Electronic modules for co-packaged optics and copper packages

Patent metadata

Field	Value
Publication number	US-12474533-B2
Application number	US-202318198890-A
Country	US
Kind code	B2
Filing date	May 18, 2023
Priority date	May 18, 2023
Publication date	Nov 18, 2025
Grant date	Nov 18, 2025

Abstract

Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. Some embodiments of the present invention may be directed to an electronic module that includes a multi-chip module (MCM) substrate having a first surface configured to be connected to a system printed circuit board and a second surface defining a central portion and a peripheral portion. The electronic module may include a main die positioned on the central portion of the second surface of the MCM substrate and in electrical communication with electrical traces of the MCM substrate. The electronic module may include MCM sockets positioned on the peripheral portion of the MCM substrate, where each MCM socket is configured to engage and support a mezzanine package substrate such that a main portion of the mezzanine package substrate extends beyond the peripheral portion of the MCM substrate.

First claim

What is claimed is:

1 . An electronic module, comprising:
a multi-chip module (MCM) substrate having (i) a first surface comprising a ball grid array (BGA) configured to be connected to a system printed circuit board (PCB) and (ii) a second surface opposite the first surface, wherein the second surface defines a central portion and a peripheral portion, and wherein the MCM substrate comprises electrical traces; a main die positioned on the central portion of the second surface of the MCM substrate and in electrical communication with the electrical traces; and a plurality of MCM sockets positioned on the peripheral portion of the MCM substrate, wherein each MCM socket of the plurality of MCM sockets is in electrical communication with the electrical traces of the MCM substrate and is configured to:
engage and support a mezzanine package substrate via a connector portion of the mezzanine package substrate such that a main portion of the mezzanine package substrate extends beyond the peripheral portion of the MCM substrate, wherein the main portion of the mezzanine package substrate is larger than the connector portion of the mezzanine package substrate; and
electrically connect the mezzanine package substrate to the main die via at least one of the electrical traces of the MCM substrate.

2 . The electronic module of claim 1 , wherein each MCM socket of the plurality of MCM sockets comprises:
a socket frame defining a peripheral access opening that is configured to allow the main portion of the mezzanine package substrate to extend beyond an edge of the MCM socket; and a socket pin array within the socket frame and configured to engage the second surface of the MCM substrate and electrically connect the mezzanine package substrate to the main die via at least one of the electrical traces of the MCM substrate.

3 . The electronic module of claim 2 , wherein a pitch of the BGA is greater than a pitch of the socket pin array.

4 . The electronic module of claim 1 , further comprising an attachment member configured to be applied to a connector portion of at least one mezzanine package substrate so as to mechanically secure the at least one of the mezzanine package substrate with respect to a corresponding one of the plurality of MCM sockets, wherein the attachment member is configured to be attached to the system PCB.

5 . The electronic module of claim 4 , wherein the attachment member is a contiguous element configured to simultaneously secure a plurality of connector portions of mezzanine package substrates in the corresponding plurality of MCM sockets.

6 . The electronic module of claim 1 , wherein the plurality of MCM sockets is configured to electrically connect high speed signal pins and ground isolation pins of mezzanine package substrates to the electrical traces of the MCM substrate.

7 . An electronic module, comprising:
a multi-chip module (MCM) comprising:
an MCM substrate having (i) a first surface comprising a ball grid array (BGA) configured to be connected to a system printed circuit board (PCB) and (ii) a second surface opposite the first surface, wherein the second surface defines a central portion and a peripheral portion, and wherein the MCM substrate comprises electrical traces;
a main die positioned on the central portion of the MCM substrate and in electrical communication with the electrical traces; and
a plurality of MCM sockets positioned on the peripheral portion of the MCM substrate, wherein each MCM socket of the plurality of MCM sockets is in electrical communication with the electrical traces of the MCM substrate; and
a mezzanine package comprising a mezzanine package substrate comprising (i) a connector portion engaged and supported by a first MCM socket of the plurality of MCM sockets and (ii) a main portion extending beyond the peripheral portion of the MCM substrate, wherein the main portion of the mezzanine package substrate is larger than the connector portion of the mezzanine package substrate and wherein the main portion is configured to support one or more devices and electrically connect the one or more devices with the MCM substrate via the first MCM socket.

8 . The electronic module of claim 7 , wherein the mezzanine package is:
a co-packaged copper (CPC) package, wherein the one or more devices comprise one or more radio-frequency copper cable connectors; or a co-packaged optics (CPO) package, wherein the one or more devices comprise one or more optical devices.

9 . The electronic module of claim 7 , wherein the mezzanine package is a first mezzanine package, wherein the mezzanine package substrate is a first mezzanine package substrate, and wherein the electronic module comprises a second mezzanine package comprising:
a second mezzanine package substrate comprising (i) a connector portion engaged and supported by a second MCM socket of the plurality of MCM sockets and (ii) a main portion extending beyond the peripheral portion of the MCM substrate, wherein the main portion is configured to support one or more devices and electrically connect the one or more devices with the MCM substrate via the second MCM socket.

10 . The electronic module of claim 9 , wherein:
the first mezzanine package is a co-packaged copper (CPC) package; and the second mezzanine package is a co-packaged optics (CPO) package.

11 . The electronic module of claim 7 , wherein the mezzanine package is a co-packaged optics (CPO) package comprising a power connection positioned on the main portion of the mezzanine package substrate, and wherein the power connection is configured to receive power for the CPO package from the system PCB.

12 . The electronic module of claim 7 , wherein the mezzanine package is a co-packaged optics (CPO) package comprising an input/output connection positioned on the main portion of the mezzanine package substrate, and wherein the input/output connection is configured to transmit input/output signals between the CPO package and the system PCB.

13 . The electronic module of claim 7 , wherein the mezzanine package is a co-packaged optics (CPO) package, wherein the main portion of the mezzanine package substrate is configured to support the one or more devices on a first surface of the mezzanine package substrate, and wherein the first surface of the mezzanine package substrate is oriented toward the system PCB when the connector portion of the mezzanine package is positioned within the first MCM socket.

14 . The electronic module of claim 7 , comprising a support member disposed beyond the peripheral portion of the MCM substrate and configured to be positioned between the main portion of the mezzanine package substrate and the system PCB and to support the main portion of the mezzanine package substrate with respect to the system PCB.

15 . The electronic module of claim 7 , wherein the mezzanine package is a co-packaged optics (CPO) package, and wherein the one or more devices comprise a plurality of photonic integrated circuits (PICs).

16 . The electronic module of claim 15 , wherein the CPO package comprises, for each PIC of the plurality of PICs, an optical connector.

17 . A method of assembling an electronic device, the method comprising:
providing a multi-chip module (MCM) comprising (i) an MCM substrate having a first surface and a second surface opposite the first surface, wherein the second surface defines a central portion and a peripheral portion, and wherein the MCM substrate comprises electrical traces, and (ii) a main die positioned on the central portion of the second surface and in elec

Assignees

• Mellanox Technologies Ltd

Inventors

• Oren Amit
• Freedman Barak
• Dietrich Casper

Classifications

• H10W90/701 Primary

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W72/072

  of bump connectors · CPC title

• G02B6/4279

  Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations · CPC title

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• G02B6/4284 Primary

  of optical modules with disconnectable electrical connectors (latching arms for electrical connectors H01R13/627) · CPC title