Two component (2K) composition based on modified epoxy resins

Patent metadata

Field	Value
Publication number	US-12473427-B2
Application number	US-202217568425-A
Country	US
Kind code	B2
Filing date	Jan 4, 2022
Priority date	Jul 9, 2019
Publication date	Nov 18, 2025
Grant date	Nov 18, 2025

Abstract

The present invention is directed to a two component (2K) composition comprising:
(A) a first component comprising:
a) at least one epoxy resin different from said resin b); and, b) at least one elastomer modified epoxy resin;
(B) a second component comprising:
c) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative being characterized by comprising at least one alkoxy-containing aminofunctional silicone resin,

wherein said composition is characterized in that it is free of catalysts.

First claim

What is claimed is:

1 . A two component (2K) composition comprising:
(A) a first component comprising:
a) at least one epoxy resin different from said resin b); and,
b) at least one elastomer modified epoxy resin in an amount of 1 to 40 wt %, based on the total weight of the first component;
(B) a second component comprising:
c) a curative which comprises at least one compound possessing at least two epoxide reactive groups per molecule, said curative comprising at least one alkoxy-containing aminofunctional silicone resin,

wherein said composition is free of catalyst, wherein said elastomer modified epoxy resin b) has an epoxide equivalent weight of from 200 to 2500 g/eq.

2 . The two component composition according to claim 1 , wherein:
A) the first component comprises, based on weight of said first component:
from 10 to 60 wt. % of a) said at least one epoxy resin a);
B) the second component comprises:
c) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative comprising at least one alkoxy-containing aminofunctional silicone resin,

wherein said two component composition has a molar ratio of epoxide reactive groups provided in said curative c) to epoxide groups of from 0.90:1 to 1.2:1.

3 . The two component composition according to claim 1 , wherein said at least one epoxy resin a) is selected from: glycidyl ethers of polyhydric alcohols and polyhydric phenols; glycidyl esters of polycarboxylic acids; and, epoxidized polyethylenically unsaturated hydrocarbons, esters, ethers and amides.

4 . The two component composition according to claim 1 , wherein said elastomer modified epoxy resin b) has an epoxide equivalent weight of from 200 to 500 g/eq.

5 . The two component composition according to claim 1 , wherein said at least one elastomer modified epoxy resin b) comprises at least one dimer acid-modified epoxy resin.

6 . The two component composition according to claim 5 , wherein said at least one dimer acid-modified epoxy resin is a reaction product of catalyzed addition reaction between an epoxide compound and C36 to C44 aliphatic diacid.

7 . The two component composition according to claim 1 , wherein said curative c) consists of:
from 90 to 100 mol. % of said at least one alkoxy-containing aminofunctional silicone resin(s); and from 0 to 10 mol. % of secondary epoxide reactive compounds.

8 . The two component composition according to claim 1 , wherein said alkoxy-containing aminofunctional silicone resin has:
i) an amine hydrogen equivalent weight of from 100 to 1500 g/eq; or, ii) a weight average molecular weight (Mw), determined by gel permeation chromatography, of from 150 to 10000 g/mol.

9 . The two component composition according to claim 1 , wherein said two component composition has a molar ratio of epoxide reactive groups provided in said curative c) to epoxide groups of from 0.9:1 to 1.1:1.

10 . A method of coating, sealing or bonding at least one substrate comprising steps of:
1) Mixing component A and component B of the two component composition according to claim 1 to form an uncured mixture; 2) Applying the uncured mixture to at least one substrate surface; 3) Reacting the uncured mixture thereby forming a cured reaction product; wherein the uncured mixture is applied in an amount sufficient to produce a continuous cured film of the cured reaction product as a coating, sealant or adhesive.

11 . The method of coating, sealing or bonding of claim 10 further comprising a step of bringing said at least one substrate surface of step 2) comprising the uncured mixture into contact with a surface-to-be-bonded to the at least one substrate surface.

12 . The method of coating, sealing or bonding of claim 10 , wherein reacting the uncured mixture comprises cross-linking.

13 . A cured product obtained from the two component (2K) composition as defined in claim 1 .

14 . The two component composition according to claim 1 , wherein said curative c) comprises at least one alkoxy-containing aminofunctional silicone resin having at least two amine hydrogen atoms per molecule, having an amine hydrogen equivalent weight of from 100 to 1500 g/eq. and having a total alkoxy content (AC) of from 10 to 40 mole percent based on number of moles of silicon.

15 . The two component composition according to claim 14 , wherein the aminofunctional silicone resin has both a methyl substitution and a phenyl substitution.

16 . The two component composition according to claim 1 , wherein:
A) the first component comprises, based on weight of said first component:
from 10 to 60 wt. % of a) said at least one epoxy resin a);
B) the second component comprises:
c) a curative which consists of at least one compound possessing at least two epoxide reactive groups per molecule, said curative comprising at least one alkoxy-containing aminofunctional silicone resin,

wherein said two component composition has a molar ratio of epoxide reactive groups provided in said curative c) to epoxide groups of from 0.90:1 to 1.2:1, and wherein said at least one elastomer modified epoxy resin b) comprises at least one dimer acid-modified epoxy resin.

17 . The two component composition according to claim 15 , wherein said at least one dimer acid-modified epoxy resin is a reaction product of catalyzed addition reaction between an epoxide compound and C36 to C44 aliphatic diacid.

Assignees

• Henkel Ag & Co Kgaa

Inventors

• Patel Mihirkumar
• Kutcherlapati Satyanarayana Raju
• Shah Jayesh P
• Tathe Dipak

Classifications

• C09D163/00

  Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title

• C08L2312/00

  Crosslinking · CPC title

• C08L2205/03

  containing three or more polymers in a blend · CPC title

• C08G77/10

  Equilibration processes · CPC title

• C08G77/26

  nitrogen-containing groups · CPC title