equal to a width of the first conductive sub-layer, and an orthographic projection of the third conductive sub-layer on the base substrate is within a range of an orthographic projection of the first conductive sub-layer on the base substrate; the width of the first metal sub-layer is less than or equal to the width of the third conductive sub-layer, and the orthographic projection of the first metal sub-layer on the base substrate is within a range of the orthographic projection of the third conductive sub-layer on the base substrate.

7 . The display substrate according to claim 2 , wherein along the direction away from the function hole, a width of the third metal sub-layer is greater than a width of the first metal sub-layer, and an orthographic projection of the first metal sub-layer on the base substrate is within a range of an orthographic projection of the third metal sub-layer on the base substrate; a width of the third conductive sub-layer is smaller than a width of the first conductive sub-layer, and an orthographic projection of the third conductive sub-layer on the base substrate is within a range of an orthographic projection of the first conductive sub-layer on the base substrate; the width of the first metal sub-layer is equal to the width of the third conductive sub-layer, and the orthographic projection of the first metal sub-layer on the base substrate is substantially overlapped with the orthographic projection of the third conductive sub-layer on the base substrate.

8 . The display substrate according to claim 2 , wherein a distance between an edge of the third metal sub-layer and the base substrate is less than a distance between a surface of the second metal sub-layer on a side away from the base substrate and the base substrate.

9 . The display substrate according to claim 1 , wherein the second partition layer comprises a first metal sub-layer disposed on a side of the first partition layer away from the base substrate, a second metal sub-layer disposed on a side of the first metal sub-layer away from the base substrate, and a third metal sub-layer disposed on a side of the second metal sub-layer away from the base substrate; a cross-sectional shape of the second metal sub-layer is a second trapezoid, the second trapezoid comprises a second lower bottom on a side close to the base substrate and a second upper bottom on a side away from the base substrate; along the direction away from the function hole, a width of the second upper bottom is smaller than a width of the second lower bottom, an orthographic projection of the second upper bottom on the base substrate is within a range of an orthographic projection of the second lower bottom on the base substrate; a width of the third metal sub-layer is less than or equal to the width of the second upper bottom, and an orthographic projection of the third metal sub-layer on the base substrate is within a range of the orthographic projection of

Assignees

• Chengdu Boe Optoelect Tech Co
• Boe Technology Group Co Ltd
• Beijing Boe Technology Dev Co Ltd

Inventors

• Du Nan
• Su Guowei
• Chung Chiehhsing
• Fu Yongyi
• Zhou Yong
• Bai Feng
• Sun Saijun
• Chen Kaihao
• Peng Suoping
• Song Kechao
• Xu Zhengping
• Liu Sa
• Li Hexiong

Classifications

• H10K59/1201

  Manufacture or treatment · CPC title

• H10K59/60

  OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes · CPC title

• H10K50/80

  Constructional details · CPC title

• H10K59/00

  Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00 · CPC title

• H10K59/65

  OLEDs integrated with inorganic image sensors · CPC title