Two-phase immersion-cooling heat-dissipation structure having skived fins

Patent metadata

Field	Value
Publication number	US-12477695-B2
Application number	US-202318104839-A
Country	US
Kind code	B2
Filing date	Feb 2, 2023
Priority date	Feb 2, 2023
Publication date	Nov 18, 2025
Grant date	Nov 18, 2025

Abstract

A two-phase immersion-cooling heat-dissipation structure having skived fins includes an immersion-cooling substrate and a plurality of immersion-cooling fins. The immersion-cooling substrate has a top surface and a bottom surface that are opposite to each other, the bottom surface is used for contacting a heat-generating component immersed in a two-phase coolant, the top surface is connected with the plurality of immersion-cooling fins, the plurality of immersion-cooling fins include at least one skived fin integrally formed on the top surface of the immersion-cooling substrate, and the plurality of immersion-cooling fins are non-linearly arranged. A thickness of any one of the plurality of immersion-cooling fins ranges from 0.1 mm to 0.35 mm, a height of any one of the plurality of immersion-cooling fins ranges from 5 mm to 10 mm, and a gap between any two of the plurality of immersion-cooling fins ranges from 0.1 mm to 0.35 mm.

First claim

What is claimed is:

1 . A two-phase immersion-cooling heat-dissipation structure having skived fins, comprising:
an immersion-cooling substrate and a plurality of immersion-cooling fins,
wherein the immersion-cooling substrate has a top surface and a bottom surface that are opposite to each other, the bottom surface of the immersion-cooling substrate is used for contacting a heat-generating component immersed in a two-phase coolant, the top surface of the immersion-cooling substrate is connected with the plurality of immersion-cooling fins, the plurality of immersion-cooling fins include at least one skived fin integrally formed on the top surface of the immersion-cooling substrate, the plurality of immersion-cooling fins are non-linearly arranged, and wherein a thickness of any one of the plurality of immersion-cooling fins ranges from 0.1 mm to 0.35 mm, a height of any one of the plurality of immersion-cooling fins ranges from 5 mm to 10 mm, and a gap between any two of the plurality of immersion-cooling fins ranges from 0.1 mm to 0.35 mm.

2 . The two-phase immersion-cooling heat-dissipation structure having skived fins according to claim 1 , wherein an included angle between a tangent line of any point on an outline of any one of the plurality of immersion-cooling fins and a direction perpendicular to an arrangement direction of the plurality of immersion-cooling fins is less than 45 degrees.

3 . The two-phase immersion-cooling heat-dissipation structure having skived fins according to claim 1 , wherein a gap between at least two of the plurality of immersion-cooling fins is different from a gap between another two of the plurality of immersion-cooling fins.

4 . The two-phase immersion-cooling heat-dissipation structure having skived fins according to claim 1 , wherein the plurality of immersion-cooling fins are made of one of copper and copper alloy.

5 . The two-phase immersion-cooling heat-dissipation structure having skived fins according to claim 1 , wherein a surface roughness of each of the plurality of immersion-cooling fins is Ra>1.5 μm.

6 . The two-phase immersion-cooling heat-dissipation structure having skived fins according to claim 1 , further including: a reinforced outer frame attached to the immersion-cooling substrate and surrounding at least a portion of the plurality of immersion-cooling fins.

7 . The two-phase immersion-cooling heat-dissipation structure having skived fins according to claim 6 , wherein at least one of the immersion-cooling substrate and the reinforced outer frame is formed with a plurality of through holes, and a plurality of spring screws are configured to pass correspondingly through the plurality of through holes.

8 . The two-phase immersion-cooling heat-dissipation structure having skived fins according to claim 1 , further including: a high thermal conductivity structure attached to the bottom surface of the immersion-cooling substrate, such that the immersion-cooling substrate is in an indirect contact with the heat-generating component through the high thermal conductivity structure, and wherein an airtight vacuum cavity is formed inside the high thermal conductivity structure, and the vacuum airtight cavity contains liquid.

Assignees

• Amulaire Thermal Tech Inc

Inventors

• Yang Ching-Ming
• Wu Chun-Te
• Yeh Tze-Yang
• Chiu Yu-Wei

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H05K7/20236

  by immersion · CPC title

• H05K7/20418 Primary

  the radiating structures being additional and fastened onto the housing · CPC title

• H01L23/427

  Electricity · mapped topic