Arrangement of two secondary circuit boards within an electronic device

Patent metadata

Field	Value
Publication number	US-12477666-B2
Application number	US-202218002199-A
Country	US
Kind code	B2
Filing date	Aug 19, 2022
Priority date	Dec 8, 2021
Publication date	Nov 18, 2025
Grant date	Nov 18, 2025

Abstract

An electronic assembly includes a first electronic component, a second electronic component, and a primary circuit board. The first electronic component is provided with a first secondary circuit board, the second electronic component is provided with a second secondary circuit board, the first secondary circuit board is electrically connected to the primary circuit board by using a first electrical connector, interlayer space is formed between the first secondary circuit board and the primary circuit board, a portion of the second secondary circuit board that enters the interlayer space overlaps the first secondary circuit board and is electrically connected to the primary circuit board by using a second electrical connector, the first electrical connector is located between the first secondary circuit board and the primary circuit board, and the second electrical connector is located between the second secondary circuit board and the primary circuit board.

First claim

What is claimed is:

1 . An electronic assembly, comprising:
a first electronic component with a first secondary circuit board; a second electronic component with a second secondary circuit board; and a primary circuit board; wherein the first secondary circuit board is electrically connected to the primary circuit board by a first electrical connector, interlayer space capable of accommodating the second secondary circuit board is formed between the first secondary circuit board and the primary circuit board, a portion of the second secondary circuit board that enters the interlayer space overlaps the first secondary circuit board and is electrically connected to the primary circuit board with a second electrical connector, and in an overlapping direction, the second secondary circuit board is located between the first secondary circuit board and the primary circuit board, the first electrical connector is located between the first secondary circuit board and the primary circuit board, and the second electrical connector is located between the second secondary circuit board and the primary circuit board; and wherein an operating height of the first electrical connector is greater than an operating height of the second electrical connector; and wherein the electronic assembly further comprises:
a positioning mechanism configured to position the first secondary circuit board and the second secondary circuit board, wherein the positioning mechanism comprises at least one positioning column perpendicular to the first secondary circuit board and the second secondary circuit board, and the first secondary circuit board is provided with a first positioning hole or a first positioning groove for the positioning column to pass through, and the second secondary circuit board is provided with a second positioning hole or a second positioning groove for the positioning column to pass through.

2 . The electronic assembly of claim 1 , wherein an adhesive layer is provided in regions that overlap each other between the second secondary circuit board and the first secondary circuit board.

3 . The electronic assembly of claim 1 , wherein a cross section of the positioning column is circular or polygonal, and the first positioning hole or the first positioning groove and the second positioning hole or the second positioning groove have a shape capable of fitting in with the positioning column.

4 . The electronic assembly of claim 1 , wherein the second secondary circuit board is a flexible circuit board.

5 . The electronic assembly of claim 1 , wherein the first electronic component comprises an optical proximity sensor, an ambient light sensor, or an optical proximity-ambient light integrated sensor, and the second electronic component comprises one, two, or three of a camera, a speaker, and a vibration motor.

6 . The electronic assembly of claim 1 , wherein a difference between the operating height of the first electrical connector and the operating height of the second electrical connector is equal to a distance from one side of the first secondary circuit board that faces the primary circuit board to one side of the second secondary circuit board that faces the primary circuit board.

7 . The electronic assembly of claim 6 , wherein the second secondary circuit board overlaps a local region of the first secondary circuit board, and a single-layer non-overlapped region and a dual-layer overlapped region are formed after the overlapping of the two secondary circuit boards; and the first electrical connector is distributed along an edge of the non-overlapped region, and the second electrical connector is distributed along an edge of the overlapped region.

8 . The electronic assembly of claim 7 , wherein the first electrical connector is a first elastomer, first conductive silica gel, or first conductive foam; and the second electrical connector is a second elastomer, second conductive silica gel, or second conductive foam.

9 . The electronic assembly of claim 1 , wherein the positioning mechanism comprises a positioning frame configured to bear the first secondary circuit board, and an inner wall of the positioning frame is provided with a positioning rib protruding towards the inside of the positioning frame, to position the first secondary circuit board and the second secondary circuit board.

10 . The electronic assembly of claim 9 , wherein a glue layer is provided between the first secondary circuit board and a bearing surface of the positioning frame.

11 . The electronic assembly of claim 9 , wherein the first secondary circuit board is provided with a first abutting portion, the second secondary circuit board is provided with a second abutting portion, and both the first abutting portion and the second abutting portion abut against the positioning rib.

12 . The electronic assembly of claim 11 , wherein the first abutting portion comprises a first right-angle portion formed on a side wall of the first secondary circuit board, the second abutting portion comprises a second right-angle portion formed on a side wall of the second secondary circuit board, the first right-angle portion is disposed opposite to the second right-angle portion, and the first right-angle portion and the second right-angle portion each abut against a side wall of the positioning rib.

13 . An electronic device, comprising:
a housing; and an electronic assembly disposed inside the housing; wherein the electronic assembly comprises: a first electronic component with a first secondary circuit board; a second electronic component with a second secondary circuit board; and a primary circuit board; wherein the first secondary circuit board is electrically connected to the primary circuit board by a first electrical connector, interlayer space capable of accommodating the second secondary circuit board is formed between the first secondary circuit board and the primary circuit board, a portion of the second secondary circuit board that enters the interlayer space overlaps the first secondary circuit board and is electrically connected to the primary circuit board with a second electrical connector, and in an overlapping direction, the second secondary circuit board is located between the first secondary circuit board and the primary circuit board, the first electrical connector is located between the first secondary circuit board and the primary circuit board, and the second electrical connector is located between the second secondary circuit board and the primary circuit board; wherein an operating height of the first electrical connector is greater than an operating height of the second electrical connector; and wherein the electronic assembly further comprises:
a positioning mechanism configured to position the first secondary circuit board and the second secondary circuit board, wherein the positioning mechanism comprises at least one positioning column perpendicular to the first secondary circuit board and the second secondary circuit board, and the first secondary circuit board is provided with a first positioning hole or a first positioning groove for the positioning column to pass through, and the second secondary circuit board is provided with a second positioning hole or a second positioning groove for the positioning column to pass through.

14 . The electronic device of claim 13 , wherein a cross section of the positioning column is circular or polygonal, and the first positioning hole or the first positioning groove and the second positioning hole or the second positioning groove have a shape capable of fitting in with the positioning colu

Assignees

• Honor Device Co Ltd

Inventors

• Xue Kangle
• Gao Jiuliang
• Yang Lijun
• Gao Baojun

Classifications

• H05K2201/10151

  Sensor · CPC title

• H05K2201/10121

  Optical component, e.g. opto-electronic component · CPC title

• H05K2201/1009

  Electromotor · CPC title

• H05K2201/10083

  Electromechanical or electro-acoustic component, e.g. microphone · CPC title

• H05K13/0015

  Orientation; Alignment; Positioning · CPC title