Electronic element mounting substrate, electronic device, and electronic module
US-2021210408-A1 · Jul 8, 2021 · US
Stacked electrode, electrode-equipped strain resistance film, and pressure sensor
US12474225B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12474225-B2 |
| Application number | US-202218278066-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 25, 2022 |
| Priority date | Mar 3, 2021 |
| Publication date | Nov 18, 2025 |
| Grant date | Nov 18, 2025 |
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- Title
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Abstract
Official abstract text for this publication.
A stacked electrode is provided on a strain resistance film, wherein: the strain resistance film contains Cr and Al; the stacked electrode has a contact layer that overlaps the strain resistance film, a diffusion prevention layer that overlaps the contact layer, and a mounting layer that overlaps the diffusion prevention layer; and the diffusion prevention layer or the mounting layer covers the contact layer so that an end surface of the contact layer is not exposed.
First claim
Opening claim text (preview).
The invention claimed is: 1 . A stacked electrode provided on a strain resistance film containing Cr and Al, comprising: a contact layer overlying the strain resistance film; a diffusion prevention layer overlying the contact layer; and a mounting layer overlying the diffusion prevention layer, wherein the diffusion prevention layer or the mounting layer covers the contact layer so that the contact layer is not exposed. 2 . The stacked electrode according to claim 1 , wherein the mounting layer or the diffusion prevention layer is in contact with an upper surface of the strain resistance film at a position outside an end surface of the contact layer. 3 . The stacked electrode according to claim 1 , wherein the mounting layer among the diffusion prevention layer and the mounting layer covers the contact layer so that an end surface of the contact layer is not exposed. 4 . The stacked electrode according to claim 1 , wherein the diffusion prevention layer covers the contact layer so that an end surface of the contact layer is not exposed, and the mounting layer covers the diffusion prevention layer so that an end surface of the diffusion prevention layer is not exposed. 5 . The stacked electrode according to claim 1 , wherein the mounting layer overlying the diffusion prevention layer or the diffusion prevention layer overlying the contact layer obliquely extends toward an upper surface of the strain resistance film located outside an end surface of the contact layer. 6 . The stacked electrode according to claim 1 , wherein an unevenness is formed on an interface between the mounting layer or the diffusion prevention layer and the strain resistance film. 7 . The stacked electrode according to claim 1 , wherein the contact layer contains Ti, the diffusion prevention layer contains a platinum group element, and the mounting layer contains Au. 8 . An electrode-equipped strain resistance film comprising: the stacked electrode according to claim 1 ; and the strain resistance film provided with the stacked electrode. 9 . A pressure sensor comprising: the stacked electrode according to claim 1 ; the strain resistance film provided with the stacked electrode; and a membrane provided with the strain resistance film.
Assignees
Inventors
Classifications
Protection against aggressive medium in general · CPC title
against moisture or humidity · CPC title
Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms (details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively) · CPC title
- G01L1/2287Primary
constructional details of the strain gauges (adjustable resistors H01C10/00) · CPC title
- G01L9/0055Primary
bonded on a diaphragm · CPC title
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Frequently asked questions
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- What does patent US12474225B2 cover?
- A stacked electrode is provided on a strain resistance film, wherein: the strain resistance film contains Cr and Al; the stacked electrode has a contact layer that overlaps the strain resistance film, a diffusion prevention layer that overlaps the contact layer, and a mounting layer that overlaps the diffusion prevention layer; and the diffusion prevention layer or the mounting layer covers the…
- Who is the assignee on this patent?
- Tdk Corp
- What technology area does this patent fall under?
- Primary CPC classification G01L1/2287. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Nov 18 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).