Systems and methods for cooling electronic devices

Patent metadata

Field	Value
Publication number	US-12477688-B2
Application number	US-202318140925-A
Country	US
Kind code	B2
Filing date	Apr 28, 2023
Priority date	Apr 28, 2023
Publication date	Nov 18, 2025
Grant date	Nov 18, 2025

Abstract

The present disclosure is directed to systems and methods for cooling electronic devices. The system comprises a pump, a distribution manifold fluidly coupled to the pump, one or more capillary coolers fluidly coupled to the distribution manifold, one or more electronic devices coupled to the one or more capillary coolers, a vapor line fluidly coupled to the one or more capillary coolers, and a condenser comprising an inlet and an outlet, wherein the inlet is fluidly coupled to the vapor line and the outlet is fluidly coupled to the pump.

First claim

What is claimed is:

1 . A system for cooling electronic devices, the system comprising:
a pump; a distribution manifold fluidly coupled to the pump, wherein the distribution manifold is placed vertically above one or more capillary coolers and the one or more capillary coolers are fluidly coupled to the distribution manifold; one or more of the electronic devices coupled to the one or more capillary coolers; a vapor line fluidly coupled to the one or more capillary coolers; and a condenser comprising an inlet and an outlet, wherein the inlet is fluidly coupled to the vapor line and the outlet is fluidly coupled to the pump.

2 . The system of claim 1 , wherein the distribution manifold comprises a fluid reservoir.

3 . The system of claim 1 , wherein the system is arranged in a data center.

4 . The system of claim 1 , further comprising a valve fluidly coupled to the distribution manifold and the one or more capillary coolers.

5 . The system of claim 4 , further comprising a controller operable to open and close the valve.

6 . The system of claim 5 , further comprising a temperature sensor, wherein the temperature sensor is arranged to monitor a temperature of the one or more electronic devices and the temperature sensor is coupled to the controller.

7 . The system of claim 5 , wherein the controller is coupled to the one or more electronic devices, and wherein the controller is arranged to monitor a power consumption level of the one or more electronic devices.

8 . The system of claim 1 , further comprising a controller operable to activate and deactivate the pump.

9 . A data center comprising:
a system for cooling electronic devices, the system comprising: a pump; a distribution manifold fluidly coupled to the pump, wherein the distribution manifold is placed vertically above one or more capillary coolers and the one or more capillary coolers are fluidly coupled to the distribution manifold; one or more of the electronic devices coupled to the one or more capillary coolers; a vapor line fluidly coupled to the one or more capillary coolers; and a condenser comprising an inlet and an outlet, wherein the inlet is fluidly coupled to the vapor line and the outlet is fluidly coupled to the pump.

10 . The system of claim 9 , further comprising a valve fluidly coupled to the distribution manifold and the one or more capillary coolers.

11 . The system of claim 10 , further comprising a controller operable to open and close the valve.

12 . The system of claim 11 , further comprising a temperature sensor, wherein the temperature sensor is arranged to monitor a temperature of the one or more electronic devices and the temperature sensor is coupled to the controller.

13 . The system of claim 11 , wherein the controller is coupled to the one or more electronic devices, and wherein the controller is arranged to monitor a power consumption level of the one or more electronic devices.

14 . The system of claim 9 , further comprising a controller operable to activate and deactivate the pump.

Assignees

• Toyota Eng & Mfg North America
• Toyota Motor Co Ltd

Inventors

• Lohan Danny J
• Joshi Shailesh N
• Dede Ercan M

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• F28D15/043

  forming loops, e.g. capillary pumped loops · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

• F28D15/025

  having non-capillary condensate return means · CPC title

• H05K7/20836

  Thermal management, e.g. server temperature control · CPC title